DE102014118214B4 - Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements - Google Patents

Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements Download PDF

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Publication number
DE102014118214B4
DE102014118214B4 DE102014118214.6A DE102014118214A DE102014118214B4 DE 102014118214 B4 DE102014118214 B4 DE 102014118214B4 DE 102014118214 A DE102014118214 A DE 102014118214A DE 102014118214 B4 DE102014118214 B4 DE 102014118214B4
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Germany
Prior art keywords
chip
carrier substrate
component
polymer layer
tso
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Active
Application number
DE102014118214.6A
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German (de)
English (en)
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DE102014118214A1 (de
Inventor
Christian Bauer
Hans Krüger
Jürgen Portmann
Alois Stelzl
Wolfgang Pahl
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SnapTrack Inc
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SnapTrack Inc
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Priority to DE102014118214.6A priority Critical patent/DE102014118214B4/de
Application filed by SnapTrack Inc filed Critical SnapTrack Inc
Priority to BR112017012118-2A priority patent/BR112017012118A2/pt
Priority to US15/532,454 priority patent/US11245977B2/en
Priority to ES15781664T priority patent/ES2873364T3/es
Priority to CN201580063060.0A priority patent/CN107004664B/zh
Priority to EP15781664.6A priority patent/EP3231010B1/de
Priority to MX2017007254A priority patent/MX380533B/es
Priority to KR1020177013197A priority patent/KR102561741B1/ko
Priority to JP2017530257A priority patent/JP6672301B2/ja
Priority to PCT/EP2015/074148 priority patent/WO2016091438A1/de
Publication of DE102014118214A1 publication Critical patent/DE102014118214A1/de
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Publication of DE102014118214B4 publication Critical patent/DE102014118214B4/de
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  for microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/02—Transducers using more than one principle simultaneously
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/007—Protection circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Otolaryngology (AREA)
  • Health & Medical Sciences (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE102014118214.6A 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements Active DE102014118214B4 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE102014118214.6A DE102014118214B4 (de) 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
JP2017530257A JP6672301B2 (ja) 2014-12-09 2015-10-19 簡易に製造可能な電気部品及び電気部品の製造方法
ES15781664T ES2873364T3 (es) 2014-12-09 2015-10-19 Componente eléctrico fácil de fabricar y procedimiento para producir un componente eléctrico
CN201580063060.0A CN107004664B (zh) 2014-12-09 2015-10-19 可简单制造的电子元器件和制造电子元器件的方法
EP15781664.6A EP3231010B1 (de) 2014-12-09 2015-10-19 Einfach herstellbares elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements
MX2017007254A MX380533B (es) 2014-12-09 2015-10-19 Componente eléctrico sencillo de producir y método para producir un componente eléctrico.
BR112017012118-2A BR112017012118A2 (pt) 2014-12-09 2015-10-19 componente elétrico fácil de produzir e método para produzir um componente elétrico
US15/532,454 US11245977B2 (en) 2014-12-09 2015-10-19 Electric component with sensitive component structures and method for producing an electric component with sensitive component structures
PCT/EP2015/074148 WO2016091438A1 (de) 2014-12-09 2015-10-19 Einfach herstellbares elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements
KR1020177013197A KR102561741B1 (ko) 2014-12-09 2015-10-19 용이하게 제조가능한 전기 컴포넌트 및 전기 컴포넌트를 제조하기 위한 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014118214.6A DE102014118214B4 (de) 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements

Publications (2)

Publication Number Publication Date
DE102014118214A1 DE102014118214A1 (de) 2016-06-09
DE102014118214B4 true DE102014118214B4 (de) 2024-02-22

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DE102014118214.6A Active DE102014118214B4 (de) 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements

Country Status (10)

Country Link
US (1) US11245977B2 (https=)
EP (1) EP3231010B1 (https=)
JP (1) JP6672301B2 (https=)
KR (1) KR102561741B1 (https=)
CN (1) CN107004664B (https=)
BR (1) BR112017012118A2 (https=)
DE (1) DE102014118214B4 (https=)
ES (1) ES2873364T3 (https=)
MX (1) MX380533B (https=)
WO (1) WO2016091438A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11067768B2 (en) * 2017-11-16 2021-07-20 Tdk Taiwan Corp. Optical member driving mechanism
CN111003682A (zh) * 2018-10-08 2020-04-14 凤凰先驱股份有限公司 电子封装件及其制法
CN111821568A (zh) * 2019-03-30 2020-10-27 深圳硅基仿生科技有限公司 电子封装体的焊料体
CN111422821A (zh) * 2020-03-13 2020-07-17 清华大学 微系统封装方法

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DE102005053765A1 (de) 2005-11-10 2007-05-16 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US20090101998A1 (en) 2007-10-17 2009-04-23 Industrial Technology Research Institute Electro-acoustic sensing device
US7670878B2 (en) * 2007-05-17 2010-03-02 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing semiconductor package
DE102009019446A1 (de) 2009-04-29 2010-11-04 Epcos Ag MEMS Mikrofon
US20100283144A1 (en) 2007-12-26 2010-11-11 Steve Xin Liang In-situ cavity circuit package
DE102010006132A1 (de) 2010-01-29 2011-08-04 Epcos Ag, 81669 Miniaturisiertes elektrisches Bauelement mit einem MEMS und einem ASIC
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
DE102012112058A1 (de) 2012-12-11 2014-06-12 Epcos Ag MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen

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JP4903540B2 (ja) 2006-11-29 2012-03-28 京セラ株式会社 微小電子機械部品封止用基板及び複数個取り形態の微小電子機械部品封止用基板、並びに微小電子機械装置及び微小電子機械装置の製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070063129A1 (en) 2005-09-21 2007-03-22 Po-Hung Chen Packaging structure of a light-sensing device with a spacer wall
DE102005053765A1 (de) 2005-11-10 2007-05-16 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7670878B2 (en) * 2007-05-17 2010-03-02 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing semiconductor package
US20090101998A1 (en) 2007-10-17 2009-04-23 Industrial Technology Research Institute Electro-acoustic sensing device
US20100283144A1 (en) 2007-12-26 2010-11-11 Steve Xin Liang In-situ cavity circuit package
DE102009019446A1 (de) 2009-04-29 2010-11-04 Epcos Ag MEMS Mikrofon
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
DE102010006132A1 (de) 2010-01-29 2011-08-04 Epcos Ag, 81669 Miniaturisiertes elektrisches Bauelement mit einem MEMS und einem ASIC
DE102012112058A1 (de) 2012-12-11 2014-06-12 Epcos Ag MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen

Also Published As

Publication number Publication date
JP2018506171A (ja) 2018-03-01
CN107004664A (zh) 2017-08-01
EP3231010B1 (de) 2021-03-03
KR20170094143A (ko) 2017-08-17
WO2016091438A1 (de) 2016-06-16
MX380533B (es) 2025-03-12
ES2873364T3 (es) 2021-11-03
JP6672301B2 (ja) 2020-03-25
MX2017007254A (es) 2017-10-16
KR102561741B1 (ko) 2023-07-28
US20170272855A1 (en) 2017-09-21
EP3231010A1 (de) 2017-10-18
BR112017012118A2 (pt) 2018-01-02
DE102014118214A1 (de) 2016-06-09
US11245977B2 (en) 2022-02-08
CN107004664B (zh) 2021-02-05

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