KR100817597B1 - 시험할 대상물들을 접촉시키기 위한 장치 및 방법 - Google Patents
시험할 대상물들을 접촉시키기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR100817597B1 KR100817597B1 KR1020057008488A KR20057008488A KR100817597B1 KR 100817597 B1 KR100817597 B1 KR 100817597B1 KR 1020057008488 A KR1020057008488 A KR 1020057008488A KR 20057008488 A KR20057008488 A KR 20057008488A KR 100817597 B1 KR100817597 B1 KR 100817597B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- test
- substrate
- unit
- contact unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000012360 testing method Methods 0.000 claims abstract description 322
- 239000000758 substrate Substances 0.000 claims abstract description 193
- 230000003287 optical effect Effects 0.000 claims abstract description 81
- 238000010998 test method Methods 0.000 claims description 33
- 238000005259 measurement Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 abstract description 3
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 50
- 238000010894 electron beam technology Methods 0.000 description 37
- 239000002245 particle Substances 0.000 description 10
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005577 local transmission Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10253717.8 | 2002-11-18 | ||
| DE10253717A DE10253717B4 (de) | 2002-11-18 | 2002-11-18 | Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050075395A KR20050075395A (ko) | 2005-07-20 |
| KR100817597B1 true KR100817597B1 (ko) | 2008-03-31 |
Family
ID=32115567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057008488A Expired - Lifetime KR100817597B1 (ko) | 2002-11-18 | 2003-11-14 | 시험할 대상물들을 접촉시키기 위한 장치 및 방법 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7135875B2 (enExample) |
| EP (1) | EP1420259A1 (enExample) |
| JP (1) | JP2006506629A (enExample) |
| KR (1) | KR100817597B1 (enExample) |
| CN (2) | CN101625823B (enExample) |
| AU (1) | AU2003292020A1 (enExample) |
| DE (1) | DE10253717B4 (enExample) |
| TW (1) | TWI267644B (enExample) |
| WO (1) | WO2004046740A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10253717B4 (de) | 2002-11-18 | 2011-05-19 | Applied Materials Gmbh | Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten |
| US7319335B2 (en) * | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
| US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
| US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
| US8083853B2 (en) * | 2004-05-12 | 2011-12-27 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser hole design |
| US8328939B2 (en) * | 2004-05-12 | 2012-12-11 | Applied Materials, Inc. | Diffuser plate with slit valve compensation |
| US8074599B2 (en) | 2004-05-12 | 2011-12-13 | Applied Materials, Inc. | Plasma uniformity control by gas diffuser curvature |
| US7429410B2 (en) * | 2004-09-20 | 2008-09-30 | Applied Materials, Inc. | Diffuser gravity support |
| KR100780759B1 (ko) * | 2005-01-24 | 2007-11-30 | 삼성전자주식회사 | 박막 트랜지스터 어레이 검사장치 |
| US7535238B2 (en) * | 2005-04-29 | 2009-05-19 | Applied Materials, Inc. | In-line electron beam test system |
| KR100643389B1 (ko) * | 2005-07-04 | 2006-11-10 | 삼성전자주식회사 | 박막트랜지스터 기판의 검사장치와 박막트랜지스터 기판의검사방법 |
| TWI323788B (en) * | 2006-03-14 | 2010-04-21 | Applied Materials Inc | Method to reduce cross talk in a multi column e-beam test system |
| US7602199B2 (en) * | 2006-05-31 | 2009-10-13 | Applied Materials, Inc. | Mini-prober for TFT-LCD testing |
| JP2009539112A (ja) * | 2006-05-31 | 2009-11-12 | アプライド マテリアルズ インコーポレイテッド | Tft−lcd検査のための小型プローバ |
| US7786742B2 (en) * | 2006-05-31 | 2010-08-31 | Applied Materials, Inc. | Prober for electronic device testing on large area substrates |
| US20080317973A1 (en) * | 2007-06-22 | 2008-12-25 | White John M | Diffuser support |
| WO2009004894A1 (ja) * | 2007-07-04 | 2009-01-08 | Sharp Kabushiki Kaisha | 表示モジュール、液晶表示装置、及び表示モジュールの製造方法 |
| TWI426286B (zh) * | 2010-08-02 | 2014-02-11 | 財團法人工業技術研究院 | 基板電性的量測設備 |
| JP6300553B2 (ja) * | 2014-02-12 | 2018-03-28 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
| TWI676033B (zh) * | 2018-11-09 | 2019-11-01 | 京元電子股份有限公司 | 具浮動容置座之半導體元件測試載盤及其測試設備 |
