DE102019117199A1 - Fan-out-packages und verfahren zu deren herstellung - Google Patents
Fan-out-packages und verfahren zu deren herstellung Download PDFInfo
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- DE102019117199A1 DE102019117199A1 DE102019117199.7A DE102019117199A DE102019117199A1 DE 102019117199 A1 DE102019117199 A1 DE 102019117199A1 DE 102019117199 A DE102019117199 A DE 102019117199A DE 102019117199 A1 DE102019117199 A1 DE 102019117199A1
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- interposer
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- Condensed Matter Physics & Semiconductors (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
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US11552029B2 (en) | 2020-09-04 | 2023-01-10 | Micron Technology, Inc. | Semiconductor devices with reinforced substrates |
TWI789682B (zh) * | 2021-01-15 | 2023-01-11 | 友達光電股份有限公司 | 封裝結構及其製作方法 |
CN113130420A (zh) * | 2021-03-19 | 2021-07-16 | 南通越亚半导体有限公司 | 一种嵌埋封装结构及其制造方法 |
US11804445B2 (en) * | 2021-04-29 | 2023-10-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming chip package structure |
US11817324B2 (en) | 2021-05-13 | 2023-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Info packages including thermal dissipation blocks |
US20230260942A1 (en) * | 2022-02-16 | 2023-08-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bond routing structure for stacked wafers |
CN116417353B (zh) * | 2023-04-07 | 2023-11-03 | 江苏中科智芯集成科技有限公司 | 一种半导体封装结构的制备方法 |
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US8558379B2 (en) * | 2007-09-28 | 2013-10-15 | Tessera, Inc. | Flip chip interconnection with double post |
US8383457B2 (en) * | 2010-09-03 | 2013-02-26 | Stats Chippac, Ltd. | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect |
US8193039B2 (en) * | 2010-09-24 | 2012-06-05 | Advanced Micro Devices, Inc. | Semiconductor chip with reinforcing through-silicon-vias |
CN202423279U (zh) * | 2011-12-29 | 2012-09-05 | 日月光半导体制造股份有限公司 | 多芯片晶圆级半导体封装构造 |
US9385052B2 (en) * | 2012-09-14 | 2016-07-05 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages |
US9443797B2 (en) * | 2012-09-14 | 2016-09-13 | STATS ChipPAC Pte. Ltd. | Semiconductor device having wire studs as vertical interconnect in FO-WLP |
US9287245B2 (en) * | 2012-11-07 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contoured package-on-package joint |
KR102134133B1 (ko) * | 2013-09-23 | 2020-07-16 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
US20150206812A1 (en) * | 2014-01-23 | 2015-07-23 | Qualcomm Incorporated | Substrate and method of forming the same |
US9527723B2 (en) * | 2014-03-13 | 2016-12-27 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming microelectromechanical systems (MEMS) package |
US20150342046A1 (en) * | 2014-05-23 | 2015-11-26 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, method for maufacturing the same and package on package having the same |
KR102372300B1 (ko) * | 2015-11-26 | 2022-03-08 | 삼성전자주식회사 | 스택 패키지 및 그 제조 방법 |
US9899342B2 (en) * | 2016-03-15 | 2018-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same |
CN106558574A (zh) * | 2016-11-18 | 2017-04-05 | 华为技术有限公司 | 芯片封装结构和方法 |
KR102400534B1 (ko) * | 2016-12-28 | 2022-05-20 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 모듈 |
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