DE10131887A1 - Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket - Google Patents

Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket

Info

Publication number
DE10131887A1
DE10131887A1 DE10131887A DE10131887A DE10131887A1 DE 10131887 A1 DE10131887 A1 DE 10131887A1 DE 10131887 A DE10131887 A DE 10131887A DE 10131887 A DE10131887 A DE 10131887A DE 10131887 A1 DE10131887 A1 DE 10131887A1
Authority
DE
Germany
Prior art keywords
multilayer
steel sheet
plate
mpa
partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10131887A
Other languages
German (de)
English (en)
Inventor
Dieter Backhaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE10131887A priority Critical patent/DE10131887A1/de
Priority to CNB028133137A priority patent/CN100361809C/zh
Priority to DE10292952T priority patent/DE10292952D2/de
Priority to HK04107075.9A priority patent/HK1064329B/xx
Priority to AU2002354732A priority patent/AU2002354732A1/en
Priority to JP2003510472A priority patent/JP4064344B2/ja
Priority to DE50209237T priority patent/DE50209237D1/de
Priority to EP02750821A priority patent/EP1401636B1/de
Priority to PCT/DE2002/002418 priority patent/WO2003004717A2/de
Priority to KR1020037016590A priority patent/KR100601539B1/ko
Publication of DE10131887A1 publication Critical patent/DE10131887A1/de
Priority to US10/749,280 priority patent/US6986950B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/262—Partition plates or sheets for separating several laminates pressed simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/30—Foil or other thin sheet-metal making or treating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/30—Foil or other thin sheet-metal making or treating
    • Y10T29/301—Method
    • Y10T29/302—Clad or other composite foil or thin metal making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12632—Four or more distinct components with alternate recurrence of each type component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
    • Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Press Drives And Press Lines (AREA)
  • Fuel Cell (AREA)
DE10131887A 2001-07-04 2001-07-04 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket Withdrawn DE10131887A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE10131887A DE10131887A1 (de) 2001-07-04 2001-07-04 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket
JP2003510472A JP4064344B2 (ja) 2001-07-04 2002-07-03 分離板又は多層プレスセットのための分離板の製造方法
DE10292952T DE10292952D2 (de) 2001-07-04 2002-07-03 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpresspaket
HK04107075.9A HK1064329B (en) 2001-07-04 2002-07-03 Partition plate and method for producing a partition plate for a multi-layer pressed stack
AU2002354732A AU2002354732A1 (en) 2001-07-04 2002-07-03 Partition plate and method for producing a partition plate for a multi-layer pressed stack
CNB028133137A CN100361809C (zh) 2001-07-04 2002-07-03 多层板压合板叠的分隔板及其制造方法
DE50209237T DE50209237D1 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket
EP02750821A EP1401636B1 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket
PCT/DE2002/002418 WO2003004717A2 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket
KR1020037016590A KR100601539B1 (ko) 2001-07-04 2002-07-03 다층 압축 적층판용 격리판과 다층 압축 적층판용 격리판의 제조방법
US10/749,280 US6986950B2 (en) 2001-07-04 2003-12-31 Partition or method for producing a partition for a multilayer pressed packet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10131887A DE10131887A1 (de) 2001-07-04 2001-07-04 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket

Publications (1)

Publication Number Publication Date
DE10131887A1 true DE10131887A1 (de) 2003-01-23

Family

ID=7690248

Family Applications (3)

Application Number Title Priority Date Filing Date
DE10131887A Withdrawn DE10131887A1 (de) 2001-07-04 2001-07-04 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket
DE50209237T Expired - Lifetime DE50209237D1 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket
DE10292952T Expired - Fee Related DE10292952D2 (de) 2001-07-04 2002-07-03 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpresspaket

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE50209237T Expired - Lifetime DE50209237D1 (de) 2001-07-04 2002-07-03 Trennblech bzw. verfahren zur herstellung eines trennbleches für ein multilayerpresspaket
DE10292952T Expired - Fee Related DE10292952D2 (de) 2001-07-04 2002-07-03 Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpresspaket

Country Status (8)

Country Link
US (1) US6986950B2 (enExample)
EP (1) EP1401636B1 (enExample)
JP (1) JP4064344B2 (enExample)
KR (1) KR100601539B1 (enExample)
CN (1) CN100361809C (enExample)
AU (1) AU2002354732A1 (enExample)
DE (3) DE10131887A1 (enExample)
WO (1) WO2003004717A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005034499B4 (de) * 2005-07-20 2011-03-31 Wickeder Westfalenstahl Gmbh Presspaketaufbau zum Verpressen von Multilayern bzw. Presse zur Verpressung bzw. Herstellung von Multilayern
DE102007054171A1 (de) * 2007-02-28 2008-09-04 Backhaus, Monika Press- und Heizsystem zum Verpressen eines Multilayerpresspaketes
JP4383493B2 (ja) * 2007-08-17 2009-12-16 新日本製鐵株式会社 ７８０ＭＰａ以上のＴＳを持つハイテン出荷鋼板の材質情報提供方法及び材質情報利用方法
RU2524892C2 (ru) * 2012-11-22 2014-08-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ изготовления деталей машин с получением субмикро- и наноструктурированного состояния диффузионного приповерхностного слоя при азотировании
CN103118494B (zh) * 2013-01-29 2015-09-16 苏州市嘉明机械制造有限公司 用于线路板压合制程电压机压合的镜板
CN104202927A (zh) * 2014-09-12 2014-12-10 高德（无锡）电子有限公司 一种软硬结合半成品印刷线路板的生产工艺
CN104955279B (zh) * 2015-05-22 2017-12-29 苏州市嘉明机械制造有限公司 一种高强度防凹陷镜板的生产工艺
CN105517334A (zh) * 2015-12-10 2016-04-20 苏州市嘉明机械制造有限公司 一种基于含浸工艺的高强度绝缘镜板的生产工艺
KR102424298B1 (ko) * 2016-09-29 2022-07-25 다이니폰 인사츠 가부시키가이샤 증착 마스크 곤포체 및 증착 마스크 곤포 방법
DE102017102940B4 (de) * 2017-02-14 2026-01-22 Bundesdruckerei Gmbh Vorrichtung zum Laminieren von mehreren in einem Stapel angeordneten Schichten zu einem Laminatverbund
CN111278221A (zh) * 2020-02-21 2020-06-12 盐城维信电子有限公司 一种快压隔板及多层快压方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3507568C2 (de) * 1985-03-04 1987-01-08 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zum Verpressen von Prepregs in einer Etagenpresse mit einer Rutschsicherung
DE3844498A1 (de) * 1988-12-30 1990-07-05 Klaus Schneider Vorrichtung zum verpressen von multilayerpaketen
DE4116543A1 (de) * 1991-05-21 1992-11-26 Siemens Nixdorf Inf Syst Verfahren zum verpressen von mehrlagigen leiterplatten
DE29719716U1 (de) * 1997-11-06 1997-12-11 Carl Aug. Picard GmbH & Co. KG, 42857 Remscheid Trennblech
DE19831461C1 (de) * 1998-07-14 2000-02-24 Dieter Backhaus Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren)
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2556897B2 (ja) * 1989-02-23 1996-11-27 ファナック株式会社 多層プリント配線板の外層材及び製造方法
CA2315177C (en) * 1998-11-04 2004-07-20 Ga-Tek Inc. (Doing Business As Gould Electronics Inc.) Component of printed circuit boards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3507568C2 (de) * 1985-03-04 1987-01-08 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zum Verpressen von Prepregs in einer Etagenpresse mit einer Rutschsicherung
DE3844498A1 (de) * 1988-12-30 1990-07-05 Klaus Schneider Vorrichtung zum verpressen von multilayerpaketen
DE4116543A1 (de) * 1991-05-21 1992-11-26 Siemens Nixdorf Inf Syst Verfahren zum verpressen von mehrlagigen leiterplatten
DE29719716U1 (de) * 1997-11-06 1997-12-11 Carl Aug. Picard GmbH & Co. KG, 42857 Remscheid Trennblech
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards
DE19831461C1 (de) * 1998-07-14 2000-02-24 Dieter Backhaus Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren)

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HUSCHKA,MANFRED: Einführung in die Multilayer- Preßtechnik. Saulgau/Württ.: Eugen G. Leuze Verlag, 1988, S. 54,57-59 *
Markenübersicht Nichtrostende Edelstähle der Fa. Böhler, Edelstahl GmbH & CoKG, S. 17,21,22 (rech. am 13.03.2002). im Internet: http://www.sten.fi/ main/suomi/kirjasto/N000DE.pdf *

Also Published As

Publication number Publication date
AU2002354732A1 (en) 2003-01-21
CN100361809C (zh) 2008-01-16
JP2004538146A (ja) 2004-12-24
US20040211494A1 (en) 2004-10-28
KR20040019311A (ko) 2004-03-05
WO2003004717A2 (de) 2003-01-16
EP1401636B1 (de) 2007-01-10
HK1064329A1 (zh) 2005-01-28
DE50209237D1 (de) 2007-02-22
WO2003004717A3 (de) 2003-05-30
EP1401636A2 (de) 2004-03-31
KR100601539B1 (ko) 2006-07-19
DE10292952D2 (de) 2004-09-09
US6986950B2 (en) 2006-01-17
JP4064344B2 (ja) 2008-03-19
CN1522197A (zh) 2004-08-18

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