DE102009045208A1 - Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes - Google Patents

Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes Download PDF

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Publication number
DE102009045208A1
DE102009045208A1 DE102009045208A DE102009045208A DE102009045208A1 DE 102009045208 A1 DE102009045208 A1 DE 102009045208A1 DE 102009045208 A DE102009045208 A DE 102009045208A DE 102009045208 A DE102009045208 A DE 102009045208A DE 102009045208 A1 DE102009045208 A1 DE 102009045208A1
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DE
Germany
Prior art keywords
layers
layer
thermoelectric
starting
main group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009045208A
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German (de)
English (en)
Inventor
Joachim Dr. Nurnus
Harald Dr. Böttner
Axel Schubert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micropatent Bv Nl
Original Assignee
Micropelt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micropelt GmbH filed Critical Micropelt GmbH
Priority to DE102009045208A priority Critical patent/DE102009045208A1/de
Priority to JP2012531403A priority patent/JP2013506981A/ja
Priority to PCT/EP2010/064433 priority patent/WO2011039240A2/de
Priority to US13/498,863 priority patent/US20130068274A1/en
Priority to EP10771687A priority patent/EP2483940A2/de
Publication of DE102009045208A1 publication Critical patent/DE102009045208A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
  • Powder Metallurgy (AREA)
DE102009045208A 2009-09-30 2009-09-30 Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes Withdrawn DE102009045208A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102009045208A DE102009045208A1 (de) 2009-09-30 2009-09-30 Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes
JP2012531403A JP2013506981A (ja) 2009-09-30 2010-09-29 熱電構造体の製造方法と熱電構造体
PCT/EP2010/064433 WO2011039240A2 (de) 2009-09-30 2010-09-29 Verfahren zum herstellen eines thermoelektrischen bauelementes und thermoelektrisches bauelement
US13/498,863 US20130068274A1 (en) 2009-09-30 2010-09-29 Method for producing a thermoelectric component and thermoelectric component
EP10771687A EP2483940A2 (de) 2009-09-30 2010-09-29 Verfahren zum herstellen eines thermoelektrischen bauelementes und thermoelektrisches bauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009045208A DE102009045208A1 (de) 2009-09-30 2009-09-30 Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes

Publications (1)

Publication Number Publication Date
DE102009045208A1 true DE102009045208A1 (de) 2011-04-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009045208A Withdrawn DE102009045208A1 (de) 2009-09-30 2009-09-30 Thermoelektrisches Bauelement und Verfahren zum Herstellen eines thermoelektrischen Bauelementes

Country Status (5)

Country Link
US (1) US20130068274A1 (https=)
EP (1) EP2483940A2 (https=)
JP (1) JP2013506981A (https=)
DE (1) DE102009045208A1 (https=)
WO (1) WO2011039240A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9516790B2 (en) 2013-04-09 2016-12-06 Harman Becker Automotive Systems Gmbh Thermoelectric cooler/heater integrated in printed circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2887409B1 (en) 2013-12-17 2016-06-15 Airbus Defence and Space GmbH Micromachined energy harvester with a thermoelectric generator and method for manufacturing the same
JP6730597B2 (ja) * 2016-07-12 2020-07-29 富士通株式会社 熱電変換材料及び熱電変換装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060657A (en) * 1998-06-24 2000-05-09 Massachusetts Institute Of Technology Lead-chalcogenide superlattice structures
US6300150B1 (en) 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
US20030230332A1 (en) * 2002-04-15 2003-12-18 Research Triangle Institute Thermoelectric device utilizing double-sided peltier junctions and method of making the device
US20040221792A1 (en) * 2003-05-07 2004-11-11 Micron Technology, Inc. Strained Si/SiGe structures by ion implantation
US20070028956A1 (en) * 2005-04-12 2007-02-08 Rama Venkatasubramanian Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices
US7514726B2 (en) * 2006-03-21 2009-04-07 The United States Of America As Represented By The Aministrator Of The National Aeronautics And Space Administration Graded index silicon geranium on lattice matched silicon geranium semiconductor alloy

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3526699B2 (ja) * 1996-07-16 2004-05-17 本田技研工業株式会社 熱電材料
WO2000030185A1 (en) * 1998-11-13 2000-05-25 Hi-Z Technology, Inc. Quantum well thermoelectric material on very thin substrate
US6096964A (en) * 1998-11-13 2000-08-01 Hi-Z Technology, Inc. Quantum well thermoelectric material on thin flexible substrate
KR100465661B1 (ko) * 1999-06-02 2005-01-13 아사히 가세이 가부시키가이샤 열전 재료 및 그 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300150B1 (en) 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
US6060657A (en) * 1998-06-24 2000-05-09 Massachusetts Institute Of Technology Lead-chalcogenide superlattice structures
US20030230332A1 (en) * 2002-04-15 2003-12-18 Research Triangle Institute Thermoelectric device utilizing double-sided peltier junctions and method of making the device
US20040221792A1 (en) * 2003-05-07 2004-11-11 Micron Technology, Inc. Strained Si/SiGe structures by ion implantation
US20070028956A1 (en) * 2005-04-12 2007-02-08 Rama Venkatasubramanian Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices
US7514726B2 (en) * 2006-03-21 2009-04-07 The United States Of America As Represented By The Aministrator Of The National Aeronautics And Space Administration Graded index silicon geranium on lattice matched silicon geranium semiconductor alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9516790B2 (en) 2013-04-09 2016-12-06 Harman Becker Automotive Systems Gmbh Thermoelectric cooler/heater integrated in printed circuit board

Also Published As

Publication number Publication date
WO2011039240A2 (de) 2011-04-07
WO2011039240A3 (de) 2011-08-11
US20130068274A1 (en) 2013-03-21
JP2013506981A (ja) 2013-02-28
EP2483940A2 (de) 2012-08-08

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OP8 Request for examination as to paragraph 44 patent law
R082 Change of representative

Representative=s name: MAIKOWSKI & NINNEMANN PATENTANWAELTE, DE

R081 Change of applicant/patentee

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Free format text: FORMER OWNER: MICROPELT GMBH, 79110 FREIBURG, DE

Effective date: 20141217

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee