DE10193439T1 - Poliermaschine zum Polieren der Umfangsfläche einer dünnen Scheibe - Google Patents

Poliermaschine zum Polieren der Umfangsfläche einer dünnen Scheibe

Info

Publication number
DE10193439T1
DE10193439T1 DE10193439T DE10193439T DE10193439T1 DE 10193439 T1 DE10193439 T1 DE 10193439T1 DE 10193439 T DE10193439 T DE 10193439T DE 10193439 T DE10193439 T DE 10193439T DE 10193439 T1 DE10193439 T1 DE 10193439T1
Authority
DE
Germany
Prior art keywords
polishing
peripheral surface
thin disc
polishing machine
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10193439T
Other languages
English (en)
Inventor
Katsuo Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000248818A external-priority patent/JP2002079446A/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE10193439T1 publication Critical patent/DE10193439T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE10193439T 2000-08-18 2001-08-17 Poliermaschine zum Polieren der Umfangsfläche einer dünnen Scheibe Withdrawn DE10193439T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000248818A JP2002079446A (ja) 2000-06-21 2000-08-18 薄板の周縁研磨装置
PCT/JP2001/007100 WO2002016076A1 (fr) 2000-08-18 2001-08-17 Dispositif de meulage des bords peripheriques d'une feuille

Publications (1)

Publication Number Publication Date
DE10193439T1 true DE10193439T1 (de) 2003-10-02

Family

ID=18738655

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10193439T Withdrawn DE10193439T1 (de) 2000-08-18 2001-08-17 Poliermaschine zum Polieren der Umfangsfläche einer dünnen Scheibe

Country Status (4)

Country Link
US (1) US6913526B2 (de)
KR (1) KR100490684B1 (de)
DE (1) DE10193439T1 (de)
WO (1) WO2002016076A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102206B2 (en) * 2003-01-20 2006-09-05 Matsushita Electric Industrial Co., Ltd. Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device
JP4116583B2 (ja) * 2004-03-24 2008-07-09 株式会社東芝 基板処理方法
JP4072522B2 (ja) * 2004-07-12 2008-04-09 エルピーダメモリ株式会社 半導体装置及びその製造方法
JP2008236380A (ja) * 2007-03-20 2008-10-02 Sony Corp 鍵提供システム、端末装置、及び情報処理方法
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
CN112276747A (zh) * 2020-09-21 2021-01-29 李宁军 一种汽车铝合金轮毂旋压设备
CN112589502A (zh) * 2020-11-18 2021-04-02 衡阳市群立新科机械有限公司 一种气模锻造件用倒角装置及其使用方法
CN112917300A (zh) * 2021-03-03 2021-06-08 台州石磊工贸有限公司 倒角机
CN115446605B (zh) * 2022-09-22 2023-12-26 苏州励沣实业有限公司 一种洁净板制造加工系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686796A (en) * 1970-07-02 1972-08-29 Bausch & Lomb Multiple head lens processing machine
JPS62236666A (ja) 1986-04-02 1987-10-16 Kobe Steel Ltd 押湯等の切除ロボツト装置
GB8816182D0 (en) * 1988-07-07 1988-08-10 Berkshire Ophthalmic Lab Ltd Method & apparatus for grinding lenses
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
JP2876572B2 (ja) 1991-11-28 1999-03-31 株式会社東京精密 半導体ウエハの面取方法
JPH06262505A (ja) * 1993-03-11 1994-09-20 Daito Shoji Kk 面取り砥石車及びそれを用いた面取り加工装置
US5626511A (en) * 1994-10-03 1997-05-06 National Optronics, Inc. Combination lens edger, polisher, and safety beveler, tool therefor and use thereof
JPH09174402A (ja) * 1995-12-22 1997-07-08 Nitomatsuku Ii R Kk ノッチ付ワークの外周面研削装置
JPH1133888A (ja) * 1997-07-24 1999-02-09 Super Silicon Kenkyusho:Kk ウェーハの鏡面面取り装置
EP0945216A3 (de) * 1998-03-25 2002-07-17 Unova U.K. Limited Kerben-Schleifwerkzeug
JPH11320363A (ja) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
US6306016B1 (en) * 2000-08-03 2001-10-23 Tsk America, Inc. Wafer notch polishing machine and method of polishing an orientation notch in a wafer

Also Published As

Publication number Publication date
US20020164934A1 (en) 2002-11-07
WO2002016076A1 (fr) 2002-02-28
KR100490684B1 (ko) 2005-05-19
KR20020043636A (ko) 2002-06-10
US6913526B2 (en) 2005-07-05

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