CN2785043Y - 可更换记忆晶片的记忆卡 - Google Patents

可更换记忆晶片的记忆卡 Download PDF

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CN2785043Y
CN2785043Y CNU2005200282803U CN200520028280U CN2785043Y CN 2785043 Y CN2785043 Y CN 2785043Y CN U2005200282803 U CNU2005200282803 U CN U2005200282803U CN 200520028280 U CN200520028280 U CN 200520028280U CN 2785043 Y CN2785043 Y CN 2785043Y
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资重兴
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Abstract

本实用新型公开了一种可更换记忆晶片的记忆卡，包括一电路基板，在板面设有控制晶片、晶片接电部及对外接电部，并于电路基板外设有一封装体，使电路基板的对外接电部露出封装体一边侧面，并令该封装体形成有至少一容置槽，在容置槽中设有一插座，插座内部的导接体一端与电路基板的晶片接电部构成电性连接，藉此组成记忆晶片可任意置入插座中与插座导接体、晶片接电部及对外接电部形成电性连接导通的记忆卡，实现节约成本、升级更换记忆晶片的效果。

Description

可更换记忆晶片的记忆卡
技术领域
本实用新型涉及一种可更换记忆晶片的记忆卡，特别涉及一种可插设于各式数字电子产品作为储存装置的记忆卡。
背景技术
请参阅图7、图8所示，习知的记忆卡结构，如MMC、RSMMC、SD、miniSD记忆卡等，通常具有一电路基板10，于电路基板10一面边缘处设有数个外接电部101，也称金手指，并于该电路基板10选定面固设有记忆晶片20及一控制晶片30，藉此使用复数导线40电性连接于记忆晶片20及电路基板10间，以及控制晶片30与电路基板10之间；藉此再于该记忆晶片20及控制晶片30面实施一封胶体50，可利用该封胶体50外型结构直接形成外接电部101外露的记忆卡，如图7、图9所示；或另外制成二个形封装胶壳60、60’，包覆住电路基板10、记忆晶片20及电路基板10等，如图8所示，使外接电部101外露于一封装胶壳60的边缘处，即组装成可插设于各式数字电子产品作为储存装置的记忆卡。
上述习知的记忆卡结构，在全部构装完成后，即不能再任意更换记忆晶片20，随着科技的日新月异，使用者或电子档案对于记忆装置容量或储取速度的需求增加时，该记忆卡往往已不敷使用，或记忆卡发生瑕疵时，将导致全部废弃该记忆卡，而另外选购新卡的浪费结果，并因此增加使用者的经济负担。
实用新型内容
本实用新型的目的是要解决上述习知的记忆卡结构，在全部构装完成后，即不能再任意更换记忆晶片的问题，而提供一种可克服上述缺点的可更换记忆晶片的记忆卡。
本实用新型包括有：
一电路基板，在一板面设有控制晶片、电路、电子元件及复数晶片接电部，于另一板面边缘处设有复数对外接电部；
一封装体，该封装体以封胶材料一体成型于电路基板的控制晶片及晶片接电部该面构成，电路基板的对外接电部形成外露，并于封装体中设有一容置槽对应晶片接电部，晶片接电部位于容置槽底；
一插座，该插座是固设于封装体的容置槽构成，具有复数导接体可与记忆晶片导接，各导接体并延伸有一导接部与电路基板的晶片接电部构成电性连接，藉此组成记忆晶片可任意拆卸更换的记忆卡。
所述的封装体可为二胶壳包覆住电路基板二面相结合构成，并于其中一胶壳设有容置槽对应所述晶片接电部，使该晶片接电部位于容置槽底，且于另一胶壳设有镂空部，使电路基板的外接电部外露于镂空部。
所述的插座是由一底座及一封盖构成，该底座为形胶壳，于内部设有复数导接体，导接体的导接部延伸于底座的底面与电路基板晶片接电部构成电性连接；而封盖枢设于底座上用来开启或封闭底座。
