WO2020043341A1 - Module électronique et son procédé de fabrication - Google Patents

Module électronique et son procédé de fabrication Download PDF

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Publication number
WO2020043341A1
WO2020043341A1 PCT/EP2019/066012 EP2019066012W WO2020043341A1 WO 2020043341 A1 WO2020043341 A1 WO 2020043341A1 EP 2019066012 W EP2019066012 W EP 2019066012W WO 2020043341 A1 WO2020043341 A1 WO 2020043341A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
contact pins
component
printed circuit
strip
Prior art date
Application number
PCT/EP2019/066012
Other languages
German (de)
English (en)
Inventor
Holger Braun
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN201980056431.0A priority Critical patent/CN112586095A/zh
Publication of WO2020043341A1 publication Critical patent/WO2020043341A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Definitions

  • the invention relates to an electronic module, in particular for
  • Transmission control unit can be used in a motor vehicle, and a method for manufacturing an electronic module.
  • Electronic modules are used to build circuits in which various electrical and / or electronic components are interconnected. With the help of components connected in this way, this can be done
  • Electronic module provide certain functionalities.
  • transmission control modules are used to control functions of a transmission in a motor vehicle.
  • simple components such as resistors,
  • an electronic module can also have sensors, for example, for states within the gearbox to be controlled or to measure in an environment, and / or have plugs in order, for example, to be able to electrically connect the electronic module or parts thereof to external circuits.
  • the components can be arranged on a circuit board.
  • Sensitive components of an electronic module should be protected against damage from mechanical loads and damage from an attack by chemically aggressive substances.
  • the components can be encapsulated, for example, in a protective compound which covers a surface of the circuit board carrying the components.
  • the Protective mass can be made of plastic, for example a thermoset,
  • Epoxy resin especially a polymer, e.g. Epoxy resin.
  • contact pins can be provided on the circuit board, which protrude through a protective layer of protective compound covering the circuit board.
  • DE 10 2015 214 311 A1 describes an electronic module with a component that can be placed flexibly via a base element and a method for producing the same.
  • DE 10 2017 210 176 Al describes another electronic module.
  • DE 10 2016 209 488 A1 describes a further electronics module with a clamp connection for a transmission control unit.
  • Embodiments of the present invention can advantageously enable an electronic module, which is particularly suitable for a
  • Transmission control device can be used to provide and manufacture, in which a plurality of contact pins can be arranged closely adjacent to one another and is accessible and contactable from outside a layer of protective compound and which is simple, reliable and / or inexpensive to manufacture.
  • an electronic module According to a first aspect of the invention, an electronic module
  • the first component is arranged on an assembly side of the printed circuit board and electrically contacted with it.
  • the contact pins contact the component side of the circuit board electrically with one end on the circuit board side.
  • the protective compound can be processed in liquid form and then hardened and covers the component side of the printed circuit board as a protective layer such that the first component is encapsulated in the protective compound and the contact pins are laterally surrounded by the protective compound and a
  • the electronic module is characterized in that the contact pins are arranged next to one another in a holding bar, which mechanically contacts all the contact pins in such a way that the contact pins are held on the holding bar and are positioned relative to one another by the holding bar.
  • a second aspect of the invention relates to a method for producing an electronic module which has the features described above.
  • the process is characterized in that the contact pins of the
  • Electronic module are arranged next to each other in a holding bar and the holding bar mechanically contacts all contact pins such that the contact pins are held on the holding bar and are positioned relative to each other by the holding bar.
  • printed circuit boards including components mounted thereon, can be encapsulated using an encapsulated one
  • Contact pins can pass through the protective compound from the component side of the circuit board, so that they can be contacted from the outside.
  • the contact pins can be applied to the protective compound
  • the contact pins are usually soldered to the component side in advance.
  • the contact pins may have a widened base for this purpose, which can be soldered flat to contact areas on the component side.
  • the protective compound can then be applied so that it covers the components to be protected and is laterally adjacent to the contact pins or surrounds it, with an end of the contact pins remote from the printed circuit board projecting outward beyond the protective compound and thus being freely accessible.
  • the protective compound can then be cured.
  • the circuit board, together with the protective compound is usually placed in an oven, for example one
  • the circuit board including the protective compound can have a low overall height, so that the furnace used can be designed to save space as much as possible.
  • a volume in which the printed circuit boards are to be accommodated for heating in the furnace can be flat.
  • Ends of the contact pins remote from the circuit board are attached to further components and / or externally accessible plugs.
  • Their electrically conductive connections can be electrically connected to the ends of the contact pins, for example by soldering, connecting or preferably
  • the multiple contact pins are to be arranged in advance in a special holding strip which mechanically holds the contact pins suitably positioned relative to one another.
  • the retaining strip can then be arranged together with the contact pins held therein on the component side of the printed circuit board and the contact pins electrically with the
  • PCB are connected, for example by soldering. This can preferably be done during the manufacture of the electronic module before the protective compound is applied to the component side of the circuit board in order to Form protective layer. If the protective composition is then applied, it can surround the support strip or lie close to it, so that the
  • the elongated contact pins can have a greater length, preferably a length more than twice or even more than four times as long as their maximum cross-sectional dimension.
  • the contact pins can have small cross-sectional dimensions, i.e. in the case of round contact pins have a small diameter in comparison to their length, so that many contact pins can be arranged next to one another on a small partial area of the component side of the printed circuit board. In particular they need
  • Contact pins do not have a widened foot, which is otherwise conventionally used to ensure that the long, thin contact pins can be attached to their feet with sufficient mechanical hold on the printed circuit board without bending sideways under load. Instead, the contact pins can be thin over their entire length and, for example, constant ones
  • Such contact pins are simple and inexpensive to manufacture. The contact pins can then on one
  • circuit board side and / or in an area further away from the circuit board side end in the holding bar and held by the latter, among other things, against lateral bending.
  • next adjacent contact pins are smaller, preferably less than half as large or even less than a quarter as large, as a length of the
  • the contact pins can be very close
  • the retaining strip being able to ensure correct positioning and / or sufficient spacing between adjacent contact pins.
  • the retaining strip can be embedded in the protective compound in such a way that the protective compound adjoins an area of the retaining strip on the circuit board side and an area of the retaining strip remote from the circuit board protrudes from the protective compound.
  • the protective compound can surround the holding strip on the side and reach it to the side.
  • the protective layer formed from the protective compound can, however, have a smaller thickness than the height of the holding strip, so that the holding strip extends away from the printed circuit board Protective layer survives.
  • the retaining bar can thus be accessible from the outside, similarly to the contact pins accommodated therein, so that the retaining bar can be coupled, for example, to other components of the electronic module.
  • the electronics module can have at least one second component, which is electrically connected to the end remote from the printed circuit board of at least one of the contact pins, in particular is welded.
  • the second component can be a sensor, for example, which protrudes from the circuit board in order to be able to measure local physical parameters.
  • the second component can be, for example, a plug that can be contacted from the outside, for example in order to be able to establish an electrical connection with external sensors or other circuits.
  • the second component can have a similar or greater overall height than the printed circuit board with the protective compound applied to it.
  • the second component can optionally be retrofitted, i.e. after the circuit board with the
  • protective compound and the protective compound has hardened are connected to the ends of the contact pins remote from the circuit board.
  • metallic contact connections of the second component can be welded to the contact pins in an electrically conductive manner, in particular laser-welded. Accordingly, when the protective compound is hardened in an oven used for this purpose, no additional installation space is required for the second
  • the second component can have, at least in one contact area, a counter bar, which interacts mechanically with the retaining bar in order to fix the second component to the retaining bar.
  • the counter bar and the holding bar can each be designed geometrically in such a way that they can be coupled to one another in a force-locking and / or positive manner.
  • the counter strip can be the second component and / or components protruding therefrom, such as electrical lines or
  • the electronics module can also have a chip protection cover which covers areas of the contact pins remote from the circuit board.
  • the chip protection cover can in particular cover areas of the contact pins which would be exposed without the chip protection cover and on which, for example, electrically conductive metal chips come into contact with the contact pins and could short-circuit them with one another.
  • the chip protection cover can be coupled to the retaining strip and / or the counter strip, that is to say it can be fixed to the latter. Together with the retaining strip and / or the counter strip, the chip protection cover can then enclose a volume in which the contact pins are received in such a way that no chips, which have a critical size that would be sufficient to short-circuit adjacent contact pins, enter the enclosed volume can.
  • the volume does not necessarily have to be hermetically sealed, i.e. a fluid such as gear oil can possibly penetrate the volume past the chip protection cover.
  • the retaining strip and the counter strip or the chip protection cover can be geometrically designed in such a way that a labyrinth seal is formed on a contact surface on which the retaining strip interacts with the counter strip or the chip protection cover.
  • the labyrinth seal can be designed in such a way that chips with the above-mentioned critical size can no longer pass through them into the volume covered by the chip protection cover.
  • the retaining strip, the counter strip and / or the chip protection cover can be any suitable material.
  • Plastic components in particular injection molded components. Such plastic components can be produced simply and inexpensively and with sufficient precision for the respective component.
  • Fig. 1 shows a perspective cross-sectional view through a
  • Fig. 2 shows a perspective top view of one with a second
