EP2772122A1 - Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant - Google Patents

Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant

Info

Publication number
EP2772122A1
EP2772122A1 EP12755994.6A EP12755994A EP2772122A1 EP 2772122 A1 EP2772122 A1 EP 2772122A1 EP 12755994 A EP12755994 A EP 12755994A EP 2772122 A1 EP2772122 A1 EP 2772122A1
Authority
EP
European Patent Office
Prior art keywords
circuit carrier
circuit
control module
cover
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12755994.6A
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2772122A1 publication Critical patent/EP2772122A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Definitions

  • Transmission control module with solder bridges or cold contacts between inserted circuit carrier and surrounding circuit carrier
  • the present invention relates to a transmission control module of a
  • Motor vehicle transmission comprising a circuit support device, a support plate and a cover, wherein the circuit support device is at least partially disposed between the support plate and the cover.
  • Circuit support device has at least a first circuit carrier and a second circuit carrier, wherein the first circuit carrier has a recess and the second circuit carrier is arranged in the recess, wherein the second circuit carrier is held on the support plate and wherein the second circuit carrier is completely covered by the cover and the cover is sealingly connected to the support plate via the first circuit carrier, and wherein the first and second circuit carriers each have a plurality of contact pads connected to a plurality of connections.
  • Transmission control modules are used in motor vehicles, in particular for
  • a printed circuit board is arranged with a module module in a breakthrough of a motherboard, wherein the module module has a housing with a holding device, which
  • Measures for example, a circumferential sealing element, are required.
  • the first and the second circuit carrier are formed flat and plate-shaped and the connections of the second and first
  • Circuit carriers are formed with bridge connections, which penetrate the end in each case into the first and second circuit carriers.
  • the cover and the support plate which in each case connect to the first circuit carrier and are sealingly connected thereto, seal the second circuit carrier and the bridge connections with respect to the environment, for example with respect to a transmission region which has transmission oil.
  • the first and second circuit carriers may each comprise a plate-shaped substrate.
  • the second circuit carrier is unpacked.
  • the first circuit carrier is a module circuit carrier and the second
  • the circuit carrier is an iTCU circuit carrier (circuit carrier for an electronic transmission control, Transmission Control Unit).
  • the second circuit carrier has the central electronic circuit of the controller, and the first circuit carrier is used to hold other components, such as sensors or connectors, or pressure regulators, and also serves the connection to the on-board
  • the second circuit carrier may be, for example, a printed circuit board circuit carrier or PCB circuit carrier.
  • Circuit carriers are liquid-tight, especially oil-tight closed by the cover on one side, and by the support plate on the other side to the environment.
  • the second circuit carrier may be at least partially connected to the support plate, which is fastened to a housing structure of a transmission. As a result, a heat dissipation can be provided.
  • the bridge connections can be designed as solder bridges, which in
  • Pads are used and soldered, on the one hand to provide an attachment, and on the other hand to ensure electrical contact.
  • the bridge connections can also be designed as cold contacts, which are introduced into intended penetration areas of the circuit carriers in order to mechanically effect an electrical contact.
  • the bridge connections may be e.g. have specially shaped pin ends which are pressed into the conductor tracks.
  • the bridge connections can be designed as a combination of solder bridges and cold contacts.
  • the first circuit carrier may have an edge region along the recess, which is at least on one side based on the thickness of the
  • Circuit carrier is set back, wherein the cover can be designed as a flat plate.
  • the edge region may have an offset such that the edge region lies deeper in relation to the edge region for receiving the cover.
  • the cover may be formed as a flat printed circuit board (PCB).
  • the edge area may be offset on both sides and may be in the area of the bridge connections, e.g. the solder bridges, i. the electrical connection with the internal circuit board, be formed thinner than the region of the second circuit substrate for connecting the cover.
  • the bridge connections e.g. the solder bridges, i. the electrical connection with the internal circuit board
  • the second circuit carrier may have a smaller thickness than the first circuit carrier in the region of the terminal of the cover.
  • the first circuit carrier may comprise an electronic circuit board and the second circuit carrier may comprise a multilayer, highly compressed electronic circuit board.
  • the electronic circuit board is, for example, a printed circuit board, PCB
  • the high-density electronic circuit board is a high-density interconnect circuit board, HDI-PCB. This makes it possible to reduce the area of the much more expensive and expensive high-density printed circuit board, i. of the second circuit substrate to be as small as possible form and insert into the first circuit substrate and to connect to this.
  • a large number of bridge connections for example solder bridges, can be combined to form a bridge bar which has a supporting structure on which the bridge connections or solder bridges are held.
