DE102005011393A1 - Gasdrucksensor - Google Patents
Gasdrucksensor Download PDFInfo
- Publication number
- DE102005011393A1 DE102005011393A1 DE200510011393 DE102005011393A DE102005011393A1 DE 102005011393 A1 DE102005011393 A1 DE 102005011393A1 DE 200510011393 DE200510011393 DE 200510011393 DE 102005011393 A DE102005011393 A DE 102005011393A DE 102005011393 A1 DE102005011393 A1 DE 102005011393A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- gas pressure
- housing
- pressure sensor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003990 capacitor Substances 0.000 abstract description 102
- 239000000758 substrate Substances 0.000 abstract description 86
- 239000012528 membrane Substances 0.000 abstract description 17
- 230000004044 response Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 25
- 230000001070 adhesive effect Effects 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000010273 cold forging Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/069—Protection against electromagnetic or electrostatic interferences
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Measuring Fluid Pressure (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-69026 | 2004-03-11 | ||
| JP2004069026A JP2005257442A (ja) | 2004-03-11 | 2004-03-11 | 圧力センサ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102005011393A1 true DE102005011393A1 (de) | 2005-09-29 |
Family
ID=34909392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200510011393 Withdrawn DE102005011393A1 (de) | 2004-03-11 | 2005-03-11 | Gasdrucksensor |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7168325B2 (https=) |
| JP (1) | JP2005257442A (https=) |
| CN (1) | CN100390517C (https=) |
| DE (1) | DE102005011393A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3912400B2 (ja) * | 2004-03-30 | 2007-05-09 | 株式会社デンソー | 圧力センサ |
| JP4835353B2 (ja) * | 2006-09-27 | 2011-12-14 | 株式会社デンソー | 圧力センサ |
| JP4840288B2 (ja) * | 2006-11-14 | 2011-12-21 | 株式会社デンソー | 燃料噴射装置及びその調整方法 |
| DE102007034416A1 (de) * | 2007-07-20 | 2009-01-22 | Läpple AG | Gasdruckfeder mit Messmittel sowie Einrichtung und Verfahren zur Überwachung zumindest einer innerhalb und/oder an einer Gasdruckfeder auftretenden physikalischen Messgröße |
| US8028584B2 (en) * | 2007-08-20 | 2011-10-04 | Denso Corporation | Pressure sensor and method for manufacturing the same |
| JP4893669B2 (ja) * | 2008-03-18 | 2012-03-07 | 株式会社デンソー | 圧力センサ |
| US8286496B2 (en) * | 2009-02-17 | 2012-10-16 | Nagano Keiki Co., Ltd. | Fluid pressure sensor incorporating flexible circuit board |
| JP5154495B2 (ja) * | 2009-04-03 | 2013-02-27 | 株式会社日本自動車部品総合研究所 | 燃料噴射弁及び燃料噴射弁の内部電気接続方法 |
| PL2312290T3 (pl) * | 2009-10-16 | 2020-06-01 | First Sensor Mobility Gmbh | Czujnik ciśnienia i jego zastosowanie w zbiorniku płynu |
| JP5761113B2 (ja) * | 2012-04-25 | 2015-08-12 | 日本精機株式会社 | 圧力検出装置及びその生産方法 |
| JP6427881B2 (ja) * | 2014-01-22 | 2018-11-28 | 株式会社デンソー | チャージアンプ内蔵型燃焼圧センサ |
| CN104807486B (zh) * | 2015-02-06 | 2017-05-10 | 纳米新能源(唐山)有限责任公司 | 气动传感器 |
| CN105043658A (zh) * | 2015-06-19 | 2015-11-11 | 宁波南车时代传感技术有限公司 | 空调用压力传感器 |
| CN105548608A (zh) * | 2016-01-22 | 2016-05-04 | 缪雪峰 | 一种用于微气流检测的磁电传感器 |
| CN107044899A (zh) * | 2017-02-22 | 2017-08-15 | 深圳市芯易邦电子有限公司 | 气压传感器 |
| US11143563B2 (en) | 2017-02-24 | 2021-10-12 | Hitachi Automotive Systems, Ltd. | Pressure detection device with noise resistant pressure sensor |
| KR101769881B1 (ko) | 2017-04-14 | 2017-08-21 | 장동주 | 절연 버킷이 구비된 압력계 |
| CN108196090A (zh) * | 2017-12-27 | 2018-06-22 | 中国航天空气动力技术研究院 | 一种无人机嵌入式大气数据传感系统 |
| CN108871664B (zh) * | 2018-06-26 | 2024-01-19 | 成都英鑫光电科技有限公司 | 气压测量装置及系统 |
| CN108801542B (zh) * | 2018-06-26 | 2024-03-26 | 成都英鑫光电科技有限公司 | 气压测量装置及系统 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371030A (ja) * | 1989-08-10 | 1991-03-26 | Nec Corp | 圧力センサーチップの接着方法 |
| US5386730A (en) * | 1992-06-25 | 1995-02-07 | Nippondenso Co., Ltd. | Pressure sensor having a sealed water-resistant construction |
| JP2982561B2 (ja) * | 1993-06-29 | 1999-11-22 | 株式会社村田製作所 | チップ貫通コンデンサ |
| JPH0714345U (ja) * | 1993-08-19 | 1995-03-10 | エヌオーケー株式会社 | 圧力センサ |
| JPH10148590A (ja) * | 1996-11-19 | 1998-06-02 | Mitsubishi Electric Corp | 圧力検出装置 |
| JPH1144600A (ja) * | 1997-07-28 | 1999-02-16 | Matsushita Electric Works Ltd | 圧力センサ |
| JP2000028459A (ja) * | 1998-07-14 | 2000-01-28 | Fuji Koki Corp | 圧力センサ |
| CN2400795Y (zh) * | 1999-12-23 | 2000-10-11 | 王洪业 | 离子束溅射沉积薄膜压力传感器 |
| JP2002350257A (ja) * | 2001-05-24 | 2002-12-04 | Denso Corp | 圧力センサ |
| JP3752444B2 (ja) * | 2001-11-16 | 2006-03-08 | 株式会社日立製作所 | 圧力検出装置 |
| JP2003294557A (ja) * | 2002-04-03 | 2003-10-15 | Denso Corp | 圧力センサの製造方法 |
-
2004
- 2004-03-11 JP JP2004069026A patent/JP2005257442A/ja active Pending
-
2005
- 2005-03-10 US US11/075,663 patent/US7168325B2/en not_active Expired - Fee Related
- 2005-03-11 DE DE200510011393 patent/DE102005011393A1/de not_active Withdrawn
- 2005-03-11 CN CNB2005100547419A patent/CN100390517C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1667388A (zh) | 2005-09-14 |
| JP2005257442A (ja) | 2005-09-22 |
| US20050199068A1 (en) | 2005-09-15 |
| CN100390517C (zh) | 2008-05-28 |
| US7168325B2 (en) | 2007-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R005 | Application deemed withdrawn due to failure to request examination |
Effective date: 20120313 |