所述的电路基板的控制晶片可为未封装的晶片固设于电路基板，并以数个金属质导线电性连接于控制晶片及电路基板间构成，也可为已封装的晶片焊接于电路基板构成；该晶片接电部可为电路基板板面形成可导接的复数电路接点所构成。
本实用新型还可以具有下述构造：其具有：
一电路基板，在一板面设有控制晶片、电路、电子元件及构成为导接弹片状的复数晶片接电部，于另一板面边缘处设有复数对外接电部；
一封装体，该封装体包覆电路基板，于封装体中设有一横式插槽，以及供电路基板的对外接电部外露的镂空部，使电路基板的对外接电部露出于该镂空部，而其导接弹片状的复数晶片接电部延伸于该横式插槽中，藉此，组成记忆晶片可任意插入封装体的横式插槽中，使记忆晶片与导接弹片状的复数晶片接电部形成电性连接的记忆卡。
本实用新型藉以记忆卡构装结构的改良，实现内部记忆晶片可任意置换升级功能，进一步获得维修及升级成本降低的效果。
附图说明
图1为本实用新型封胶材料封装成记忆卡的立体图。
图2为本实用新型封胶材料封装成记忆卡的剖视图。
图3为本实用新型二胶壳封装成记忆卡的立体图。
图4为本实用新型二胶壳封装成记忆卡的剖视图。
图5为本实用新型记忆卡另一实施例的立体图。
图6为本实用新型记忆卡另一实施例的剖视图。
图7为习知封胶材料封装成记忆卡的剖视图。
图8为习知二胶壳封装成记忆卡的剖视图。
图9为习知记忆卡外观示意图。
具体实施方式
请参阅图1、图2、图3、图4所示，本实用新型是一种可插设于各式数字电子产品作为储存装置，特别可简易更换内部记忆晶片的记忆卡，主要包括有一电路基板1、一封装体2、2A及一插座3，其中，请参阅图2、图4所示，电路基板1可为一电路板，在一板面选定处设有控制晶片11、电路、电子元件及复数晶片接电部12，其中的电子元件包含被动元件及主动元件，于另一板面边缘处设有复数对外接电部13，即金手指结构；控制晶片11可为未封装的晶片固设于电路基板1，并以数个金属质导线14电性连接于控制晶片11及电路基板1间构成，也可为已封装的晶片焊接于电路基板1构成，如图4所示；该晶片接电部12可为电路基板1板面形成可导接的复数电路接点所构成；
请参阅图1、图2所示，封装体2、2A可为封胶材料一体成型于电路基板1的控制晶片11及晶片接电部12该面构成，使电路基板1的对外接电部13形成外露，并于封装体2中设有一容置槽21对应晶片接电部12，使晶片接电部12位于容置槽21底；请参阅图3、图4所示，也可为二胶壳22A、23A包覆住电路基板1二面相黏合构成，该黏合方式为超声波熔接，并于其中一胶壳22A设有容置槽21A对应所述晶片接电部12，使该晶片接电部12位于容置槽21A底，且于另一胶壳23A设有镂空部24A，使电路基板1的外接电部13可外露与其它数字电子产品作电性连接；
请参阅图2、图4所示，插座3是固设于封装体2、2A的容置槽21、21A中，是由一底座31及一封盖32构成，该底座31可为形胶壳，于内部底面设有复数导接体311，该导接体311可为金属弹片、金属块或锡球等导电材料构成，导接体311的导接部312延伸于底座31的底面与电路基板1的晶片接电部12构成电性连接，例如焊接或弹性接触均可；而封盖32枢设于底座31上用来开启或封闭底座31的板片。
藉上述电路基板1、封装体2、2A及插座3结构特征及组装关系，即能组成可更换记忆晶片的饿记忆卡，使用者可任意掀开插座3的封盖32，如图1、图3所示，将一封装记忆晶片20置入插座3中，使记忆晶片20以导线架或电路板所构成的接电部201与导接体311接触，并与电路基板1的控制晶片11、晶片接电部12及对外接电部13形成电性连接导通，即可使记忆卡插接于各式数字电子产品作为储存装置。藉此达成内部记忆晶片20可任意置换升级功能，以进一步获得维修及升级成本降低的效果。
请参阅图5、图6所示，电路基板1的晶片接电部12’也可构成为固设于电路基板1上的导接弹片结构；且于电路基板1外设有一封装体2B包覆，于封装体2B中设有一横式插槽25B，以及供电路基板1的对外接电部13外露的镂空部24B，使电路基板1的对外接电部13露出于该镂空部24B，而其导接弹片结构的晶片接电部12’延伸于该横式插槽25B中，也能组成可更换记忆晶片20的记忆卡，使记忆晶片20的接电部201与电路基板1的晶片接电部12’导接应用。而封装体2B构成方式，也可为封胶材料一体成型构成，或使用二胶壳22B、23B组成，并不局限。

Claims (5)

1、一种可更换记忆晶片的记忆卡，其特征在于：其包括有：
一电路基板，在一板面设有控制晶片、电路、电子元件及复数晶片接电部，于另一板面边缘处设有复数对外接电部；
一封装体，该封装体以封胶材料一体成型于电路基板的控制晶片及晶片接电部该面构成，电路基板的对外接电部形成外露，并于封装体中设有一容置槽对应晶片接电部，晶片接电部位于容置槽底；
一插座，该插座是固设于封装体的容置槽构成，具有复数导接体可与记忆晶片导接，各导接体并延伸有一导接部与电路基板的晶片接电部构成电性连接。
2、按照权利要求1所述的一种可更换记忆晶片的记忆卡，其特征在于：所述的封装体为二胶壳包覆住电路基板二面相结合构成，并于其中一胶壳设有容置槽对应所述晶片接电部，该晶片接电部位于容置槽底，且于另一胶壳设有镂空部，电路基板的外接电部外露于镂空部。
3、按照权利要求1所述的一种可更换记忆晶片的记忆卡，其特征在于：所述的插座是由一底座及一封盖构成，该底座为凵形胶壳，于内部设有复数导接体，导接体的导接部延伸于底座的底面与电路基板晶片接电部构成电性连接；而封盖枢设于底座上用来开启或封闭底座。
4、按照权利要求1所述的一种可更换记忆晶片的记忆卡，其特征在于：所述的电路基板的控制晶片为未封装的晶片固设于电路基板，并以数个金属质导线电性连接于控制晶片及电路基板间构成，或为已封装的晶片焊接于电路基板构成；该晶片接电部为电路基板板面形成可导接的复数电路接点所构成。
5、一种可更换记忆晶片的记忆卡，其特征在于：其包括有：
一电路基板，在一板面设有控制晶片、电路、电子元件及构成为导接弹片状的复数晶片接电部，于另一板面边缘处设有复数对外接电部；
一封装体，该封装体包覆电路基板，于封装体中设有一横式插槽，以及供电路基板的对外接电部外露的镂空部，电路基板的对外接电部露出于该镂空部，而其导接弹片状的复数晶片接电部延伸于该横式插槽中，记忆晶片可任意插入封装体的横式插槽中，记忆晶片与导接弹片状的复数晶片接电部形成电性连接。
CNU2005200282803U 2005-02-18 2005-02-18 可更换记忆晶片的记忆卡 Expired - Fee Related CN2785043Y (zh)

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CN109411439A (zh) * 2018-09-29 2019-03-01 江苏芯力特电子科技有限公司 一种内嵌式芯片载体

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CN113539349B (zh) * 2021-07-23 2024-05-28 曙光信息产业股份有限公司 一种测试基板、llcr测量方法及测试基板测试方法
CN116610347B (zh) * 2023-05-23 2024-03-08 润芯微科技(江苏)有限公司 一种利用u盘升级车载芯片的方法

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