  • the support structure may for example be a matrix mass, in which the bridge connections are cast in such a way that their terminal ends protrude respectively from the matrix mass.
  • the bridge connections in particular the solder bridges, can be U-shaped and compensate for thermally induced changes in length allow a change in the distance of the contacts to be connected.
  • a transmission for motor vehicles which has a transmission device, a transmission housing and a transmission control module according to one of the preceding examples.
  • the transmission device is enclosed by the transmission housing and the transmission control module is attached to the support plate on an inner side of the transmission housing. This allows the dissipation of heat energy to the mass of the transmission housing. Due to the cover a sufficient protection against the transmission oil is guaranteed.
  • Transmission control module which includes the following steps:
  • Circuit carrier can be provided as a flat and plate-shaped circuit carrier, and the connections of the second and first circuit carrier are formed as bridge connections, which penetrate end in each case in the first and second circuit carrier.
  • the bridge connections can e.g. be performed as solder bridges, which are used in solder and soldered.
  • the bridge connections can e.g. also be designed as cold contacts that provided in
  • Bridge connections for example, have specially shaped pin ends, which are pressed into the conductor tracks.
  • the bridge connections formed as solder connections, ie solder bridges, are preferably made in a common soldering process, wherein the connection of the circuit carrier to the solder bridges can be effected in particular synchronously in one operation.
  • the compounds can also be designed as cold contacts formed in one operation.
  • the first and the second circuit carrier can first be held in position relative to one another with at least two fixing pieces, in order subsequently to carry out the fastening according to step d).
  • the attachment and the connection of the electrical components on the first circuit carrier is e.g. by soldering. This can likewise be carried out in a common soldering operation, in particular synchronously.
  • soldering of the electrical components and the solder bridges can be carried out in a common operation.
  • soldering of the solder bridges can be done with vertically offset solder pot to connect different thickness circuit substrate together.
  • FIG. 1 shows a schematic section through a transmission control module according to an embodiment of the present invention.
  • Fig. 2 shows a plan view of a transmission control module according to a
  • Fig. 3 shows a section of a cross section of another
  • Fig. 4 shows in a perspective view embodiments for solder bridges according to the present invention.
  • Fig. 5 shows an embodiment of staggered solder pot for performing the solder joints according to an embodiment of the present invention.
  • Fig. 6 shows another embodiment of a transmission control module according to the present invention.
  • FIG. 7 shows a further exemplary embodiment of a transmission control module according to the present invention in connection with an exemplary embodiment for the production of a transmission control module according to the invention.
  • Fig. 8 shows an embodiment of a method for assembling a transmission control module according to the present invention.
  • FIG. 1 shows a transmission control module 10 of a motor vehicle transmission, with a circuit support device 12, a support plate 14 and a cover 16.
  • the circuit support device 12 is at least partially disposed between the support plate 14 and the cover 16 and has a first planar, plate-shaped circuit carrier 18 and a second flat,
  • plate-shaped circuit carrier 20 wherein plate-shaped also refers to the property of a certain rigidity and rigidity.
  • the first circuit carrier 18 has a recess
  • the second circuit carrier 20 is held on the support plate 14 and is completely covered by the cover 16.
  • the cover 16 is sealingly connected to the support plate 16 via the first circuit carrier 18.
  • the first and second circuit carriers 18, 20 each have a plurality of
  • the connections 26 are used as bridge connections penetrating end-to-end into the first and second circuit carriers, e.g. as solder bridges 28, formed.
  • the support plate 14 is fixed, for example, on an inner side 15 of a transmission housing 17.
  • the transmission control module 10 is then located, for example, within the transmission housing 17 of a motor vehicle transmission.
  • the attachment to the transmission housing allows heat dissipation.
  • the cover 16 ensures adequate protection against the transmission oil.
  • the first circuit carrier 18 is composed of a plurality of elements or PCB strips, the resulting impact between PCBs must be sealed separately.
  • the first circuit carrier 18 is also referred to as a module circuit carrier and the second circuit carrier 20 is an iTCU circuit carrier, which is, for example, an HDI-PCB, while the first
  • Circuit substrate 18 may be formed only as a PCB.
  • Circuit carrier 20 may be formed, for example, as a normal PCB.
  • the second circuit carrier has, for example, a plurality of electrical or electronic components.
  • the first circuit carrier 18 has, for example, further electrical components, such as a sensor
  • the electronics of the second circuit carrier 20 is protected by the cover 16.
  • the support plate 14 may for example be made of plastic or metal and, as can be seen in Fig. 2, at least partially over the first circuit carrier 18th protrude. In Fig. 2, the cover 16 is shown in dashed lines.
  • Support plate 14 can be formed with a flat adhesive 36.
  • a similar connection can also be provided for the connection between the cover 16 and the first circuit carrier 18, for example with a flat lid adhesive 38.
  • the second circuit carrier 20 can be fastened to the carrier plate 14 with a flat heat-conductive adhesive 40. As also indicated in Fig. 1, the second
  • Circuit carrier 20 a plurality of middle circuit layers, for example, Cu layers 42, and the first circuit carrier 18 may, for example, a central Cu layer 44 have.
  • Fixier Sharinge 46 may be provided which are glued, for example, over both PCB corners to subsequently make the insertion of the solder bridges 28, as well as for soldering itself.
  • the first circuit carrier 18 may have an edge region 48 along the recess 22, which is recessed at least on one side with respect to the thickness D of the circuit carrier. This is in
  • Fig. 3 shown with an offset or paragraph 50.
  • the cover 16 can then be executed as a flat plate 52. Due to the offset 50 remains sufficient space for the arrangement of the solder bridges 28, and the electronic or electrical components on the second
  • the support plate 14 has staggered areas 54 at the
  • the edge region 48 on both sides of an offset and is thinner in the region of the solder bridges than the region for connection of the cover 16.
  • the support plate 14 may be formed as a flat plate. If the
  • Cover 16 is formed as a flat plate 52, the cover 16 may be formed for example of a planar printed circuit board material (PCB).
  • PCB printed circuit board material
  • the Cover 16 may be made of plastic, metal or pure PCB base material (glass fiber, resin), or copper layers that conduct heat from inside to outside via thermal vias, ie heat transfer paths.
  • pressing elements 56 are provided to press the second circuit substrate 20 against the support plate 14 to a good
  • a plurality of solder bridges may be combined to form a bridge latch 60 having a support structure 62 on which the solder bridges are held.
  • the bridge bars can be formed both straight and L-shaped, which is indicated in Fig. 4.
  • the support structure may be a matrix mass into which the
  • soldering bridges are cast in such a way that their terminal ends protrude from the matrix mass.
  • the solder bridges can have a U-shaped form.
  • the variant is suitable, in which the solder bridges 28 protrude from the side regions 64 and then protrude downwards.
  • the solder bridges can be combined in a plurality of bars or in a common latch, as is indicated in Fig. 4 with a circumferential bridge latch 66.
  • the insertion, for example injection, of the solder bridges in a plastic bar represents a higher
  • soldering pots 68 may be provided in which individual solder pots are arranged in a height offset from each other, i. Within the solder pot is in each case a solder 70, with which the solder bridges 28 are soldered. This is shown schematically in FIG.
  • a thermally conductive cement 74 is provided between the second circuit carrier 20 and the support plate 14.
  • the interior space between the cover 16 and the circuit carriers 18, 20 can also be filled up with a plastic compound 76 or filled in, as indicated in FIG. 7.
  • the molding compound which is, for example, a plastic mass that is thermoplastic or crosslinked to thermoset or elastomer.
  • the transmission control module 10 is arranged in a molding device 80. Since the molding compound does not have to have any particular mechanical strength, since the housing is already formed by the support plate 14 and the cover 16, it is possible to work with very thin-bodied masses and with one
  • Mold material are sealed, or it is applied to seal a film or a closure plate to safely prevent ingress of oil.
  • the molding compound is used in addition to the heat dissipation and the fixation of the components.
  • FIG. 8 shows a method 100 for assembling a
  • Transmission control module in which first, in a first step 110, a first planar, plate-shaped circuit carrier is provided with a recess. Subsequently, insertion 112 of a second flat, plate-shaped circuit carrier takes place in the recess. Subsequently, an arrangement 114 of a plurality of connections takes place for connecting the second circuit carrier to the first circuit carrier. Thereafter, provision and attachment 116 of a plurality of electrical components on the first circuit carrier takes place. Subsequently, an arrangement 118 of the first and the second circuit carrier takes place between a carrier plate and a cover completely covering the second circuit carrier, wherein the second circuit carrier is held on the carrier plate and wherein the cover is sealingly connected to the carrier plate via the first circuit carrier.
  • the first and second circuit carriers are provided as planar and plate-shaped circuit carriers, and the connections of the second and first circuit carriers are formed as bridge connections, which penetrate into the first and second circuit carriers at the ends.
  • the bridge connections can be formed as solder bridges and the electrical components can be soldered, the solder bridges and the soldering e.g. be executed in a joint operation.
  • solder bridge connection or the provision of the electrical components can be done in different orders.
  • the solder joints are made in a common soldering, for example synchronously.
  • the electrical connection between the first and the second circuit carrier takes place by cold contacts, which can be arranged individually or combined to form bars.
  • the cold contacts are specially shaped pin ends that are pressed into the PCB and produce a secure electrical connection without soldering.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Transmission Device (AREA)
  • Combinations Of Printed Boards (AREA)
  • General Details Of Gearings (AREA)

Abstract

La présente invention concerne un module de commande de transmission (10) d'une transmission de véhicule automobile, le module de commande de transmission comprenant un dispositif de support de circuit (12), une plaque porteuse (14) et une couverture (16), le dispositif de support de circuit étant disposé au moins en partie entre la plaque porteuse et la couverture. Le dispositif de support de circuit présente au moins un premier support de circuit (18) et un deuxième support de circuit (20), le premier support de circuit disposant d'un évidement (22) et le deuxième support de circuit étant disposé dans l'évidement. Le deuxième support de circuit est complètement recouvert par la couverture et la couverture est reliée de manière étanche à la plaque porteuse par l'intermédiaire du premier support de circuit. Le premier et le deuxième support de circuit présentent respectivement une pluralité de points de contact (24) qui sont reliés par une pluralité de liaisons (26). Pour mettre à disposition une configuration facile à produire et fiable du point de vue étanchéité d'un dispositif de commutation, le premier et le deuxième support de circuit sont conçus plans et en forme de plaque, et les liaisons du deuxième et du premier support de circuit sont formées avec des liaisons de pontage qui pénètrent à chaque fois d'un côté dans le premier et le deuxième support de circuit, par exemple des ponts de soudure (28).
EP12755994.6A 2011-10-25 2012-09-03 Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant Withdrawn EP2772122A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011085172A DE102011085172A1 (de) 2011-10-25 2011-10-25 Getriebesteuermodul mit Lötbrücken oder Kaltkontakten zwischen eingesetztem Schaltungsträger und umgebendem Schaltungsträger
PCT/EP2012/067083 WO2013060513A1 (fr) 2011-10-25 2012-09-03 Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant

Publications (1)

Publication Number Publication Date
EP2772122A1 true EP2772122A1 (fr) 2014-09-03

Family

ID=46800194

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12755994.6A Withdrawn EP2772122A1 (fr) 2011-10-25 2012-09-03 Module de commande de transmission comprenant des ponts brasés ou des contacts froids entre le support de circuit inséré et le support de circuit environnant

Country Status (5)

Country Link
EP (1) EP2772122A1 (fr)
JP (1) JP2014531009A (fr)
CN (1) CN103891419B (fr)
DE (1) DE102011085172A1 (fr)
WO (1) WO2013060513A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012222180B4 (de) 2012-12-04 2024-07-18 Robert Bosch Gmbh Superflaches Getriebesteuermodul
DE102013215645A1 (de) * 2013-08-08 2015-02-12 Siemens Aktiengesellschaft Elektrisches Modul mit Substrat, Halbleiterbauelement und Leiterplatte
DE102014211763A1 (de) * 2014-06-18 2015-12-24 Robert Bosch Gmbh Steuerungsmodul mit thermisch verformbarem Ausgleichsbereich
DE102014223835A1 (de) * 2014-11-21 2016-05-25 Robert Bosch Gmbh Getriebesteuermodul für den Einsatz in einem kontaminierenden Medium, TCU-Baugruppe zur Verwendung in einem solchen Getriebesteuermodul und Verfahren zur Herstellung eines solchen Getriebesteuermodules
DE102014224033A1 (de) * 2014-11-25 2016-05-25 Robert Bosch Gmbh Elektronikmodul, insbesondere für Kfz-Getriebesteuergerät, mit Presskontakt-Sandwich-Modul-Technik
DE102015208529B3 (de) * 2015-02-10 2016-08-04 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zu deren Herstellung
DE102015205445A1 (de) * 2015-03-25 2016-09-29 Robert Bosch Gmbh Getriebesteuergerät für ein Getriebe eines Fahrzeugs
DE102015219466A1 (de) * 2015-10-08 2017-04-13 Robert Bosch Gmbh Getriebesteuermodul für ein Kraftfahrzeug
US10028411B2 (en) * 2016-07-26 2018-07-17 Continental Automotive Systems, Inc. Electronic controller with laser weld sealed housing
EP3302009B1 (fr) * 2016-09-30 2023-03-01 Napatech A/S Carte d'extension avec système de refroidissement commun

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535705A1 (de) 1995-09-26 1997-03-27 Bosch Gmbh Robert Doppelt kaschierte Leiterplatte mit mehreren Anschlußflächen
TW379469B (en) * 1998-10-29 2000-01-11 Acer Peripherals Inc Electric circuit board connector and the method
DE102004061818A1 (de) * 2004-12-22 2006-07-06 Robert Bosch Gmbh Steuermodul
DE102005002813B4 (de) * 2005-01-20 2006-10-19 Robert Bosch Gmbh Steuermodul
DE102005015717A1 (de) 2005-03-31 2006-10-05 Robert Bosch Gmbh Elektrische Schaltungsanordung
DE102007032593B3 (de) * 2007-07-12 2008-11-13 Continental Automotive Gmbh Steuervorrichtung
US7618283B1 (en) * 2008-04-23 2009-11-17 Tyco Electronics Corporation Bridge connector for connecting circuit boards

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2013060513A1 *

Also Published As

Publication number Publication date
JP2014531009A (ja) 2014-11-20
CN103891419B (zh) 2018-03-30
DE102011085172A1 (de) 2013-04-25
WO2013060513A1 (fr) 2013-05-02
CN103891419A (zh) 2014-06-25

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