  • Fig. 3 shows a perspective cross-sectional view through with a
  • Chip protection cover provided electronic module according to the invention.
  • FIG. 4 shows a longitudinal sectional view through an electronic module according to the invention provided with a chip protection cover.
  • the electronic module 1 shows a cross-sectional view through an electronic module 1 according to an embodiment of the present invention.
  • the electronic module 1 comprises a printed circuit board 3, on the component side 7 of which one or preferably several components 5 (for the sake of simplicity only shown extremely schematically) are arranged.
  • the components 5 can be electrically connected to electrically conductive structures (not explicitly shown), for example conductor tracks on the printed circuit board 3.
  • These conductive structures can in turn be connected to contact pins 9, by means of which contacting to other components or contacting in the form of a plug that can be achieved from the outside can be created.
  • the contact pins 9 are arranged in a holding strip 17 which mechanically holds the contact pins 9 and positions them closely adjacent to one another.
  • the contact pins 9 are significantly longer both as their diameter and as a distance between the next adjacent contact pins 9.
  • the contact pins 9 can preferably be accommodated in the holding strip 17, aligned parallel to one another.
  • the holding bar 17 can be a simple one
  • contact pins 9 can be extrusion-coated with electrically insulating plastic.
  • a plurality of contact pins 9 can be mounted together in the holding strip 17 by arranging the holding strip 17 on the component side 7 of the printed circuit board 3 and then ends 13 of the contact pins 9 on the printed circuit board side with associated ones
  • Contact areas on the circuit board 3 are electrically connected, for example soldered.
  • the protective compound 11 covers the components 5 and thus encapsulates them.
  • the retaining strip 17 has a greater height, which is in particular greater than the thickness of the protective layer formed by the protective compound 11, so that the protective compound 11 adjoins an area of the retaining strip 17 on the circuit board side, an area of the retaining strip remote from the printed circuit board 17, however, protrudes upward from the protective compound 11 and is thus exposed.
  • FIG. 2 shows a perspective view of an electronic module 1, in which the printed circuit board 3 has been connected to a second component 19.
  • the second component can be, for example, an additional printed circuit board, a lead frame or the like with components fitted thereon.
  • the second component 19 can also be a sensor, a mating connector or the like.
  • the second component 19 can be coupled to the holding bar 17 via a counter bar 21. It can be arranged in the counter bar 21
  • Contact terminals 25 electrically contact the contact pins 9 received in the holding strip 17 at their ends 15 remote from the printed circuit board and with them in particular be welded.
  • a load-bearing mechanical coupling between the printed circuit board 3 and the second component 19 preferably does not predominantly take place via the contact connections 25 connected to the contact pins 9, but is instead established by a suitable mechanical coupling between the holding strip 17 and the counter strip 21.
  • FIG. 3 shows a cross-sectional view through an electronics module 1, which is connected via its retaining bar 17 to the counter bar 21 of a second component 19.
  • Fig. 4 shows a longitudinal sectional view through a similar
  • the counter bar 21 and the holding bar 17 are geometrically designed in such a way that they can be coupled to one another simply, reliably and with sufficient mechanical strength.
  • the counter bar 21 and the holding bar 17 can be clipped together.
  • a holding element 27 possibly provided on the holding strip 17 can, for example, be provided in a holding element 21 provided in the counter strip 21
  • Engage recess 29 to stabilize a mechanical connection between the holding bar 17 and the counter bar 21 so that forces acting on the second component 19, the electrical connection between the
  • a chip protection cover 23 is provided. This chip protection cover 23 can
  • the chip protection cover 23 can also cover the contact connections 25.
  • the chip protection cover 23 can, like the holding strip 17 and the counter strip 21, consist of an electrically insulating plastic material and can be, for example, a simple injection-molded component.
  • the chip protection cover 23, the holding strip 17 and the counter strip 21 can be designed geometrically in such a way that a labyrinth seal forms at a transition between these components.
  • Labyrinth seal is a way into the interior of the volume covered by the chip protection cover 23 so that it is curved in a labyrinthine manner that no elongated ones Metal chips can get through. However, fluids such as, in particular, the transmission oil can still get through this labyrinth seal.
  • Figs. 5 (a) and (b) are longitudinal sections through possible configurations of the electronic module 1 and in particular through its holding strip 17.
  • the holding strip 17 can be designed with openings 31 through which the contact pins 9 run with a certain lateral play.
  • the contact pins 9 are only held on the rest of the retaining strip 17 via a web 33.
  • the contact pins 9 are roughly positioned in the holding bar 17, but can still be shifted slightly laterally when mounting the holding bar 17 before they are then soldered with their end 13 on the circuit board side, for example with a contact surface 35 on the component side 7 of the printed circuit board 3.
  • the holding strip 17, as shown in FIG. 5 (b), can tightly enclose the contact pins 9 and thus position them firmly.
  • the contact pins 9 can be pressed into narrow openings in the holding bar 17 or can be cast directly during the manufacture of the holding bar 17.
  • Embodiments of the invention relate to a mechanical and electrical connection of discrete components in an electronic module, preferably for a transmission control for an automatic transmission.
  • the invention is particularly advantageous for the connection of plug connectors, sensor modules, etc. with many electrical conductors to be joined.
