DE102006033241A1 - Fahrueugbeleuchtungseinrichtung und LED-Lichtquelle dafür - Google Patents

Fahrueugbeleuchtungseinrichtung und LED-Lichtquelle dafür Download PDF

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Publication number
DE102006033241A1
DE102006033241A1 DE102006033241A DE102006033241A DE102006033241A1 DE 102006033241 A1 DE102006033241 A1 DE 102006033241A1 DE 102006033241 A DE102006033241 A DE 102006033241A DE 102006033241 A DE102006033241 A DE 102006033241A DE 102006033241 A1 DE102006033241 A1 DE 102006033241A1
Authority
DE
Germany
Prior art keywords
light source
temperature
led chip
led light
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006033241A
Other languages
German (de)
English (en)
Inventor
Yasushi Yatsuda
Hisao Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of DE102006033241A1 publication Critical patent/DE102006033241A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/18—Controlling the intensity of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
DE102006033241A 2005-07-20 2006-07-18 Fahrueugbeleuchtungseinrichtung und LED-Lichtquelle dafür Withdrawn DE102006033241A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-210484 2005-07-20
JP2005210484A JP4857633B2 (ja) 2005-07-20 2005-07-20 Ｌｅｄ光源

Publications (1)

Publication Number Publication Date
DE102006033241A1 true DE102006033241A1 (de) 2007-02-15

Family

ID=37681249

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006033241A Withdrawn DE102006033241A1 (de) 2005-07-20 2006-07-18 Fahrueugbeleuchtungseinrichtung und LED-Lichtquelle dafür

Country Status (3)

Country Link
US (1) US7656307B2 (https=)
JP (1) JP4857633B2 (https=)
DE (1) DE102006033241A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046075A1 (de) * 2007-09-26 2009-04-02 Osram Opto Semiconductors Gmbh LED-Modul
DE102012000623A1 (de) * 2012-01-14 2013-07-18 Volkswagen Aktiengesellschaft Temperaturüberwachung von Leuchtvorrichtungen

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US20080055896A1 (en) * 2006-08-30 2008-03-06 David Charles Feldmeier Systems, devices, components and methods for controllably configuring the color of light emitted by an automotive LED illumination system
US20080055065A1 (en) * 2006-08-30 2008-03-06 David Charles Feldmeier Systems, devices, components and methods for controllably configuring the brightness of light emitted by an automotive LED illumination system
JP4753904B2 (ja) * 2007-03-15 2011-08-24 シャープ株式会社 発光装置
JP4796027B2 (ja) * 2007-09-18 2011-10-19 パナソニック株式会社 Ｌｅｄモジュール
KR100906087B1 (ko) * 2007-10-26 2009-07-06 화우테크놀러지 주식회사 엘이디램프
WO2009090788A1 (ja) * 2008-01-18 2009-07-23 Sharp Kabushiki Kaisha 白色光源並びにそれを備えた照明装置及び表示装置
WO2009095817A1 (en) * 2008-01-31 2009-08-06 Koninklijke Philips Electronics N.V. Lighting unit and thermal management system and method therefor
JP5665160B2 (ja) * 2008-03-26 2015-02-04 パナソニックＩｐマネジメント株式会社 発光装置および照明器具
US8159131B2 (en) * 2008-06-30 2012-04-17 Bridgelux, Inc. Light emitting device having a transparent thermally conductive layer
KR100999760B1 (ko) * 2008-09-26 2010-12-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP5028466B2 (ja) * 2008-11-27 2012-09-19 サムソン エルイーディー カンパニーリミテッド． 車用ヘッドライト
US9326346B2 (en) 2009-01-13 2016-04-26 Terralux, Inc. Method and device for remote sensing and control of LED lights
US8358085B2 (en) 2009-01-13 2013-01-22 Terralux, Inc. Method and device for remote sensing and control of LED lights
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
EP2501393B1 (en) * 2009-11-17 2016-07-27 Terralux, Inc. Led power-supply detection and control
CA2787703A1 (en) 2010-01-20 2011-07-28 The Flewelling Ford Family Trust Mesh lighting system for emergency vehicles
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
CN102163602B (zh) * 2010-02-16 2015-01-14 东芝照明技术株式会社 发光装置以及具备此发光装置的照明装置
US9548286B2 (en) 2010-08-09 2017-01-17 Micron Technology, Inc. Solid state lights with thermal control elements
WO2012037436A1 (en) 2010-09-16 2012-03-22 Terralux, Inc. Communication with lighting units over a power bus
US9596738B2 (en) 2010-09-16 2017-03-14 Terralux, Inc. Communication with lighting units over a power bus
JP5545866B2 (ja) * 2010-11-01 2014-07-09 シチズン電子株式会社 半導体発光装置
US8644699B2 (en) * 2011-02-17 2014-02-04 Nokia Corporation Method and apparatus for light emitting diode control
EP2762767A4 (en) * 2011-09-27 2015-04-01 Toshiba Lighting & Technology LAMP DEVICE AND LIGHTING DEVICE
WO2013090904A1 (en) 2011-12-16 2013-06-20 Terralux, Inc. System and methods of applying bleed circuits in led lamps
FR2984251B1 (fr) * 2011-12-19 2014-01-10 Saint Gobain Vitrage eclairant pour vehicule
US9249966B1 (en) 2012-11-09 2016-02-02 OptoElectronix, Inc. High efficiency SSL thermal designs for traditional lighting housings
US9265119B2 (en) 2013-06-17 2016-02-16 Terralux, Inc. Systems and methods for providing thermal fold-back to LED lights
US9164001B2 (en) * 2013-06-28 2015-10-20 Bridgelux, Inc. Using an LED die to measure temperature inside silicone that encapsulates an LED array
JP6256699B2 (ja) * 2014-11-11 2018-01-10 豊田合成株式会社 発光装置
CN104797060B (zh) 2015-05-13 2017-11-10 昂宝电子（上海）有限公司 用于发光二极管照明系统中的温度控制的系统和方法
US10925128B2 (en) * 2016-06-10 2021-02-16 Eaton Intelligent Power Limited Current tuneback in light emitting diode luminaires
US11408602B2 (en) * 2018-10-10 2022-08-09 Elumigen, Llc High intensity discharge light assembly
CN112768442A (zh) * 2021-02-19 2021-05-07 深圳市艾迪恩科技有限公司 一种彩色外观的led灯丝及灯丝灯
CN114484302A (zh) * 2022-01-26 2022-05-13 林耀 带有散热结构光源载体

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JP4040955B2 (ja) * 2002-11-06 2008-01-30 株式会社小糸製作所 車両用前照灯及びその製造方法
US7018565B2 (en) * 2003-03-04 2006-03-28 Sarnoff Corporation Efficient, size-selected green-emitting phosphors
JP2004276737A (ja) * 2003-03-14 2004-10-07 Koito Mfg Co Ltd 車両用灯具
US7091874B2 (en) * 2003-04-18 2006-08-15 Smithson Bradley D Temperature compensated warning light
JP4234488B2 (ja) * 2003-05-08 2009-03-04 株式会社小糸製作所 車両用灯具
JP4251941B2 (ja) * 2003-08-08 2009-04-08 三菱電機株式会社 ヘッドランプ
US7482636B2 (en) * 2003-10-15 2009-01-27 Nichia Corporation Light emitting device
KR100623024B1 (ko) * 2004-06-10 2006-09-19 엘지전자 주식회사 고출력 ｌｅｄ 패키지
US20060132323A1 (en) * 2004-09-27 2006-06-22 Milex Technologies, Inc. Strobe beacon

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046075A1 (de) * 2007-09-26 2009-04-02 Osram Opto Semiconductors Gmbh LED-Modul
DE102012000623A1 (de) * 2012-01-14 2013-07-18 Volkswagen Aktiengesellschaft Temperaturüberwachung von Leuchtvorrichtungen

Also Published As

Publication number Publication date
JP2007027583A (ja) 2007-02-01
US7656307B2 (en) 2010-02-02
JP4857633B2 (ja) 2012-01-18
US20070041185A1 (en) 2007-02-22

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Effective date: 20130718

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Free format text: PREVIOUS MAIN CLASS: F21K0002000000

Ipc: F21K0009000000

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee