DE102012018523A1 - Chemisch-mechanische Acrylat-Polyurethan-Polierschicht - Google Patents

Chemisch-mechanische Acrylat-Polyurethan-Polierschicht Download PDF

Info

Publication number
DE102012018523A1
DE102012018523A1 DE102012018523A DE102012018523A DE102012018523A1 DE 102012018523 A1 DE102012018523 A1 DE 102012018523A1 DE 102012018523 A DE102012018523 A DE 102012018523A DE 102012018523 A DE102012018523 A DE 102012018523A DE 102012018523 A1 DE102012018523 A1 DE 102012018523A1
Authority
DE
Germany
Prior art keywords
acrylate
isocyanate
bis
chemical mechanical
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012018523A
Other languages
German (de)
English (en)
Inventor
Jia Xie
David B. James
Chau H. Duong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102012018523A1 publication Critical patent/DE102012018523A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
DE102012018523A 2011-09-29 2012-09-19 Chemisch-mechanische Acrylat-Polyurethan-Polierschicht Withdrawn DE102012018523A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/248,123 US8512427B2 (en) 2011-09-29 2011-09-29 Acrylate polyurethane chemical mechanical polishing layer
US13/248,123 2011-09-29

Publications (1)

Publication Number Publication Date
DE102012018523A1 true DE102012018523A1 (de) 2013-04-04

Family

ID=47878728

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012018523A Withdrawn DE102012018523A1 (de) 2011-09-29 2012-09-19 Chemisch-mechanische Acrylat-Polyurethan-Polierschicht

Country Status (7)

Country Link
US (1) US8512427B2 (enExample)
JP (1) JP6073099B2 (enExample)
KR (1) KR101929055B1 (enExample)
CN (1) CN103072099B (enExample)
DE (1) DE102012018523A1 (enExample)
FR (1) FR2980798B1 (enExample)
TW (1) TWI472546B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
WO2015026613A1 (en) * 2013-08-20 2015-02-26 Dow Global Technologies Llc Polyurethane elastomeric seal for hydraulic pumps
US20150065013A1 (en) * 2013-08-30 2015-03-05 Dow Global Technologies Llc Chemical mechanical polishing pad
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
JP6365869B2 (ja) * 2014-03-19 2018-08-01 Dic株式会社 ウレタン組成物及び研磨材
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9064806B1 (en) * 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
JP7066608B2 (ja) * 2015-09-25 2022-05-13 シーエムシー マテリアルズ，インコーポレイティド 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法
JP2020504218A (ja) * 2017-01-12 2020-02-06 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ ポリウレタンの物理的性質の改善
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
US10465097B2 (en) 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
JP7099827B2 (ja) * 2018-01-26 2022-07-12 ニッタ・デュポン株式会社 研磨パッド
KR102197481B1 (ko) * 2019-06-27 2020-12-31 에스케이씨 주식회사 연마패드 및 이의 제조방법
US12006442B2 (en) * 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US12122013B2 (en) 2019-10-23 2024-10-22 Sk Enpulse Co., Ltd. Composition for polishing pad and polishing pad
EP4229104A4 (en) * 2020-10-19 2024-08-28 CMC Materials LLC UV CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
US11951591B2 (en) 2020-11-06 2024-04-09 Sk Enpulse Co., Ltd. Polishing pad, method for producing the same and method of fabricating semiconductor device using the same
KR102488112B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
US20230390888A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp pad having ultra expanded polymer microspheres
CN115415931B (zh) * 2022-07-26 2024-03-15 安徽禾臣新材料有限公司 一种半导体加工用化学机械抛光垫
CN117247739A (zh) * 2023-09-20 2023-12-19 上海宗易工贸有限公司 一种半导体晶片抛光材料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057431A (en) 1975-09-29 1977-11-08 The Goodyear Tire & Rubber Company Ethylenically polyurethane unsaturated composition
US4721751A (en) 1987-03-26 1988-01-26 Ppg Industries, Inc. Polyurea-polyurethane acrylate dispersions
US4855184A (en) 1988-02-02 1989-08-08 Minnesota Mining And Manufacturing Company Radiation-curable protective coating composition
US5341799A (en) 1991-12-23 1994-08-30 Hercules Incorporated Urethane polymers for printing plate compositions
US5965460A (en) 1997-01-29 1999-10-12 Mac Dermid, Incorporated Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads
WO1999007515A1 (en) * 1997-08-06 1999-02-18 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
KR100867339B1 (ko) 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
JP4576095B2 (ja) * 2003-04-24 2010-11-04 東洋インキ製造株式会社 両面粘着シート及び研磨布積層体
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP4475404B2 (ja) * 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
KR20060099398A (ko) * 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP2008221367A (ja) * 2007-03-09 2008-09-25 Toyo Tire & Rubber Co Ltd 研磨パッド
US8540893B2 (en) * 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
ASTM D1708-10
ASTM D2240-05
ASTM D5279-08

