DE10329028A1 - Isolierung für piezokeramische Vielschichtaktoren - Google Patents

Isolierung für piezokeramische Vielschichtaktoren Download PDF

Info

Publication number
DE10329028A1
DE10329028A1 DE2003129028 DE10329028A DE10329028A1 DE 10329028 A1 DE10329028 A1 DE 10329028A1 DE 2003129028 DE2003129028 DE 2003129028 DE 10329028 A DE10329028 A DE 10329028A DE 10329028 A1 DE10329028 A1 DE 10329028A1
Authority
DE
Germany
Prior art keywords
actuator
layer
thick
sintering
organic binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2003129028
Other languages
German (de)
English (en)
Inventor
Hans-Jürgen Dr. Schreiner
Jürgen Schmieder
Reiner Dipl.-Ing. Bindig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Priority to DE2003129028 priority Critical patent/DE10329028A1/de
Publication of DE10329028A1 publication Critical patent/DE10329028A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Compositions Of Oxide Ceramics (AREA)
DE2003129028 2002-07-11 2003-06-27 Isolierung für piezokeramische Vielschichtaktoren Withdrawn DE10329028A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2003129028 DE10329028A1 (de) 2002-07-11 2003-06-27 Isolierung für piezokeramische Vielschichtaktoren

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10231536 2002-07-11
DE10231536.1 2002-07-11
DE2003129028 DE10329028A1 (de) 2002-07-11 2003-06-27 Isolierung für piezokeramische Vielschichtaktoren

Publications (1)

Publication Number Publication Date
DE10329028A1 true DE10329028A1 (de) 2004-01-29

Family

ID=29723865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003129028 Withdrawn DE10329028A1 (de) 2002-07-11 2003-06-27 Isolierung für piezokeramische Vielschichtaktoren

Country Status (4)

Country Link
US (1) US7065846B2 (enExample)
EP (1) EP1381094A3 (enExample)
JP (1) JP2004048015A (enExample)
DE (1) DE10329028A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012207276B4 (de) 2011-08-01 2018-04-05 Continental Automotive Gmbh Vollaktiver Piezostack mit Passivierung

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US7987728B2 (en) * 2006-07-07 2011-08-02 The University Of Houston System Piezoceramic-based smart aggregate for unified performance monitoring of concrete structures
JP5185224B2 (ja) * 2008-09-24 2013-04-17 日本碍子株式会社 結晶配向セラミックスの製造方法
JP5414798B2 (ja) 2009-08-27 2014-02-12 京セラ株式会社 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム
DE102010047302B3 (de) 2010-10-01 2012-03-29 Epcos Ag Piezoelektrisches Vielschichtbauelement und Verfahren zu dessen Herstellung
WO2012099233A1 (ja) * 2011-01-21 2012-07-26 京セラ株式会社 積層型圧電素子およびこれを備えた圧電アクチュエータ、噴射装置ならびに燃料噴射システム
JP5743608B2 (ja) * 2011-02-28 2015-07-01 京セラ株式会社 積層型圧電素子およびこれを備えた圧電アクチュエータ、噴射装置、燃料噴射システム
DE102012104830A1 (de) * 2012-06-04 2013-12-05 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
DE102019206018B4 (de) 2019-04-26 2022-08-25 Pi Ceramic Gmbh Elektromechanischer Aktor mit keramischer Isolierung, Verfahren zu dessen Herstellung sowie Verfahren zur Ansteuerung eines solchen Aktors
US11545615B2 (en) * 2020-09-09 2023-01-03 Baker Hughes Oilfield Operations Llc Method for manufacturing piezoelectric instrumentation devices with 3D structures using additive manufacturing

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012207276B4 (de) 2011-08-01 2018-04-05 Continental Automotive Gmbh Vollaktiver Piezostack mit Passivierung

Also Published As

Publication number Publication date
US20040134049A1 (en) 2004-07-15
EP1381094A3 (de) 2006-02-08
US7065846B2 (en) 2006-06-27
JP2004048015A (ja) 2004-02-12
EP1381094A2 (de) 2004-01-14

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