DE102007032555A1 - Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips - Google Patents

Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips Download PDF

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Publication number
DE102007032555A1
DE102007032555A1 DE102007032555A DE102007032555A DE102007032555A1 DE 102007032555 A1 DE102007032555 A1 DE 102007032555A1 DE 102007032555 A DE102007032555 A DE 102007032555A DE 102007032555 A DE102007032555 A DE 102007032555A DE 102007032555 A1 DE102007032555 A1 DE 102007032555A1
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Germany
Prior art keywords
layer
contact
semiconductor chip
semiconductor
chip according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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DE102007032555A
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German (de)
English (en)
Inventor
Michael Dr. Fehrer
Uwe Dr. Strauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39720739&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102007032555(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102007032555A priority Critical patent/DE102007032555A1/de
Priority to EP08159845.0A priority patent/EP2015372B1/de
Priority to EP16187689.1A priority patent/EP3121858A1/de
Priority to JP2008180584A priority patent/JP5079611B2/ja
Priority to US12/218,492 priority patent/US7994519B2/en
Publication of DE102007032555A1 publication Critical patent/DE102007032555A1/de
Priority to JP2012188817A priority patent/JP5876792B2/ja
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162Current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8314Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8316Multi-layer electrodes comprising at least one discontinuous layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/833Transparent materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials

Landscapes

  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Electrodes Of Semiconductors (AREA)
DE102007032555A 2007-07-12 2007-07-12 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips Withdrawn DE102007032555A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102007032555A DE102007032555A1 (de) 2007-07-12 2007-07-12 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips
EP08159845.0A EP2015372B1 (de) 2007-07-12 2008-07-07 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips
EP16187689.1A EP3121858A1 (de) 2007-07-12 2008-07-07 Halbleiterchip und verfahren zur herstellung eines halbleiterchips
JP2008180584A JP5079611B2 (ja) 2007-07-12 2008-07-10 半導体チップ及び半導体チップ製造方法
US12/218,492 US7994519B2 (en) 2007-07-12 2008-07-14 Semiconductor chip and method for producing a semiconductor chip
JP2012188817A JP5876792B2 (ja) 2007-07-12 2012-08-29 半導体チップ及び半導体チップ製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007032555A DE102007032555A1 (de) 2007-07-12 2007-07-12 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips

Publications (1)

Publication Number Publication Date
DE102007032555A1 true DE102007032555A1 (de) 2009-01-15

Family

ID=39720739

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007032555A Withdrawn DE102007032555A1 (de) 2007-07-12 2007-07-12 Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips

Country Status (4)

Country Link
US (1) US7994519B2 (https=)
EP (2) EP2015372B1 (https=)
JP (2) JP5079611B2 (https=)
DE (1) DE102007032555A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102857A1 (de) * 2015-02-27 2016-09-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zur Herstellung eines elektrischen Kontakts und Verfahren zur Herstellung eines Halbleiterbauelements
EP3121858A1 (de) 2007-07-12 2017-01-25 Osram Opto Semiconductors Gmbh Halbleiterchip und verfahren zur herstellung eines halbleiterchips
DE102015011635A1 (de) * 2015-09-11 2017-03-16 Azur Space Solar Power Gmbh lnfrarot-LED
DE102016006295A1 (de) * 2016-05-27 2017-11-30 Azur Space Solar Power Gmbh Leuchtdiode
DE102017002333A1 (de) 2017-03-13 2018-09-13 Azur Space Solar Power Gmbh Leuchtdiode
DE102017002332A1 (de) 2017-03-13 2018-09-13 Azur Space Solar Power Gmbh Leuchtdiode

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TWI404189B (zh) * 2009-02-06 2013-08-01 億光電子工業股份有限公司 複晶式發光二極體元件及其製造方法
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
CN103222074B (zh) 2010-11-18 2016-06-01 首尔伟傲世有限公司 具有电极焊盘的发光二极管芯片
US9520536B2 (en) 2010-11-18 2016-12-13 Seoul Viosys Co., Ltd. Light emitting diode chip having electrode pad
KR101769075B1 (ko) * 2010-12-24 2017-08-18 서울바이오시스 주식회사 발광 다이오드 칩 및 그것을 제조하는 방법
US9312437B2 (en) * 2011-11-07 2016-04-12 Koninklijke Philips N.V. P-contact with more uniform injection and lower optical loss
DE102012108883A1 (de) * 2012-09-20 2014-03-20 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips
DE102013007981A1 (de) 2013-05-10 2014-11-13 Audi Ag Vorrichtung zum Erzeugen eines Impulses auf ein Fahrzeug in einer Fahrzeugquerrichtung
FR3008547B1 (fr) * 2013-07-15 2016-12-09 Commissariat Energie Atomique Structure emissive a injection laterale de porteurs
CN103594593B (zh) * 2013-11-08 2016-04-06 溧阳市江大技术转移中心有限公司 具有粗化透明电极的倒装发光二极管的制造方法
KR102131345B1 (ko) * 2014-02-07 2020-07-07 엘지이노텍 주식회사 발광소자
JP6149878B2 (ja) 2015-02-13 2017-06-21 日亜化学工業株式会社 発光素子
DE102017104735B4 (de) 2017-03-07 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender Halbleiterchip
WO2022094801A1 (zh) * 2020-11-04 2022-05-12 苏州晶湛半导体有限公司 谐振腔发光二极管及其制备方法
CN115483323A (zh) * 2021-05-31 2022-12-16 京东方科技集团股份有限公司 发光器件、发光基板和发光器件的制作方法

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US6515308B1 (en) * 2001-12-21 2003-02-04 Xerox Corporation Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
DE10346605A1 (de) * 2003-08-29 2005-03-31 Osram Opto Semiconductors Gmbh Strahlungemittierendes Halbleiterbauelement
US20050087753A1 (en) * 2003-10-24 2005-04-28 D'evelyn Mark P. Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates
EP1577959A2 (en) * 2004-03-19 2005-09-21 LumiLeds Lighting U.S., LLC Semiconductor light emitting devices including in-plane light emitting layers
DE102005008056A1 (de) * 2004-12-30 2006-07-13 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips
DE102005061797A1 (de) * 2005-12-23 2007-07-05 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip mit Stromaufweitungsschicht und Verfahren zu dessen Herstellung

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US6515308B1 (en) * 2001-12-21 2003-02-04 Xerox Corporation Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
DE10346605A1 (de) * 2003-08-29 2005-03-31 Osram Opto Semiconductors Gmbh Strahlungemittierendes Halbleiterbauelement
US20050087753A1 (en) * 2003-10-24 2005-04-28 D'evelyn Mark P. Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates
EP1577959A2 (en) * 2004-03-19 2005-09-21 LumiLeds Lighting U.S., LLC Semiconductor light emitting devices including in-plane light emitting layers
DE102005008056A1 (de) * 2004-12-30 2006-07-13 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips
DE102005061797A1 (de) * 2005-12-23 2007-07-05 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip mit Stromaufweitungsschicht und Verfahren zu dessen Herstellung

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121858A1 (de) 2007-07-12 2017-01-25 Osram Opto Semiconductors Gmbh Halbleiterchip und verfahren zur herstellung eines halbleiterchips
DE102015102857A1 (de) * 2015-02-27 2016-09-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zur Herstellung eines elektrischen Kontakts und Verfahren zur Herstellung eines Halbleiterbauelements
US10153400B2 (en) 2015-02-27 2018-12-11 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device, method of producing an electrical contact and method of producing a semiconductor device
DE102015011635A1 (de) * 2015-09-11 2017-03-16 Azur Space Solar Power Gmbh lnfrarot-LED
DE102015011635B4 (de) * 2015-09-11 2020-10-08 Azur Space Solar Power Gmbh lnfrarot-LED
US10211370B2 (en) 2015-09-11 2019-02-19 Azur Space Solar Power Gmbh Infrared LED
US10103289B2 (en) 2016-05-27 2018-10-16 Azur Space Solar Power Gmbh Light-emitting diode
DE102016006295A1 (de) * 2016-05-27 2017-11-30 Azur Space Solar Power Gmbh Leuchtdiode
DE102017002333A1 (de) 2017-03-13 2018-09-13 Azur Space Solar Power Gmbh Leuchtdiode
US10128413B2 (en) 2017-03-13 2018-11-13 Azur Space Solar Power Gmbh Light emitting diode
CN108574028A (zh) * 2017-03-13 2018-09-25 阿聚尔斯佩西太阳能有限责任公司 发光二极管
EP3376547A1 (de) * 2017-03-13 2018-09-19 AZUR SPACE Solar Power GmbH Leuchtdiode
TWI661577B (zh) * 2017-03-13 2019-06-01 德商艾澤太空太陽能公司 發光二極體
DE102017002332B4 (de) * 2017-03-13 2019-11-07 Azur Space Solar Power Gmbh Leuchtdiode
US10475963B2 (en) 2017-03-13 2019-11-12 Azur Space Solar Power Gmbh Light emitting diode
US10615309B2 (en) 2017-03-13 2020-04-07 Azur Space Solar Power Gmbh Light emitting diode
CN108574028B (zh) * 2017-03-13 2020-09-01 阿聚尔斯佩西太阳能有限责任公司 发光二极管
DE102017002332A1 (de) 2017-03-13 2018-09-13 Azur Space Solar Power Gmbh Leuchtdiode

Also Published As

Publication number Publication date
JP2012256933A (ja) 2012-12-27
JP2009033157A (ja) 2009-02-12
EP3121858A1 (de) 2017-01-25
US20090045426A1 (en) 2009-02-19
EP2015372A2 (de) 2009-01-14
EP2015372A3 (de) 2013-02-06
JP5876792B2 (ja) 2016-03-02
US7994519B2 (en) 2011-08-09
EP2015372B1 (de) 2016-10-19
JP5079611B2 (ja) 2012-11-21

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Effective date: 20140715