DE102006036963A1 - Halbleiterbauelement mit Kontaktstelle und Herstellungsverfahren - Google Patents

Halbleiterbauelement mit Kontaktstelle und Herstellungsverfahren Download PDF

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Publication number
DE102006036963A1
DE102006036963A1 DE102006036963A DE102006036963A DE102006036963A1 DE 102006036963 A1 DE102006036963 A1 DE 102006036963A1 DE 102006036963 A DE102006036963 A DE 102006036963A DE 102006036963 A DE102006036963 A DE 102006036963A DE 102006036963 A1 DE102006036963 A1 DE 102006036963A1
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Germany
Prior art keywords
ferrite
layer
further characterized
forming
signal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102006036963A
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German (de)
English (en)
Inventor
Eun-Seok Song
Un-Byoung Hwaseong Kang
Si-Hoon Yongin Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050070396A external-priority patent/KR100606654B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE102006036963A1 publication Critical patent/DE102006036963A1/de
Ceased legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE102006036963A 2005-08-01 2006-08-01 Halbleiterbauelement mit Kontaktstelle und Herstellungsverfahren Ceased DE102006036963A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020050070396A KR100606654B1 (ko) 2005-08-01 2005-08-01 전자파 장해 저감용 페라이트 차폐 구조를 구비하는 반도체패키지 및 그 제조 방법
KR10-2005-0070396 2005-08-01
US11/387,848 2006-03-24
US11/387,848 US7495317B2 (en) 2005-08-01 2006-03-24 Semiconductor package with ferrite shielding structure

Publications (1)

Publication Number Publication Date
DE102006036963A1 true DE102006036963A1 (de) 2007-02-15

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DE (1) DE102006036963A1 (ja)

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US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
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