DE102011000623A8 - Halbleitervorrichtung mit einem Halbleitermodul, das durch verstärkte Wärmesenken mit vergrößerter thermischer Masse gekühlt wird - Google Patents

Halbleitervorrichtung mit einem Halbleitermodul, das durch verstärkte Wärmesenken mit vergrößerter thermischer Masse gekühlt wird Download PDF

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Publication number
DE102011000623A8
DE102011000623A8 DE102011000623A DE102011000623A DE102011000623A8 DE 102011000623 A8 DE102011000623 A8 DE 102011000623A8 DE 102011000623 A DE102011000623 A DE 102011000623A DE 102011000623 A DE102011000623 A DE 102011000623A DE 102011000623 A8 DE102011000623 A8 DE 102011000623A8
Authority
DE
Germany
Prior art keywords
heat sinks
thermal mass
increased thermal
semiconductor device
reinforced heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011000623A
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English (en)
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DE102011000623A1 (de
Inventor
Taijirou MOMOSE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE102011000623A1 publication Critical patent/DE102011000623A1/de
Publication of DE102011000623A8 publication Critical patent/DE102011000623A8/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102011000623A 2010-02-11 2011-02-10 Halbleitervorrichtung mit einem Halbleitermodul, das von Wärmesenken mit vergrößerter thermischer Masse gekühlt wird Withdrawn DE102011000623A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010028326A JP2011165988A (ja) 2010-02-11 2010-02-11 半導体装置
JP2010-028326 2010-02-11

Publications (2)

Publication Number Publication Date
DE102011000623A1 DE102011000623A1 (de) 2011-08-11
DE102011000623A8 true DE102011000623A8 (de) 2011-11-17

Family

ID=44316796

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011000623A Withdrawn DE102011000623A1 (de) 2010-02-11 2011-02-10 Halbleitervorrichtung mit einem Halbleitermodul, das von Wärmesenken mit vergrößerter thermischer Masse gekühlt wird

Country Status (3)

Country Link
US (1) US20110194253A1 (de)
JP (1) JP2011165988A (de)
DE (1) DE102011000623A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9240750B2 (en) * 2011-11-30 2016-01-19 Mitsubishi Electric Corporation Forced air cooling-type power conversion device
JP5751273B2 (ja) * 2013-04-02 2015-07-22 トヨタ自動車株式会社 半導体装置
KR20160043050A (ko) 2013-08-16 2016-04-20 톰슨 라이센싱 분리된 대류 핀들을 가진 다층 열 확산기 조립체
CN105637748B (zh) * 2013-10-17 2018-04-27 三菱电机株式会社 功率单元及功率转换装置
US10074592B2 (en) * 2014-10-08 2018-09-11 Borgwarner Inc. Pedestal surface for MOSFET module
US10164504B2 (en) * 2014-10-08 2018-12-25 Borgwarner Inc. Bi-directional MOSFET cooling for an electric machine
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
JP6631431B2 (ja) * 2016-07-21 2020-01-15 株式会社デンソー 電力変換装置
CN111315182B (zh) * 2018-12-12 2022-02-08 台达电子工业股份有限公司 整合式电子装置
CN112994413B (zh) * 2021-03-24 2022-12-30 深圳市英威腾电气股份有限公司 自然散热变频器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456570U (de) * 1977-09-28 1979-04-19
JPS5965558U (ja) * 1982-10-25 1984-05-01 株式会社明電舎 Ｇｔｏユニツト
JPH08195452A (ja) * 1995-01-18 1996-07-30 Fuji Electric Co Ltd ヒートシンク
JP3525832B2 (ja) * 1999-11-24 2004-05-10 株式会社デンソー 半導体装置
JP2001196515A (ja) * 2000-01-11 2001-07-19 Matsushita Electric Works Ltd 放熱構造およびその製造方法
EP1148547B8 (de) * 2000-04-19 2016-01-06 Denso Corporation Kühlmittelgekühlte Halbleiteranordnung
JP2002319651A (ja) * 2001-04-20 2002-10-31 Nec Corp 半導体装置とその実装構造
JP3771518B2 (ja) 2002-05-31 2006-04-26 三菱電機株式会社 電力変換装置
EP2216891B1 (de) * 2003-08-21 2012-01-04 Denso Corporation Montagestruktur eines Halbleiterbausteins
JP4284625B2 (ja) * 2005-06-22 2009-06-24 株式会社デンソー 三相インバータ装置
JP4564937B2 (ja) * 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
JP4580997B2 (ja) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
JP5164704B2 (ja) 2008-07-17 2013-03-21 株式会社日立国際電気 中継局装置及び中継局における一斉通信後追い通知方法
US7952875B2 (en) * 2009-05-29 2011-05-31 GM Global Technology Operations LLC Stacked busbar assembly with integrated cooling

Also Published As

Publication number Publication date
JP2011165988A (ja) 2011-08-25
US20110194253A1 (en) 2011-08-11
DE102011000623A1 (de) 2011-08-11

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Legal Events

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140902