Also Published As

Publication number Publication date
KR20130035225A (ko) 2013-04-08
TWI472546B (zh) 2015-02-11
CN103072099A (zh) 2013-05-01
US20130084702A1 (en) 2013-04-04
US8512427B2 (en) 2013-08-20
CN103072099B (zh) 2015-06-17
KR101929055B1 (ko) 2018-12-13
TW201323466A (zh) 2013-06-16
FR2980798A1 (fr) 2013-04-05
FR2980798B1 (fr) 2016-06-17
JP2013078839A (ja) 2013-05-02
JP6073099B2 (ja) 2017-02-01

Similar Documents

Publication Publication Date Title
DE102012018523A1 (de) Chemisch-mechanische Acrylat-Polyurethan-Polierschicht
DE102013018258A1 (de) Weiches und konditionierbares chemisch-mechanisches Polierkissen
DE112006001927B4 (de) Polierkissen enthaltend ein Zwischenräume durchdringendes Netzwerk aus verflüssigtem Vinylmomomer mit darin befindlicher Polyurethanmatrix
DE102015007033A1 (de) Chemisch-mechanische Polierschichtformulierung mit Konditionierungstoleranz
DE102017008616A1 (de) Chemisch-mechanische Polierkissen mit hoher Planarisierungseffizienz und Verfahren zu deren Herstellung
DE102015006980A1 (de) Chemisch-Mechanisches Polierverfahren
DE102015003240A1 (de) Chemisch-mechanisches polierkissen mit polierschicht und fenster
DE102015004786A1 (de) Chemisch-mechanisches Polierkissen
DE102014015664A1 (de) Verfahren zum chemisch-mechanischen Polieren von Siliziumwafern
DE102014007002A1 (de) Chemisch-mechanischer Mehrschicht-Polierkissenstapel mit weicher und konditionierbarer Polierschicht
DE102014007027A1 (de) Weiches und konditionierbares chemisch-mechanisches Fensterpolierkissen
DE102015003200A1 (de) Weiches und konditionierbares chemisch-mechanisches polierkissen mit fenster
DE102007024459A1 (de) Chemisch-mechanisches Polierkissen
DE102014012353A1 (de) Chemisch-mechanisches polierkissen
DE102014007024A1 (de) Weicher und konditionierbarer chemisch-mechanischer Polierkissenstapel
DE102016007767A1 (de) Formulierung für eine verbundpolierschicht für ein chemisch-mechanisches polierkissen
DE102019007230A1 (de) Chemisch-mechanisches polierkissen und polierverfahren
DE602004010871T2 (de) Polierscheibe
DE102016012533A1 (de) Chemisch-mechanisches Polierverfahren
DE102014013023A1 (de) Polyurethan-Polierkissen
DE102016007777A1 (de) Verfahren mit Porositätseinstellung zur Bildung eines Polierkissens
TWI429504B (zh) A polishing pad and a method for manufacturing the same, and a method for manufacturing the glass substrate
TW201134876A (en) Creep-resistant polishing pad window
DE102016007771A1 (de) Verfahren zur Herstellung einer Polierschicht für ein chemisch-mechanisches Polierkissen
DE102015000550B4 (de) Verfahren zur herstellung chemisch-mechanischer polierschichten

Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination