DE112014004713A5 - Halbleiterlaser mit einseitig verbreiterter Ridgestruktur - Google Patents
Halbleiterlaser mit einseitig verbreiterter Ridgestruktur Download PDFInfo
- Publication number
- DE112014004713A5 DE112014004713A5 DE112014004713.9T DE112014004713T DE112014004713A5 DE 112014004713 A5 DE112014004713 A5 DE 112014004713A5 DE 112014004713 T DE112014004713 T DE 112014004713T DE 112014004713 A5 DE112014004713 A5 DE 112014004713A5
- Authority
- DE
- Germany
- Prior art keywords
- ridgestruktur
- unilaterally
- broadened
- semiconductor laser
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1014—Tapered waveguide, e.g. spotsize converter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1017—Waveguide having a void for insertion of materials to change optical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201310220641 DE102013220641A1 (de) | 2013-10-14 | 2013-10-14 | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
DE102013220641.0 | 2013-10-14 | ||
PCT/EP2014/072004 WO2015055644A1 (de) | 2013-10-14 | 2014-10-14 | Halbleiterlaser mit einseitig verbreiterter ridgestruktur |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112014004713A5 true DE112014004713A5 (de) | 2016-07-21 |
Family
ID=51691069
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201310220641 Withdrawn DE102013220641A1 (de) | 2013-10-14 | 2013-10-14 | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
DE112014004713.9T Withdrawn DE112014004713A5 (de) | 2013-10-14 | 2014-10-14 | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201310220641 Withdrawn DE102013220641A1 (de) | 2013-10-14 | 2013-10-14 | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US10181700B2 (de) |
CN (1) | CN105637721B (de) |
DE (2) | DE102013220641A1 (de) |
WO (1) | WO2015055644A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015119146A1 (de) | 2015-11-06 | 2017-05-11 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und Verfahren zum Herstellen eines Halbleiterlasers sowie Wafer |
DE102017117135A1 (de) | 2017-07-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von Laserdioden und Laserdiode |
DE102018010602B4 (de) | 2018-06-13 | 2024-09-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser und herstellungsverfahren für einen halbleiterlaser |
DE102018114133B4 (de) * | 2018-06-13 | 2024-05-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser und Herstellungsverfahren für einen Halbleiterlaser |
DE102018125496A1 (de) | 2018-10-15 | 2020-04-16 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und Herstellungsverfahren für Halbleiterlaser |
US20230253761A1 (en) * | 2020-06-12 | 2023-08-10 | Nichia Corporation | Laser diode element and method for manufacturing same |
DE102021103484A1 (de) | 2021-02-15 | 2022-08-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen einer mehrzahl von halbleiterlasern und halbleiterlaser |
DE102021211000B4 (de) | 2021-09-30 | 2024-10-10 | Trumpf Photonics, Inc. | Halbleiterlaserchip mit mindestens einem überstehenden Stegbereich |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4730327A (en) * | 1985-12-16 | 1988-03-08 | Lytel Incorporated | Dual channel fabry-perot laser |
JP3822976B2 (ja) * | 1998-03-06 | 2006-09-20 | ソニー株式会社 | 半導体装置およびその製造方法 |
JP2000174385A (ja) * | 1998-07-15 | 2000-06-23 | Sony Corp | 半導体レ―ザ |
JP4077348B2 (ja) * | 2003-03-17 | 2008-04-16 | 松下電器産業株式会社 | 半導体レーザ装置およびそれを用いた光ピックアップ装置 |
JP2006093614A (ja) * | 2004-09-27 | 2006-04-06 | Hamamatsu Photonics Kk | 半導体レーザ素子及び半導体レーザ素子アレイ |
JP4948307B2 (ja) * | 2006-07-31 | 2012-06-06 | 三洋電機株式会社 | 半導体レーザ素子およびその製造方法 |
DE102009058345B4 (de) * | 2009-12-15 | 2021-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser |
DE102011100175B4 (de) * | 2011-05-02 | 2021-12-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserlichtquelle mit einer Stegwellenleiterstruktur und einer Modenfilterstruktur |
DE102011054954A1 (de) | 2011-10-31 | 2013-05-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronischer Halbleiterlaser |
-
2013
- 2013-10-14 DE DE201310220641 patent/DE102013220641A1/de not_active Withdrawn
-
2014
- 2014-10-14 CN CN201480056614.XA patent/CN105637721B/zh not_active Expired - Fee Related
- 2014-10-14 WO PCT/EP2014/072004 patent/WO2015055644A1/de active Application Filing
- 2014-10-14 DE DE112014004713.9T patent/DE112014004713A5/de not_active Withdrawn
- 2014-10-14 US US15/029,372 patent/US10181700B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20160268775A1 (en) | 2016-09-15 |
CN105637721B (zh) | 2022-01-14 |
WO2015055644A1 (de) | 2015-04-23 |
DE102013220641A1 (de) | 2015-04-16 |
CN105637721A (zh) | 2016-06-01 |
US10181700B2 (en) | 2019-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
UY4298S (es) | Carcasa | |
DE112014002330A5 (de) | Laserdiodenvorrichtung | |
FR3009435B1 (fr) | Module thermoelectrique | |
DE112014004713A5 (de) | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur | |
DK2956698T3 (da) | Bindestrimler | |
DK3052081T3 (da) | Pastil | |
DK2946640T3 (da) | Langmuir-probe | |
DE112014005652A5 (de) | Optoelektronisches Bauelement | |
DE112014001263A5 (de) | Optoelektronisches Bauelement | |
DE112014001966A5 (de) | Optoelektronisches Bauelement | |
DE102013106534B8 (de) | Chromatographiepipettenspitze | |
UA31799S (uk) | Упаковка | |
DE112014003515A5 (de) | Optoelektronisches Bauelement | |
DE112014001252A5 (de) | Aufbissschiene | |
FR3005529B1 (fr) | Module thermoelectrique | |
FI20135623A (fi) | Kaasunvaihtoventtiilijärjestely | |
DE112014005124A5 (de) | Optoelektronisches Bauelement | |
DK2981168T3 (da) | Laminitiskile | |
FR3005681B1 (fr) | Tariere | |
DE112014002467A5 (de) | Optoelektronisches Bauelement | |
DE112014005422A5 (de) | Friktionsfalschdrallaggregat | |
BR112016000501A2 (pt) | Nalador | |
UA26053S (uk) | Пакет | |
ES1092109Y (es) | Pendiente | |
UA28948S (uk) | Упаковка |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R016 | Response to examination communication | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |