CN104955279B - 一种高强度防凹陷镜板的生产工艺 - Google Patents
一种高强度防凹陷镜板的生产工艺 Download PDFInfo
- Publication number
- CN104955279B CN104955279B CN201510267648.XA CN201510267648A CN104955279B CN 104955279 B CN104955279 B CN 104955279B CN 201510267648 A CN201510267648 A CN 201510267648A CN 104955279 B CN104955279 B CN 104955279B
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- China
- Prior art keywords
- coating
- steel plate
- production technology
- high intensity
- runner plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510267648.XA CN104955279B (zh) | 2015-05-22 | 2015-05-22 | 一种高强度防凹陷镜板的生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510267648.XA CN104955279B (zh) | 2015-05-22 | 2015-05-22 | 一种高强度防凹陷镜板的生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104955279A CN104955279A (zh) | 2015-09-30 |
CN104955279B true CN104955279B (zh) | 2017-12-29 |
Family
ID=54169512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510267648.XA Active CN104955279B (zh) | 2015-05-22 | 2015-05-22 | 一种高强度防凹陷镜板的生产工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104955279B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1327885A (zh) * | 2001-06-29 | 2001-12-26 | 沈阳黎明航空发动机集团公司 | 金属表面高温防护涂层加工方法 |
US6355360B1 (en) * | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
CN1522197A (zh) * | 2001-07-04 | 2004-08-18 | D・巴克豪斯 | 多层板压合板叠的分隔板及其制造方法 |
CN1732725A (zh) * | 2002-12-27 | 2006-02-08 | C2C印刷电路板技术有限公司 | 用于生产印刷电路板元件的隔板 |
CN102674888A (zh) * | 2012-05-15 | 2012-09-19 | 深圳市爱尔创科技有限公司 | 用于牙科氧化锆陶瓷制品的着色溶液及使用方法 |
-
2015
- 2015-05-22 CN CN201510267648.XA patent/CN104955279B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6355360B1 (en) * | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
CN1327885A (zh) * | 2001-06-29 | 2001-12-26 | 沈阳黎明航空发动机集团公司 | 金属表面高温防护涂层加工方法 |
CN1522197A (zh) * | 2001-07-04 | 2004-08-18 | D・巴克豪斯 | 多层板压合板叠的分隔板及其制造方法 |
CN1732725A (zh) * | 2002-12-27 | 2006-02-08 | C2C印刷电路板技术有限公司 | 用于生产印刷电路板元件的隔板 |
CN102674888A (zh) * | 2012-05-15 | 2012-09-19 | 深圳市爱尔创科技有限公司 | 用于牙科氧化锆陶瓷制品的着色溶液及使用方法 |
Also Published As
Publication number | Publication date |
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CN104955279A (zh) | 2015-09-30 |
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TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 215000 Industrial Park, Shishe village, Linhu Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Jiaruisi Mechanical and Electrical Equipment Co.,Ltd. Address before: 215000 Jiangsu city of Suzhou province high tech Zone Hengtang Youth Industrial Park Patentee before: SUZHOU JIAMING MACHINERY MANUFACTURING Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20211223 Address after: 215000 Hengtang Youth Industrial Park, Suzhou High-tech Zone, Jiangsu Province Patentee after: SUZHOU JIAMING MACHINERY MANUFACTURING Co.,Ltd. Address before: 215000 Shi she Yi Cun Industrial Park, Linhu Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Jiaruisi Mechanical and Electrical Equipment Co.,Ltd. |