DE112011103143T8 - Sialon-phosphor, verfahren zum herstellen desselben und gehäuse für eine licht emittierende vorrichtung, welches denselben verwendet - Google Patents

Sialon-phosphor, verfahren zum herstellen desselben und gehäuse für eine licht emittierende vorrichtung, welches denselben verwendet Download PDF

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Publication number
DE112011103143T8
DE112011103143T8 DE112011103143T DE112011103143T DE112011103143T8 DE 112011103143 T8 DE112011103143 T8 DE 112011103143T8 DE 112011103143 T DE112011103143 T DE 112011103143T DE 112011103143 T DE112011103143 T DE 112011103143T DE 112011103143 T8 DE112011103143 T8 DE 112011103143T8
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Germany
Prior art keywords
same
sialon
phosphorus
housing
manufacturing
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DE112011103143T
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English (en)
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DE112011103143B4 (de
DE112011103143T5 (de
Inventor
Chul Soo Yoon
Hyong Sik Won
Youn Gon Park
Chang Bun Yoon
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of DE112011103143T8 publication Critical patent/DE112011103143T8/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE112011103143.2T 2010-09-20 2011-09-19 Sialon-leuchtstoff, verfahren zum herstellen desselben und licht-emittierende vorrichtung, welche denselben verwendet Active DE112011103143B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020100092534A KR101215342B1 (ko) 2010-09-20 2010-09-20 사이알론 형광체, 그 제조방법 및 이를 이용한 발광소자 패키지
KR10-2010-0092534 2010-09-20
PCT/KR2011/006908 WO2012039566A2 (ko) 2010-09-20 2011-09-19 사이알론 형광체, 그 제조방법 및 이를 이용한 발광소자 패키지

Publications (3)

Publication Number Publication Date
DE112011103143T5 DE112011103143T5 (de) 2013-07-11
DE112011103143T8 true DE112011103143T8 (de) 2013-09-12
DE112011103143B4 DE112011103143B4 (de) 2024-05-02

Family

ID=45874241

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112011103143.2T Active DE112011103143B4 (de) 2010-09-20 2011-09-19 Sialon-leuchtstoff, verfahren zum herstellen desselben und licht-emittierende vorrichtung, welche denselben verwendet

Country Status (5)

Country Link
US (1) US9391245B2 (de)
KR (1) KR101215342B1 (de)
CN (1) CN103314074B (de)
DE (1) DE112011103143B4 (de)
WO (1) WO2012039566A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101760788B1 (ko) * 2010-09-20 2017-07-24 삼성전자주식회사 적색 형광체, 이의 제조방법 및 이를 포함하는 발광장치
US8890196B2 (en) * 2013-03-14 2014-11-18 Goldeneye, Inc. Lightweight self-cooling light sources
US9219202B2 (en) * 2013-04-19 2015-12-22 Cree, Inc. Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
DE102014107972B9 (de) * 2014-04-17 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einem ersten Leuchtstoff und Filterpartikeln
US9735323B2 (en) * 2015-06-30 2017-08-15 Nichia Corporation Light emitting device having a triple phosphor fluorescent member
JP6770353B2 (ja) * 2016-07-01 2020-10-14 デンカ株式会社 β型サイアロン蛍光体、並びにそれを用いた発光部材及び発光装置
JP6940764B2 (ja) 2017-09-28 2021-09-29 日亜化学工業株式会社 発光装置
CN107760306A (zh) * 2017-10-27 2018-03-06 天水华天科技股份有限公司 一种基于紫外光激发的荧光粉及其制备方法和应用
CN111808608B (zh) * 2019-04-12 2023-12-15 烟台布莱特光电材料有限公司 一种荧光体化合物、及其制备方法和组合物

Family Cites Families (16)

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NL8400660A (nl) 1984-03-01 1985-10-01 Philips Nv Luminescerend scherm.
JP3668770B2 (ja) 2001-06-07 2005-07-06 独立行政法人物質・材料研究機構 希土類元素を付活させた酸窒化物蛍光体
JP3726131B2 (ja) 2002-05-23 2005-12-14 独立行政法人物質・材料研究機構 サイアロン系蛍光体
JP4052136B2 (ja) 2003-02-06 2008-02-27 宇部興産株式会社 サイアロン系酸窒化物蛍光体およびその製造方法
JP3921545B2 (ja) 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
CN101023150B (zh) * 2004-07-28 2012-05-16 同和电子科技有限公司 荧光体及其制造方法以及光源
US7476337B2 (en) 2004-07-28 2009-01-13 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method for the same, and light source
JP4888624B2 (ja) 2004-07-30 2012-02-29 独立行政法人物質・材料研究機構 α型サイアロン粉末の製造方法
JP4674348B2 (ja) * 2004-09-22 2011-04-20 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
KR100984822B1 (ko) * 2005-03-22 2010-10-04 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 형광체와 그 제조 방법
JP5025474B2 (ja) 2005-05-12 2012-09-12 独立行政法人物質・材料研究機構 β型サイアロン蛍光体
JP4494306B2 (ja) 2005-07-27 2010-06-30 電気化学工業株式会社 α型サイアロン粉末の製造方法
KR20080059418A (ko) * 2005-09-30 2008-06-27 더 리전츠 오브 더 유니버시티 오브 캘리포니아 고상 조명용 질화 및 산질화 세륨계 형광물질들
KR101077990B1 (ko) * 2010-02-12 2011-10-31 삼성엘이디 주식회사 형광체, 발광장치, 면광원장치, 디스플레이 장치 및 조명장치
KR101450991B1 (ko) * 2010-05-13 2014-10-15 덴끼 가가꾸 고교 가부시키가이샤 β 형 사이알론의 제조 방법, β 형 사이알론 및 그 이용 제품
KR101214234B1 (ko) * 2011-02-14 2012-12-20 삼성전자주식회사 형광체 및 이의 제조방법

Also Published As

Publication number Publication date
US9391245B2 (en) 2016-07-12
KR101215342B1 (ko) 2012-12-26
CN103314074A (zh) 2013-09-18
WO2012039566A2 (ko) 2012-03-29
CN103314074B (zh) 2015-01-07
DE112011103143B4 (de) 2024-05-02
KR20120030792A (ko) 2012-03-29
DE112011103143T5 (de) 2013-07-11
WO2012039566A3 (ko) 2012-06-21
US20140008680A1 (en) 2014-01-09

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