  • Known electronic modules contain, among other things, a control unit with electrical components for signal processing, power electronics and discrete components such as sensors for detecting position and speed, electrical interfaces, for example in the form of plug connections, and at least one plug connection for connection to the vehicle wiring harness.
  • Some of the electronic modules are installed under gear oil and are exposed to high temperatures (e.g. -40 ... + 150 ° C) in the gear unit. For this reason, the design of control modules should meet various requirements, such as helping to avoid chemical attack by aggressive oil, as well as providing good temperature and vibration resistance and protection against short circuits caused by metal chips.
  • the position of discrete components is usually specified by a construction of the gear. As a rule, this position lies outside a level of the control device.
  • An electrical conductor is required for the electrical connection to the control unit. This can e.g. a cable, a lead frame or a flexible film.
  • a support is required for mechanical positioning and fixation in the room. This can e.g. be a plastic body.
  • the electrical conductor and the mechanical support can be combined in one assembly or component and are referred to below as
  • control units and discrete components such as sensor domes are manufactured in separate production steps. These components are then assembled. Methods such as soldering, welding and plug connections are used for electrical contacting.
  • Embodiments of the invention can be used particularly advantageously for a new module platform for control modules with a polymer protection system from the applicant.
  • the electronic components are placed on a substrate such as arranged on a circuit board and then enclosed with liquid polymer that hardens later.
  • the component In order to get as many printed circuit boards as possible in the curing process, for example in an oven, the component should be as flat as possible. An assembly of a sensor dome or another discrete component should take place after the polymer has hardened.
  • embodiments of the invention can be used in others
  • One of the objects of the invention is to provide a simpler and therefore cheaper connection between e.g. To be able to manufacture control unit and discrete components such as sensors and connectors.
  • connection created with embodiments of the electronic module described here is mechanically very robust. In particular, in comparison to pins soldered directly into printed circuit boards, it is robust when subjected to vibrations and thermal changes.
  • Conductor sections may be necessary. Electrical contact points are a quality risk in operation and increase the manufacturing costs due to the required processes.
  • Embodiments of the invention are particularly advantageous when a large number of connections have to be made, as is the case with plugs and sensor modules as discrete components.
  • the manufacture of the discrete components / assemblies is usually independent of the actual PCB production. In this way, the cheapest design, supplier and production method can be selected for each assembly.
  • PCB PCB
  • a contact pin or pin is soldered onto a printed circuit board (FR4, HDI, 7) of the control device.
  • a resin e.g. epoxy resin
  • a contact surface of a contact connection of the discrete component is placed on the end face and a permanent electrical connection is preferably created by laser welding.
  • any number of contact pins can be placed in one or more rows in a very confined space.
  • the contact surfaces of the discrete component can be punched out of a metal board.
  • the contact pins can be assembled on the circuit board by being embedded with or without play in a plastic retaining strip on the
  • the component side of the circuit board can be arranged and then soldered and cast with resin.
  • a metal plate of the discrete component can be extrusion-coated with plastic as chip protection, for example in the form of an extrusion-coated lead frame.
  • This plastic can engage in the plastic retaining strip.
  • Another chip protection cover can be arranged above and protects and separates the individual pins from one another.
  • the second component can be thermally riveted, for example, with its extrusion-coated lead frame fixed to the plastic holding strip or to the printed circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un module électronique (1) et un procédé de sa fabrication. Le module électronique (1) comporte une carte à circuit imprimé (3), un premier composant (5) qui est disposé sur une face d'équipement (7) de la carte à circuit imprimé (3) et qui est en contact électrique avec celle-ci, une pluralité de broches (9) de contact oblongues conductrices de l'électricité, qui sont respectivement en contact électrique avec la face d'équipement (7) de la carte à circuit imprimé (3) par une extrémité (13) côté carte à circuit imprimé, et une masse de protection (11) électriquement isolante, qui peut être traitée sous forme liquide et ensuite durcie et qui recouvre ainsi la face d'équipement (7) de la carte (3) à circuit imprimé, en ce que le premier composant (5) est encapsulé dans la masse de protection (11) et les broches de contact (9) sont entourées latéralement par la masse de protection (11) et une extrémité (15) des broches de contact (9) éloignée de la carte de circuit imprimé dépasse de la masse de protection (11), Le module électronique (1) est caractérisé en ce que les broches de contact (9) sont disposées les unes à côté des autres dans une barre de maintien (17) qui est en contact mécanique avec toutes les broches de contact (9) de telle sorte que les broches de contact (9) sont maintenues sur la barre de maintien (17) et sont positionnées les unes par rapport aux autres par la barre de maintien (17).
PCT/EP2019/066012 2018-08-27 2019-06-18 Module électronique et son procédé de fabrication WO2020043341A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980056431.0A CN112586095A (zh) 2018-08-27 2019-06-18 电子模块及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018214474.5 2018-08-27
DE102018214474.5A DE102018214474A1 (de) 2018-08-27 2018-08-27 Elektronikmodul und Verfahren zum Fertigen desselben

