DE112011101135T8 - Elektrisch Verbundene Felder von aktiven Bauteilen in Überführungsdrucktechnik - Google Patents
Elektrisch Verbundene Felder von aktiven Bauteilen in Überführungsdrucktechnik Download PDFInfo
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- DE112011101135T8 DE112011101135T8 DE112011101135T DE112011101135T DE112011101135T8 DE 112011101135 T8 DE112011101135 T8 DE 112011101135T8 DE 112011101135 T DE112011101135 T DE 112011101135T DE 112011101135 T DE112011101135 T DE 112011101135T DE 112011101135 T8 DE112011101135 T8 DE 112011101135T8
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- 238000005516 engineering process Methods 0.000 title 1
- 238000010023 transfer printing Methods 0.000 title 1
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US31852210P | 2010-03-29 | 2010-03-29 | |
US61/318,522 | 2010-03-29 | ||
PCT/US2011/029365 WO2011126726A1 (en) | 2010-03-29 | 2011-03-22 | Electrically bonded arrays of transfer printed active components |
Publications (3)
Publication Number | Publication Date |
---|---|
DE112011101135T5 DE112011101135T5 (de) | 2013-03-14 |
DE112011101135T8 true DE112011101135T8 (de) | 2013-05-29 |
DE112011101135B4 DE112011101135B4 (de) | 2021-02-11 |
Family
ID=44120924
Family Applications (1)
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DE112011101135.0T Active DE112011101135B4 (de) | 2010-03-29 | 2011-03-22 | Elektrisch verbundene Felder von aktiven Bauteilen in Überführungsdrucktechnik |
Country Status (3)
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US (2) | US9049797B2 (de) |
DE (1) | DE112011101135B4 (de) |
WO (1) | WO2011126726A1 (de) |
Cited By (1)
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US11037812B2 (en) | 2016-05-23 | 2021-06-15 | X-Fab Semiconductor Foundries Gmbh | Method for a transfer print between substrates |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11037812B2 (en) | 2016-05-23 | 2021-06-15 | X-Fab Semiconductor Foundries Gmbh | Method for a transfer print between substrates |
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US20130153277A1 (en) | 2013-06-20 |
WO2011126726A1 (en) | 2011-10-13 |
US20150327388A1 (en) | 2015-11-12 |
US9049797B2 (en) | 2015-06-02 |
DE112011101135B4 (de) | 2021-02-11 |
DE112011101135T5 (de) | 2013-03-14 |
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