DE10207957A1 - Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern - Google Patents

Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern

Info

Publication number
DE10207957A1
DE10207957A1 DE10207957A DE10207957A DE10207957A1 DE 10207957 A1 DE10207957 A1 DE 10207957A1 DE 10207957 A DE10207957 A DE 10207957A DE 10207957 A DE10207957 A DE 10207957A DE 10207957 A1 DE10207957 A1 DE 10207957A1
Authority
DE
Germany
Prior art keywords
contact hole
layer
metal layer
metal
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10207957A
Other languages
German (de)
English (en)
Inventor
Robert J Blakely
John S Atkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE10207957A1 publication Critical patent/DE10207957A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE10207957A 2001-03-06 2002-02-25 Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern Withdrawn DE10207957A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/800,282 US6618266B2 (en) 2001-03-06 2001-03-06 Method for high-density, low-via-count, decoupling capacitor placement

Publications (1)

Publication Number Publication Date
DE10207957A1 true DE10207957A1 (de) 2002-10-02

Family

ID=25177973

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10207957A Withdrawn DE10207957A1 (de) 2001-03-06 2002-02-25 Verfahren für hochdichtes Entkoppeln einer Kondensatorplazierung mit geringer Anzahl von Kontaktlöchern

Country Status (3)

Country Link
US (1) US6618266B2 (https=)
JP (1) JP3836384B2 (https=)
DE (1) DE10207957A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2891164A4 (en) * 2012-08-30 2016-07-20 Allison Transm Inc METHOD AND SYSTEM FOR REDUCING SOUND AND / OR ELECTRIC NOISE FROM ELECTRICALLY OR MECHANICALLY EXCITED CAPACITORS

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Publication number Priority date Publication date Assignee Title
US6900991B2 (en) * 2001-12-03 2005-05-31 Intel Corporation Electronic assembly with sandwiched capacitors and methods of manufacture
US6844505B1 (en) * 2002-11-04 2005-01-18 Ncr Corporation Reducing noise effects in circuit boards
JP2005050962A (ja) * 2003-07-31 2005-02-24 Taiyo Yuden Co Ltd コンデンサ実装構造，コンデンサ実装基板及びコンデンサ実装用配線基板
US7310243B2 (en) * 2004-06-10 2007-12-18 International Business Machines Corporation Method and components for implementing EMC shielded resonance damping
US7227260B2 (en) 2004-10-26 2007-06-05 Kabushiki Kaisha Toshiba Method and system for a pad structure for use with a semiconductor package
US7417869B1 (en) * 2005-01-13 2008-08-26 Apple Inc. Methods and systems for filtering signals
US20070097584A1 (en) * 2005-03-03 2007-05-03 David Ducharme High current surge panel with diagnostics
US7793043B2 (en) * 2006-08-24 2010-09-07 Hewlett-Packard Development Company, L.P. Buffered memory architecture
US7746660B1 (en) * 2006-10-10 2010-06-29 Xilinx, Inc. Reduced mounting inductance and increased self-resonant frequency range
CN101166401B (zh) * 2006-10-16 2011-11-30 辉达公司 用于在高速系统中放置多个负载的方法和系统
US7545623B2 (en) * 2006-11-27 2009-06-09 Kemet Electronics Corporation Interposer decoupling array having reduced electrical shorts
JP5133813B2 (ja) * 2008-08-11 2013-01-30 レノボ・シンガポール・プライベート・リミテッド 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板
TWI378598B (en) * 2008-12-17 2012-12-01 Htc Corp Handheld electronic device
US9831035B2 (en) * 2014-10-31 2017-11-28 Deere & Company Capacitor with improved heat dissipation
CN105007684B (zh) * 2015-06-30 2018-02-23 广东欧珀移动通信有限公司 基于大容量叠层电容的pcb板布局的方法和pcb板结构
JP6784505B2 (ja) * 2016-04-14 2020-11-11 太陽誘電株式会社 コンデンサ実装構造
CN105955437A (zh) * 2016-04-21 2016-09-21 浪潮电子信息产业股份有限公司 一种电源过孔的位置摆放方法及一种pcb
US10394996B2 (en) 2017-08-02 2019-08-27 International Business Machines Corporation Via array placement on a printed circuit board outline
JP6943710B2 (ja) * 2017-09-27 2021-10-06 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
EP4447224A1 (en) * 2023-04-11 2024-10-16 Nxp B.V. Antenna package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235775A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 多層プリント配線基板
US5898576A (en) * 1996-11-12 1999-04-27 Bay Networks Inc. Printed circuit board including a terminated power plane and method of manufacturing the same
US6084779A (en) * 1998-10-02 2000-07-04 Sigrity, Inc. Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips
US6215649B1 (en) * 1998-11-05 2001-04-10 International Business Machines Corporation Printed circuit board capacitor structure and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2891164A4 (en) * 2012-08-30 2016-07-20 Allison Transm Inc METHOD AND SYSTEM FOR REDUCING SOUND AND / OR ELECTRIC NOISE FROM ELECTRICALLY OR MECHANICALLY EXCITED CAPACITORS
EP3528268A1 (en) * 2012-08-30 2019-08-21 Allison Transmission, Inc. Transmission system
US10832870B2 (en) 2012-08-30 2020-11-10 Allison Transmission, Inc. Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Also Published As

Publication number Publication date
US20020172023A1 (en) 2002-11-21
JP2002359450A (ja) 2002-12-13
JP3836384B2 (ja) 2006-10-25
US6618266B2 (en) 2003-09-09

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H05K 111

8139 Disposal/non-payment of the annual fee