Publications (1)

Publication Number Publication Date
WO2020043341A1 true WO2020043341A1 (fr) 2020-03-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/066012 WO2020043341A1 (fr) 2018-08-27 2019-06-18 Module électronique et son procédé de fabrication

Country Status (3)

Country Link
CN (1) CN112586095A (fr)
DE (1) DE102018214474A1 (fr)
WO (1) WO2020043341A1 (fr)

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DE102015214311A1 (de) 2015-07-29 2017-02-02 Robert Bosch Gmbh Elektronikmodul mit über Sockelelement flexibel platzierbarem Bauelement und Verfahren zum Fertigen desselben
DE102016209488A1 (de) 2016-05-31 2017-11-30 Robert Bosch Gmbh Elektronikmodul mit Klemmverbindung für Getriebesteuergerät
US20170354048A1 (en) * 2016-06-07 2017-12-07 Cummins Inc. Plugin-pod for electronic control unit
DE102017210176A1 (de) 2017-06-19 2018-12-20 Robert Bosch Gmbh Elektronikmodul

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DE102007002749B3 (de) * 2007-01-18 2008-04-10 Siemens Ag Modularer Steckeraufbau
DE102015219076A1 (de) * 2015-10-02 2017-04-06 Robert Bosch Gmbh Elektronikmodulanordnung für ein Getriebesteuermodul und Getriebesteuermodul

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