DE10253717B4 - Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten - Google Patents

Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten Download PDF

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Publication number
DE10253717B4
DE10253717B4 DE10253717A DE10253717A DE10253717B4 DE 10253717 B4 DE10253717 B4 DE 10253717B4 DE 10253717 A DE10253717 A DE 10253717A DE 10253717 A DE10253717 A DE 10253717A DE 10253717 B4 DE10253717 B4 DE 10253717B4
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DE
Germany
Prior art keywords
test
substrate
contacting
unit
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10253717A
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German (de)
English (en)
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DE10253717A1 (de
Inventor
Matthias Brunner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials GmbH and Co KG
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Applied Materials GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10253717A priority Critical patent/DE10253717B4/de
Application filed by Applied Materials GmbH and Co KG filed Critical Applied Materials GmbH and Co KG
Priority to AU2003292020A priority patent/AU2003292020A1/en
Priority to KR1020057008488A priority patent/KR100817597B1/ko
Priority to JP2004552594A priority patent/JP2006506629A/ja
Priority to TW092131977A priority patent/TWI267644B/zh
Priority to CNB2003801035614A priority patent/CN100526897C/zh
Priority to EP03026267A priority patent/EP1420259A1/en
Priority to CN200910150538XA priority patent/CN101625823B/zh
Priority to PCT/EP2003/012739 priority patent/WO2004046740A1/de
Priority to US10/716,102 priority patent/US7135875B2/en
Publication of DE10253717A1 publication Critical patent/DE10253717A1/de
Priority to US11/398,052 priority patent/US7474108B2/en
Application granted granted Critical
Publication of DE10253717B4 publication Critical patent/DE10253717B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
DE10253717A 2002-11-18 2002-11-18 Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten Expired - Fee Related DE10253717B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE10253717A DE10253717B4 (de) 2002-11-18 2002-11-18 Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten
PCT/EP2003/012739 WO2004046740A1 (de) 2002-11-18 2003-11-14 Vorrichtung und methode zur kontaktierung von testobjekten
JP2004552594A JP2006506629A (ja) 2002-11-18 2003-11-14 検査体の接触のための装置及び方法
TW092131977A TWI267644B (en) 2002-11-18 2003-11-14 Apparatus and method for contacting of test objects
CNB2003801035614A CN100526897C (zh) 2002-11-18 2003-11-14 用于接触检验对象的装置及方法
EP03026267A EP1420259A1 (en) 2002-11-18 2003-11-14 Apparatus and method for contacting of test objects
AU2003292020A AU2003292020A1 (en) 2002-11-18 2003-11-14 Device and methods for contacting objects to be tested
KR1020057008488A KR100817597B1 (ko) 2002-11-18 2003-11-14 시험할 대상물들을 접촉시키기 위한 장치 및 방법
CN200910150538XA CN101625823B (zh) 2002-11-18 2003-11-14 用于接触检验对象的装置及方法
US10/716,102 US7135875B2 (en) 2002-11-18 2003-11-18 Apparatus and method for contacting of test objects
US11/398,052 US7474108B2 (en) 2002-11-18 2006-04-05 Apparatus and method for contacting of test objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10253717A DE10253717B4 (de) 2002-11-18 2002-11-18 Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten

Publications (2)

Publication Number Publication Date
DE10253717A1 DE10253717A1 (de) 2004-05-27
DE10253717B4 true DE10253717B4 (de) 2011-05-19

Family

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Family Applications (1)

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DE10253717A Expired - Fee Related DE10253717B4 (de) 2002-11-18 2002-11-18 Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten

Country Status (9)

Country Link
US (2) US7135875B2 (enExample)
EP (1) EP1420259A1 (enExample)
JP (1) JP2006506629A (enExample)
KR (1) KR100817597B1 (enExample)
CN (2) CN101625823B (enExample)
AU (1) AU2003292020A1 (enExample)
DE (1) DE10253717B4 (enExample)
TW (1) TWI267644B (enExample)
WO (1) WO2004046740A1 (enExample)

Families Citing this family (23)

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Publication number Priority date Publication date Assignee Title
DE10253717B4 (de) 2002-11-18 2011-05-19 Applied Materials Gmbh Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten
US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US6833717B1 (en) * 2004-02-12 2004-12-21 Applied Materials, Inc. Electron beam test system with integrated substrate transfer module
US8083853B2 (en) 2004-05-12 2011-12-27 Applied Materials, Inc. Plasma uniformity control by gas diffuser hole design
US8074599B2 (en) 2004-05-12 2011-12-13 Applied Materials, Inc. Plasma uniformity control by gas diffuser curvature
US8328939B2 (en) * 2004-05-12 2012-12-11 Applied Materials, Inc. Diffuser plate with slit valve compensation
US7429410B2 (en) * 2004-09-20 2008-09-30 Applied Materials, Inc. Diffuser gravity support
KR100780759B1 (ko) * 2005-01-24 2007-11-30 삼성전자주식회사 박막 트랜지스터 어레이 검사장치
US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
KR100643389B1 (ko) * 2005-07-04 2006-11-10 삼성전자주식회사 박막트랜지스터 기판의 검사장치와 박막트랜지스터 기판의검사방법
CN101400991B (zh) * 2006-03-14 2013-03-20 应用材料公司 减小多个柱状电子束测试系统中的串扰的方法
US7602199B2 (en) * 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing
KR101023890B1 (ko) * 2006-05-31 2011-03-22 어플라이드 머티어리얼스, 인코포레이티드 Ｔｆｔ-ｌｃｄ 테스팅을 위한 소형 프로버
US7786742B2 (en) * 2006-05-31 2010-08-31 Applied Materials, Inc. Prober for electronic device testing on large area substrates
US20080317973A1 (en) * 2007-06-22 2008-12-25 White John M Diffuser support
WO2009004894A1 (ja) * 2007-07-04 2009-01-08 Sharp Kabushiki Kaisha 表示モジュール、液晶表示装置、及び表示モジュールの製造方法
TWI426286B (zh) * 2010-08-02 2014-02-11 財團法人工業技術研究院 基板電性的量測設備
JP6300553B2 (ja) * 2014-02-12 2018-03-28 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
TWI676033B (zh) * 2018-11-09 2019-11-01 京元電子股份有限公司 具浮動容置座之半導體元件測試載盤及其測試設備
CN111190087B (zh) * 2018-11-15 2022-03-15 京元电子股份有限公司 具浮动容置座的半导体元件测试载盘及其测试设备
CN109765479B (zh) * 2019-01-28 2021-10-01 合肥京东方视讯科技有限公司 一种电路板缺件检测装置和方法
US20250180618A1 (en) * 2023-10-05 2025-06-05 Dutch Terahertz Inspection Services B.V. Thermal vacuum chamber for cryogenic near field beam pattern measurement at terahertz frequencies

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EP0402499A1 (de) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
EP0523594A1 (de) * 1991-07-15 1993-01-20 ICT Integrated Circuit Testing Gesellschaft für HalbleiterprÀ¼ftechnik mbH Verfahren zur Korpuskularstrahl-Prüfung von Substraten für Flüssigkeitskristallanzeigen (LCD)
US5691764A (en) * 1994-08-05 1997-11-25 Tokyo Electron Limited Apparatus for examining target objects such as LCD panels
US5982190A (en) * 1998-02-04 1999-11-09 Toro-Lira; Guillermo L. Method to determine pixel condition on flat panel displays using an electron beam

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Publication number Priority date Publication date Assignee Title
US4532423A (en) * 1982-05-31 1985-07-30 Tokyo Shibaura Denki Kabushiki Kaisha IC Tester using an electron beam capable of easily setting a probe card unit for wafers & packaged IC's to be tested
DE3636316A1 (de) * 1985-10-25 1987-04-30 Hitachi Ltd Vorrichtung zum abtasten von oberflaechen unter verwendung eines geladenen partikelstrahls
EP0402499A1 (de) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
EP0523594A1 (de) * 1991-07-15 1993-01-20 ICT Integrated Circuit Testing Gesellschaft für HalbleiterprÀ¼ftechnik mbH Verfahren zur Korpuskularstrahl-Prüfung von Substraten für Flüssigkeitskristallanzeigen (LCD)
US5691764A (en) * 1994-08-05 1997-11-25 Tokyo Electron Limited Apparatus for examining target objects such as LCD panels
US5982190A (en) * 1998-02-04 1999-11-09 Toro-Lira; Guillermo L. Method to determine pixel condition on flat panel displays using an electron beam

Also Published As

Publication number Publication date
KR100817597B1 (ko) 2008-03-31
CN100526897C (zh) 2009-08-12
AU2003292020A1 (en) 2004-06-15
US20060181290A1 (en) 2006-08-17
JP2006506629A (ja) 2006-02-23
WO2004046740A1 (de) 2004-06-03
KR20050075395A (ko) 2005-07-20
CN101625823B (zh) 2013-04-17
DE10253717A1 (de) 2004-05-27
US7474108B2 (en) 2009-01-06
CN1714298A (zh) 2005-12-28
TWI267644B (en) 2006-12-01
EP1420259A1 (en) 2004-05-19
US7135875B2 (en) 2006-11-14
TW200417737A (en) 2004-09-16
CN101625823A (zh) 2010-01-13
US20040145383A1 (en) 2004-07-29

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