DE112004000210D2 - Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung - Google Patents

Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung

Info

Publication number
DE112004000210D2
DE112004000210D2 DE112004000210T DE112004000210T DE112004000210D2 DE 112004000210 D2 DE112004000210 D2 DE 112004000210D2 DE 112004000210 T DE112004000210 T DE 112004000210T DE 112004000210 T DE112004000210 T DE 112004000210T DE 112004000210 D2 DE112004000210 D2 DE 112004000210D2
Authority
DE
Germany
Prior art keywords
phosphor
production
light emitting
emitting device
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE112004000210T
Other languages
English (en)
Other versions
DE112004000210B4 (de
Inventor
Rainer Schirmer
Franz Zwaschka
Martin Zachau
Thorsten Fries
Bert Braune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112004000210D2 publication Critical patent/DE112004000210D2/de
Application granted granted Critical
Publication of DE112004000210B4 publication Critical patent/DE112004000210B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
DE112004000210.9T 2003-02-20 2004-02-20 Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff und Verfahren zu seiner Herstellung Expired - Lifetime DE112004000210B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10307281.0 2003-02-20
DE10307281A DE10307281A1 (de) 2003-02-20 2003-02-20 Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung
PCT/DE2004/000325 WO2004074400A1 (de) 2003-02-20 2004-02-20 Beschichteter leuchtstoff, lichtemittierende vorrichtung mit derartigem leuchtstoff und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
DE112004000210D2 true DE112004000210D2 (de) 2005-10-06
DE112004000210B4 DE112004000210B4 (de) 2023-04-20

Family

ID=32797583

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10307281A Withdrawn DE10307281A1 (de) 2003-02-20 2003-02-20 Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung
DE112004000210.9T Expired - Lifetime DE112004000210B4 (de) 2003-02-20 2004-02-20 Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff und Verfahren zu seiner Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10307281A Withdrawn DE10307281A1 (de) 2003-02-20 2003-02-20 Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
US (1) US7678293B2 (de)
JP (1) JP4557293B2 (de)
DE (2) DE10307281A1 (de)
WO (1) WO2004074400A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005265654A (ja) * 2004-03-19 2005-09-29 Hitachi Maxell Ltd 複合化粒子
US20060192225A1 (en) * 2005-02-28 2006-08-31 Chua Janet B Y Light emitting device having a layer of photonic crystals with embedded photoluminescent material and method for fabricating the device
US7358543B2 (en) * 2005-05-27 2008-04-15 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device
KR20080049754A (ko) * 2005-08-24 2008-06-04 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 고형 이산화탄소체의 형성
CN100414727C (zh) * 2005-11-04 2008-08-27 江苏日月照明电器有限公司 一种白光led荧光粉涂覆厚度控制方法
KR100735320B1 (ko) 2005-12-27 2007-07-04 삼성전기주식회사 형광체막 형성방법 및 이를 이용한 발광다이오드 패키지제조방법
TWI357435B (en) * 2006-05-12 2012-02-01 Lextar Electronics Corp Light emitting diode and wavelength converting mat
CN101070471B (zh) * 2006-05-12 2012-11-07 隆达电子股份有限公司 发光二极管元件及其波长转换材料
JP2008291251A (ja) * 2007-04-26 2008-12-04 Sharp Corp 蛍光体の製造方法、波長変換部材および発光装置
JP5777242B2 (ja) * 2010-06-29 2015-09-09 株式会社日本セラテック 蛍光体材料および発光装置
WO2012001821A1 (ja) * 2010-06-29 2012-01-05 株式会社日本セラテック 蛍光体材料および発光装置
US8409960B2 (en) 2011-04-08 2013-04-02 Micron Technology, Inc. Methods of patterning platinum-containing material
CN102391691A (zh) * 2011-09-01 2012-03-28 江苏双乐化工颜料有限公司 一种蓄光颜料及其包膜处理方法
US20130092964A1 (en) * 2011-10-13 2013-04-18 Intematix Corporation Highly reliable photoluminescent materials having a thick and uniform titanium dioxide coating
DE102011116402A1 (de) * 2011-10-19 2013-04-25 Osram Opto Semiconductors Gmbh Wellenlängenkonvertierendes Partikel, Verfahren zur Herstellung von wellenlängenkonvertierenden Partikeln und optoelektronisches Bauelement mit wellenlängenkonvertierenden Partikeln
US9006966B2 (en) 2011-11-08 2015-04-14 Intematix Corporation Coatings for photoluminescent materials
JP2014136670A (ja) * 2013-01-18 2014-07-28 Shin Etsu Chem Co Ltd 強負帯電付与性疎水性球状シリカ微粒子、その製造方法及びそれを用いた静電荷現像用電荷制御剤
JP5915557B2 (ja) * 2013-01-30 2016-05-11 住友金属鉱山株式会社 被覆蛍光体粒子及びその製造方法、それを用いたｌｅｄ素子
JP2015089898A (ja) * 2013-11-05 2015-05-11 信越化学工業株式会社 無機蛍光体粉末、無機蛍光体粉末を用いた硬化性樹脂組成物、波長変換部材および光半導体装置
US10253257B2 (en) 2015-11-25 2019-04-09 Intematix Corporation Coated narrow band red phosphor
JP2020019921A (ja) * 2018-02-06 2020-02-06 信越化学工業株式会社 蛍光体粒子
JP2020066599A (ja) * 2018-10-25 2020-04-30 ロート製薬株式会社 複合粉体、皮膚外用組成物、及び無機蛍光粉体の蛍光強度増強方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676398A (en) * 1968-11-25 1972-07-11 Ppg Industries Inc Polymerizable crosslinkable esters of polyepoxy compounds
US3770602A (en) * 1968-11-25 1973-11-06 Ppg Industries Inc Radiation crosslinkable polymers prepared by reacting a polyepoxy compound with an acrylic anhydride of a monocarboxylic acid
DE3784985T2 (de) * 1986-08-29 1993-07-01 Gte Prod Corp Phosphorpartikel, phosphormischung und fluoreszente lampe.
US5366834A (en) 1989-11-15 1994-11-22 Nichia Kagaku Kogyo K.K. Method of manufacturing a cathode ray tube phosphor screen
US5087523A (en) * 1990-01-22 1992-02-11 Gte Laboratories Incorporated Phosphors with improved lumen output and lamps made therefrom
JP2765641B2 (ja) * 1991-09-30 1998-06-18 日亜化学工業株式会社 蛍光体組成物および低圧水銀ランプ
JP3444609B2 (ja) * 1992-09-16 2003-09-08 化成オプトニクス株式会社 混合赤色蛍光体及びカラーブラウン管
TW295672B (de) * 1994-09-20 1997-01-11 Hitachi Ltd
JPH08188774A (ja) * 1995-01-11 1996-07-23 Toshiba Lighting & Technol Corp 蛍光体、蛍光体の製造方法、蛍光体ランプおよび照明装置
JPH09104863A (ja) 1995-10-12 1997-04-22 Nec Kansai Ltd 被覆蛍光体および蛍光体の被覆処理方法および被覆蛍光体を用いた電界発光灯
JPH09255951A (ja) * 1996-03-25 1997-09-30 Kasei Optonix Co Ltd 青色発光蛍光体
JPH10195429A (ja) * 1997-01-16 1998-07-28 Toshiba Corp カラーテレビジョン用蛍光体
JPH10212475A (ja) * 1997-01-31 1998-08-11 Toshiba Corp 蛍光体およびその製造方法
US6322901B1 (en) * 1997-11-13 2001-11-27 Massachusetts Institute Of Technology Highly luminescent color-selective nano-crystalline materials
JPH11250861A (ja) * 1998-02-27 1999-09-17 Toshiba Lighting & Technology Corp ラピッドスタート形蛍光ランプおよび照明装置
JPH11256149A (ja) * 1998-03-16 1999-09-21 Matsushita Electric Ind Co Ltd 赤色蛍光体とこれを用いた蛍光ランプ
DE19834377A1 (de) 1998-07-30 2000-02-03 Philips Corp Intellectual Pty Leuchtstoffzubereitung mit amidgruppen- oder urethangruppenhaltigem organischem Bindemittel
WO2001027961A2 (en) * 1998-08-31 2001-04-19 The Government Of The United States Of America, Represented By The Secretary Of The Navy Coated cathodoluminescent phosphors
GB9911781D0 (en) 1999-05-20 1999-07-21 Isis Innovations Ltd Process for preparing phosphor particles
JP3988309B2 (ja) 1999-01-14 2007-10-10 ソニー株式会社 蛍光体及びその製造方法
US6251308B1 (en) * 1999-03-19 2001-06-26 Premix Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
JP2000285860A (ja) * 1999-03-30 2000-10-13 Toshiba Corp 蛍光ランプ
US6811813B1 (en) * 1999-05-19 2004-11-02 Sarnoff Corporation Method of coating micrometer sized inorganic particles
US6565771B1 (en) * 1999-10-06 2003-05-20 Sumitomo Chemical Company, Limited Process for producing aluminate-based phosphor
DE19956779A1 (de) * 1999-11-25 2001-05-31 Bakelite Ag Vinylester mit hoher Vernetzungsdichte Verfahren zu ihrer Herstellung und Verwendung
KR100791564B1 (ko) * 1999-12-21 2008-01-03 삼성에스디아이 주식회사 희토류 산화물이 코팅된 형광체 및 그의 제조방법
US6531074B2 (en) * 2000-01-14 2003-03-11 Osram Sylvania Inc. Luminescent nanophase binder systems for UV and VUV applications
JP2002080843A (ja) * 2000-06-30 2002-03-22 Nichia Chem Ind Ltd 真空紫外線励起発光蛍光体
DE10051242A1 (de) 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff
DE10307282A1 (de) * 2003-02-20 2004-09-02 Osram Opto Semiconductors Gmbh Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
US20060078734A1 (en) 2006-04-13
DE112004000210B4 (de) 2023-04-20
DE10307281A1 (de) 2004-09-02
WO2004074400A1 (de) 2004-09-02
JP4557293B2 (ja) 2010-10-06
JP2006518398A (ja) 2006-08-10
US7678293B2 (en) 2010-03-16

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, , DE

Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBU, DE

8110 Request for examination paragraph 44
R081 Change of applicant/patentee

Owner name: OSRAM GMBH, DE

Free format text: FORMER OWNER: OSRAM GESELLSCHAFT MIT BESCHRAEN, OSRAM OPTO SEMICONDUCTORS GMBH, , DE

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