| CN111190087B (zh) * | 2018-11-15 | 2022-03-15 | 京元电子股份有限公司 | 具浮动容置座的半导体元件测试载盘及其测试设备 |
| CN109765479B (zh) * | 2019-01-28 | 2021-10-01 | 合肥京东方视讯科技有限公司 | 一种电路板缺件检测装置和方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5365034A (en) | 1992-09-29 | 1994-11-15 | Matsushita Electric Industrial Co., Ltd. | Defect detection and defect removal apparatus of thin film electronic device |
| US5521522A (en) | 1992-11-13 | 1996-05-28 | Tokyo Electron Limited | Probe apparatus for testing multiple integrated circuit dies |
| US5691764A (en) * | 1994-08-05 | 1997-11-25 | Tokyo Electron Limited | Apparatus for examining target objects such as LCD panels |
| US6075245A (en) * | 1998-01-12 | 2000-06-13 | Toro-Lira; Guillermo L. | High speed electron beam based system for testing large area flat panel displays |
| JP2001318116A (ja) | 2000-05-11 | 2001-11-16 | Micronics Japan Co Ltd | 表示用パネル基板の検査装置 |
| EP1233274A2 (en) * | 2001-02-08 | 2002-08-21 | Three-Five Systems, Inc. | System and method for testing a display device |
| US6798231B2 (en) | 2001-03-05 | 2004-09-28 | Ishiwawajima-Harima Heavy Industries Co., Ltd. & Sharp Kabushiki Kaisha | Inspection device for liquid crystal driving substrate |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4471298A (en) | 1981-12-11 | 1984-09-11 | Cirdyne, Inc. | Apparatus for automatically electrically testing printed circuit boards |
| JPS58210631A (ja) * | 1982-05-31 | 1983-12-07 | Toshiba Corp | 電子ビ−ムを用いたicテスタ |
| JPS5976439A (ja) * | 1982-10-22 | 1984-05-01 | Fujitsu Ltd | 半導体装置の診断方法 |
| JPS622552A (ja) * | 1985-06-27 | 1987-01-08 | Matsushita Electric Ind Co Ltd | 半導体検査装置および半導体検査方法 |
| JPS6298544A (ja) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | 荷電粒子線装置 |
| US4965515A (en) * | 1986-10-15 | 1990-10-23 | Tokyo Electron Limited | Apparatus and method of testing a semiconductor wafer |
| US4772846A (en) * | 1986-12-29 | 1988-09-20 | Hughes Aircraft Company | Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy |
| JPH0817196B2 (ja) * | 1988-03-22 | 1996-02-21 | 東京エレクトロン株式会社 | 電子ビームプローブ装置 |
| US6288561B1 (en) * | 1988-05-16 | 2001-09-11 | Elm Technology Corporation | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| JP2694345B2 (ja) | 1988-07-14 | 1997-12-24 | 東京エレクトロン株式会社 | 検査装置 |
| JP2678178B2 (ja) * | 1988-11-18 | 1997-11-17 | 東京エレクトロン株式会社 | プロービング方法及びプローブ装置 |
| US4985676A (en) * | 1989-02-17 | 1991-01-15 | Tokyo Electron Limited | Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns |
| US4965676A (en) * | 1989-02-28 | 1990-10-23 | Ricoh Corporation And Ricoh Company, Ltd. | Facsimile remote diagnostic system |
| EP0402499A1 (de) * | 1989-06-13 | 1990-12-19 | Siemens Aktiengesellschaft | Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde |
| US5268638A (en) * | 1991-07-15 | 1993-12-07 | Siemens Aktiengesellschaft | Method for particle beam testing of substrates for liquid crystal displays "LCD" |
| JP2765427B2 (ja) * | 1993-04-13 | 1998-06-18 | 日本電気株式会社 | 半導体集積回路内部相互配線の検査方法および装置 |
| DE69326003T2 (de) * | 1993-09-20 | 1999-11-25 | Hewlett-Packard Gmbh | Testapparat zum Testen und Handhaben einer Vielzahl von Vorrichtungen |
| US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
| US5528158A (en) * | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
| WO1996029607A1 (en) * | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Method and apparatus for inspecting substrate |
| JPH08115954A (ja) * | 1994-10-14 | 1996-05-07 | Tokyo Electron Ltd | 検査装置 |
| US5621333A (en) * | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
| TW301099B (enExample) * | 1995-07-14 | 1997-03-21 | Tokyo Electron Co Ltd | |
| US6046599A (en) * | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
| US5923180A (en) * | 1997-02-04 | 1999-07-13 | Hewlett-Packard Company | Compliant wafer prober docking adapter |
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| JP3423979B2 (ja) * | 1997-07-11 | 2003-07-07 | 東京エレクトロン株式会社 | プローブ方法及びプローブ装置 |
| US5962190A (en) * | 1997-08-27 | 1999-10-05 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions having improved sidewall geometry and development latitude |
| US5982190A (en) * | 1998-02-04 | 1999-11-09 | Toro-Lira; Guillermo L. | Method to determine pixel condition on flat panel displays using an electron beam |
| US6246245B1 (en) | 1998-02-23 | 2001-06-12 | Micron Technology, Inc. | Probe card, test method and test system for semiconductor wafers |
| JP3538696B2 (ja) * | 1998-08-20 | 2004-06-14 | ジェネシス・テクノロジー株式会社 | プローブ装置の組立方法 |
| US6198299B1 (en) * | 1998-08-27 | 2001-03-06 | The Micromanipulator Company, Inc. | High Resolution analytical probe station |
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| JP4015352B2 (ja) * | 2000-02-22 | 2007-11-28 | 株式会社日立製作所 | 荷電粒子ビームを用いた検査方法 |
| DE10253717B4 (de) | 2002-11-18 | 2011-05-19 | Applied Materials Gmbh | Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten |
-
2002
- 2002-11-18 DE DE10253717A patent/DE10253717B4/de not_active Expired - Fee Related
-
2003
- 2003-11-14 WO PCT/EP2003/012739 patent/WO2004046740A1/de not_active Ceased
- 2003-11-14 AU AU2003292020A patent/AU2003292020A1/en not_active Abandoned
- 2003-11-14 KR KR1020057008488A patent/KR100817597B1/ko not_active Expired - Lifetime
- 2003-11-14 CN CN200910150538XA patent/CN101625823B/zh not_active Expired - Lifetime
- 2003-11-14 EP EP03026267A patent/EP1420259A1/en not_active Withdrawn
- 2003-11-14 JP JP2004552594A patent/JP2006506629A/ja active Pending
- 2003-11-14 TW TW092131977A patent/TWI267644B/zh not_active IP Right Cessation
- 2003-11-14 CN CNB2003801035614A patent/CN100526897C/zh not_active Expired - Lifetime
- 2003-11-18 US US10/716,102 patent/US7135875B2/en not_active Expired - Lifetime
-
2006
- 2006-04-05 US US11/398,052 patent/US7474108B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5365034A (en) | 1992-09-29 | 1994-11-15 | Matsushita Electric Industrial Co., Ltd. | Defect detection and defect removal apparatus of thin film electronic device |
| US5521522A (en) | 1992-11-13 | 1996-05-28 | Tokyo Electron Limited | Probe apparatus for testing multiple integrated circuit dies |
| US5691764A (en) * | 1994-08-05 | 1997-11-25 | Tokyo Electron Limited | Apparatus for examining target objects such as LCD panels |
| US6075245A (en) * | 1998-01-12 | 2000-06-13 | Toro-Lira; Guillermo L. | High speed electron beam based system for testing large area flat panel displays |
| JP2001318116A (ja) | 2000-05-11 | 2001-11-16 | Micronics Japan Co Ltd | 表示用パネル基板の検査装置 |
| EP1233274A2 (en) * | 2001-02-08 | 2002-08-21 | Three-Five Systems, Inc. | System and method for testing a display device |
| US6798231B2 (en) | 2001-03-05 | 2004-09-28 | Ishiwawajima-Harima Heavy Industries Co., Ltd. & Sharp Kabushiki Kaisha | Inspection device for liquid crystal driving substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1714298A (zh) | 2005-12-28 |
| US7474108B2 (en) | 2009-01-06 |
| EP1420259A1 (en) | 2004-05-19 |
| DE10253717B4 (de) | 2011-05-19 |
| WO2004046740A1 (de) | 2004-06-03 |
| US7135875B2 (en) | 2006-11-14 |
| JP2006506629A (ja) | 2006-02-23 |
| US20040145383A1 (en) | 2004-07-29 |
| CN101625823B (zh) | 2013-04-17 |
| CN101625823A (zh) | 2010-01-13 |
| CN100526897C (zh) | 2009-08-12 |
| KR20050075395A (ko) | 2005-07-20 |
| US20060181290A1 (en) | 2006-08-17 |
| AU2003292020A1 (en) | 2004-06-15 |
| TWI267644B (en) | 2006-12-01 |
| DE10253717A1 (de) | 2004-05-27 |
| TW200417737A (en) | 2004-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20050512 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20060623 Comment text: Request for Examination of Application |
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| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20070627 Patent event code: PE09021S01D |
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Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20071221 |
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| GRNT | Written decision to grant | ||
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Comment text: Registration of Establishment Patent event date: 20080321 Patent event code: PR07011E01D |
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