CN2814676Y - 带凹槽式基板的发光二极管封装结构 - Google Patents

带凹槽式基板的发光二极管封装结构 Download PDF

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Publication number
CN2814676Y
CN2814676Y CNU2005200839605U CN200520083960U CN2814676Y CN 2814676 Y CN2814676 Y CN 2814676Y CN U2005200839605 U CNU2005200839605 U CN U2005200839605U CN 200520083960 U CN200520083960 U CN 200520083960U CN 2814676 Y CN2814676 Y CN 2814676Y
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CN
China
Prior art keywords
emitting diode
substrate
light
groove
diode chip
Prior art date
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Expired - Fee Related
Application number
CNU2005200839605U
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English (en)
Chinese (zh)
Inventor
童胜男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen poly Photoelectric Technology Co., Ltd.
Original Assignee
MINGDA OPTOELECTRONIC (XIAMEN) CO Ltd
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Filing date
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Priority to CNU2005200839605U priority Critical patent/CN2814676Y/zh
Priority to PCT/US2006/019826 priority patent/WO2006132794A2/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CNU2005200839605U 2005-06-03 2005-06-03 带凹槽式基板的发光二极管封装结构 Expired - Fee Related CN2814676Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2005200839605U CN2814676Y (zh) 2005-06-03 2005-06-03 带凹槽式基板的发光二极管封装结构
PCT/US2006/019826 WO2006132794A2 (fr) 2005-06-03 2006-05-22 Module de dispositif electroluminescent a configuration de connexion par bossages sur un substrat de dissipation thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2005200839605U CN2814676Y (zh) 2005-06-03 2005-06-03 带凹槽式基板的发光二极管封装结构

Publications (1)

Publication Number Publication Date
CN2814676Y true CN2814676Y (zh) 2006-09-06

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Country Status (2)

Country Link
CN (1) CN2814676Y (fr)
WO (1) WO2006132794A2 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834175A (zh) * 2010-05-13 2010-09-15 江西省晶和照明有限公司 Led照明cob封装结构以及球泡
CN101958390A (zh) * 2010-08-13 2011-01-26 李刚 发光芯片封装结构
CN102082220A (zh) * 2009-11-27 2011-06-01 李学富 一种led发光二极管及其制作工艺
CN102364684A (zh) * 2011-06-17 2012-02-29 杭州华普永明光电股份有限公司 一种led模组及其制造工艺
CN102376699A (zh) * 2011-06-17 2012-03-14 杭州华普永明光电股份有限公司 一种基于陶瓷基pcb板的led模组及其制造工艺
CN102412246A (zh) * 2011-06-17 2012-04-11 杭州华普永明光电股份有限公司 一种基于金属基pcb板的led模组及其制造工艺
CN102447018A (zh) * 2010-10-12 2012-05-09 柏腾科技股份有限公司 基板与散热结构的结合改良及其方法
CN110391350A (zh) * 2019-07-29 2019-10-29 云谷（固安）科技有限公司 显示面板以及显示装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120061695A1 (en) * 2009-03-24 2012-03-15 Kang Kim Light-emitting diode package
KR101144351B1 (ko) * 2010-09-30 2012-05-11 서울옵토디바이스주식회사 웨이퍼 레벨 발광다이오드 패키지 및 그 제조방법
CN104124216A (zh) * 2014-07-03 2014-10-29 天水华天科技股份有限公司 一种基板片式载体csp封装件及其制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1464953A (zh) * 2001-08-09 2003-12-31 松下电器产业株式会社 Led照明装置和卡型led照明光源

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102082220A (zh) * 2009-11-27 2011-06-01 李学富 一种led发光二极管及其制作工艺
CN101834175A (zh) * 2010-05-13 2010-09-15 江西省晶和照明有限公司 Led照明cob封装结构以及球泡
CN101834175B (zh) * 2010-05-13 2015-07-15 中节能晶和照明有限公司 Led照明cob封装结构以及球泡
CN101958390A (zh) * 2010-08-13 2011-01-26 李刚 发光芯片封装结构
CN102447018A (zh) * 2010-10-12 2012-05-09 柏腾科技股份有限公司 基板与散热结构的结合改良及其方法
CN102364684A (zh) * 2011-06-17 2012-02-29 杭州华普永明光电股份有限公司 一种led模组及其制造工艺
CN102376699A (zh) * 2011-06-17 2012-03-14 杭州华普永明光电股份有限公司 一种基于陶瓷基pcb板的led模组及其制造工艺
CN102412246A (zh) * 2011-06-17 2012-04-11 杭州华普永明光电股份有限公司 一种基于金属基pcb板的led模组及其制造工艺
CN102364684B (zh) * 2011-06-17 2017-02-08 杭州华普永明光电股份有限公司 一种led模组及其制造工艺
CN110391350A (zh) * 2019-07-29 2019-10-29 云谷（固安）科技有限公司 显示面板以及显示装置
CN110391350B (zh) * 2019-07-29 2022-08-05 云谷（固安）科技有限公司 显示面板以及显示装置

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Publication number Publication date
WO2006132794A3 (fr) 2007-04-19
WO2006132794A2 (fr) 2006-12-14

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: Fang Zhong Lu, Huli District of Xiamen City, Fujian Province, No. 2000, zip code: 362000

Patentee after: Mingda Optoelectronic (Xiamen) Co., Ltd.

Address before: Room 106, Pioneer Building, Pioneer Park, Xiamen, Fujian, Xiamen Province, China: 362000

Patentee before: Mingda Optoelectronic (Xiamen) Co., Ltd.

ASS Succession or assignment of patent right

Owner name: XIAMEN JUYING OPTO-ELECTRICAL TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: MINGDA PHOTOELECTRIC (XIAMEN) CO., LTD.

Effective date: 20090522

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20090522

Address after: The first Gilbert Nanku District Dongdu Huli District of Xiamen city of Fujian Province, No. two base layer, zip code: 361009

Patentee after: Xiamen poly Photoelectric Technology Co., Ltd.

Address before: Fang Zhong Lu, Huli District of Xiamen City, Fujian Province, No. 2000, zip code: 361009

Patentee before: Mingda Optoelectronic (Xiamen) Co., Ltd.

CU03 Correction of utility model patent gazette

Correction item: Patentee

Correct: Xiamen Joywin Photoelectric Technology Co., Ltd.

False: Xiamen poly Photoelectric Technology Co., Ltd.

Number: 26

Page: 962

Volume: 25

ERR Gazette correction

Free format text: CORRECT: PATENTEE; FROM: XIAMEN JUYING OPTO-ELECTRICAL TECHNOLOGY CO., LTD. TO: XIAMEN JUYING OPTO-ELECTRICAL SCIENCE CO., LTD.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060906

Termination date: 20110603