DE102005014674B4 - Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben - Google Patents
Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben Download PDFInfo
- Publication number
- DE102005014674B4 DE102005014674B4 DE102005014674A DE102005014674A DE102005014674B4 DE 102005014674 B4 DE102005014674 B4 DE 102005014674B4 DE 102005014674 A DE102005014674 A DE 102005014674A DE 102005014674 A DE102005014674 A DE 102005014674A DE 102005014674 B4 DE102005014674 B4 DE 102005014674B4
- Authority
- DE
- Germany
- Prior art keywords
- thermal barrier
- semiconductor
- semiconductor module
- plastic housing
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005014674A DE102005014674B4 (de) | 2005-03-29 | 2005-03-29 | Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben |
US11/910,113 US7825506B2 (en) | 2005-03-29 | 2006-03-27 | Semiconductor module including semiconductor chips in a plastic housing in separate regions |
PCT/DE2006/000543 WO2006102874A1 (fr) | 2005-03-29 | 2006-03-27 | Module a semi-conducteur compose de puces a semi-conducteur dans un boitier en plastique a zones separees et procede de fabrication dudit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005014674A DE102005014674B4 (de) | 2005-03-29 | 2005-03-29 | Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102005014674A1 DE102005014674A1 (de) | 2006-10-19 |
DE102005014674B4 true DE102005014674B4 (de) | 2010-02-11 |
Family
ID=36579889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102005014674A Expired - Fee Related DE102005014674B4 (de) | 2005-03-29 | 2005-03-29 | Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben |
Country Status (3)
Country | Link |
---|---|
US (1) | US7825506B2 (fr) |
DE (1) | DE102005014674B4 (fr) |
WO (1) | WO2006102874A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190047444A (ko) * | 2017-10-27 | 2019-05-08 | 에스케이하이닉스 주식회사 | 단열벽을 포함하는 반도체 패키지 |
JP2021077698A (ja) * | 2019-11-06 | 2021-05-20 | キオクシア株式会社 | 半導体パッケージ |
US20230122242A1 (en) * | 2021-10-15 | 2023-04-20 | Hrl Laboratories, Llc | Thermal Isolation Between Embedded MECA Modules |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3930858A1 (de) * | 1988-09-20 | 1990-03-22 | Peter H Maier | Modulaufbau |
DE10137618A1 (de) * | 2001-08-01 | 2003-02-27 | Infineon Technologies Ag | Schutzvorrichtung für Baugruppen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2772184B2 (ja) | 1991-11-07 | 1998-07-02 | 株式会社東芝 | 半導体装置 |
US5777847A (en) * | 1995-09-27 | 1998-07-07 | Nec Corporation | Multichip module having a cover wtih support pillar |
JP3516789B2 (ja) | 1995-11-15 | 2004-04-05 | 三菱電機株式会社 | 半導体パワーモジュール |
US5866953A (en) | 1996-05-24 | 1999-02-02 | Micron Technology, Inc. | Packaged die on PCB with heat sink encapsulant |
KR100370231B1 (ko) | 2000-06-13 | 2003-01-29 | 페어차일드코리아반도체 주식회사 | 리드프레임의 배면에 직접 부착되는 절연방열판을구비하는 전력 모듈 패키지 |
DE10137667B4 (de) | 2001-08-01 | 2010-05-20 | Qimonda Ag | Schutzvorrichtung für Baugruppen mit Abstandhalter |
DE10146854B4 (de) | 2001-09-24 | 2009-05-20 | Infineon Technologies Ag | Elektronisches Bauteil mit wenigstens einem Halbleiterchip und Verfahren zur Herstellung eines elektronischen Bauteils mit wenigstens einem Halbleiterchip |
JP2003298009A (ja) * | 2002-03-29 | 2003-10-17 | Toshiba Corp | パワーモジュール及びそれを用いた電力変換装置 |
EP1524690B1 (fr) | 2003-10-13 | 2009-03-11 | Infineon Technologies AG | Boîtier à semiconducteur avec dissipateur thermique |
-
2005
- 2005-03-29 DE DE102005014674A patent/DE102005014674B4/de not_active Expired - Fee Related
-
2006
- 2006-03-27 US US11/910,113 patent/US7825506B2/en not_active Expired - Fee Related
- 2006-03-27 WO PCT/DE2006/000543 patent/WO2006102874A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3930858A1 (de) * | 1988-09-20 | 1990-03-22 | Peter H Maier | Modulaufbau |
DE10137618A1 (de) * | 2001-08-01 | 2003-02-27 | Infineon Technologies Ag | Schutzvorrichtung für Baugruppen |
Also Published As
Publication number | Publication date |
---|---|
US7825506B2 (en) | 2010-11-02 |
US20090057874A1 (en) | 2009-03-05 |
DE102005014674A1 (de) | 2006-10-19 |
WO2006102874A1 (fr) | 2006-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60004269T2 (de) | Elektronische baugruppe mit hohem kühlungsvermögen | |
DE3814469C2 (fr) | ||
DE102011077206B4 (de) | Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte | |
DE102009027292A1 (de) | Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung | |
DE19715001A1 (de) | Kühleinrichtung für einen Montagemodul | |
DE2354260A1 (de) | Anordnung fuer die dichte packung von integrierten schaltungen | |
EP1120831A2 (fr) | Composant électronique avec un dispositif de blindage électromagnétique | |
DE10139395A1 (de) | Kontaktierung von Halbleiterchips in Chipkarten | |
EP2962799B1 (fr) | Module semi-conducteur doté de raccords soudés aux ultrasons | |
EP2772122A1 (fr) | Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant | |
DE102018132143A1 (de) | Leiterplatte, chip-kühlgehäuse, baugruppe und verfahren zum kühlen eines halbleiterchips | |
DE8114325U1 (de) | Wärmeableitungsvorrichtung | |
DE19722357C1 (de) | Steuergerät | |
DE102005014674B4 (de) | Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben | |
DE102014218389B4 (de) | Halbleitermodul | |
DE102005039764A1 (de) | Vorrichtung für eine thermische Kopplung und Verfahren zur Herstellung einer thermischen Kopplung | |
EP2476300B1 (fr) | Unité électronique et procédé de fabrication associé | |
DE102005054268B4 (de) | Verfahren zur Herstellung eines Halbleiterbauteils mit mindestens einem Halbleiterchip | |
DE10324615A1 (de) | Elektronisches Bauteil und Verfahren, sowie Vorrichtung zur Herstellung des elektronischen Bauteils | |
DE19645971C2 (de) | Gehäusungssystem mit Feldeffekttransistoren und Verfahren zum Gehäusen von Feldeffekttransistoren | |
DE102016211967B3 (de) | Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils | |
EP1049362B1 (fr) | Plaquette à circuit comportante une région conductrice pour la chaleur | |
DE102015204915B4 (de) | Wärmeleitkörper mit einer Koppeloberfläche mit Vertiefung und Wärmetransfervorrichtung | |
DE3935792A1 (de) | Elektronische schaltung auf gesinterter keramikfolie | |
EP0607845B1 (fr) | Elément isolant en une pièce, en particulier une pièce fait par moulage par injection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |