CN2658949Y - 影像感测器的薄膜覆晶封装结构 - Google Patents
影像感测器的薄膜覆晶封装结构 Download PDFInfo
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- CN2658949Y CN2658949Y CNU2003201026504U CN200320102650U CN2658949Y CN 2658949 Y CN2658949 Y CN 2658949Y CN U2003201026504 U CNU2003201026504 U CN U2003201026504U CN 200320102650 U CN200320102650 U CN 200320102650U CN 2658949 Y CN2658949 Y CN 2658949Y
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- image sensing
- image sensor
- flip chip
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- -1 PI) Polymers 0.000 description 1
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Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2003201026504U CN2658949Y (zh) | 2003-11-07 | 2003-11-07 | 影像感测器的薄膜覆晶封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2003201026504U CN2658949Y (zh) | 2003-11-07 | 2003-11-07 | 影像感测器的薄膜覆晶封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN2658949Y true CN2658949Y (zh) | 2004-11-24 |
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Application Number | Title | Priority Date | Filing Date |
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CNU2003201026504U Expired - Lifetime CN2658949Y (zh) | 2003-11-07 | 2003-11-07 | 影像感测器的薄膜覆晶封装结构 |
Country Status (1)
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CN (1) | CN2658949Y (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100442496C (zh) * | 2006-08-01 | 2008-12-10 | 南茂科技股份有限公司 | 补强型薄膜覆晶封装构造 |
CN105744130A (zh) * | 2016-03-12 | 2016-07-06 | 宁波舜宇光电信息有限公司 | 摄像模组及其感光组件和制造方法 |
CN111935384A (zh) * | 2020-08-28 | 2020-11-13 | 昆山丘钛微电子科技有限公司 | 一种感光组件、摄像模组、终端设备及制备方法 |
CN115312548A (zh) * | 2021-05-05 | 2022-11-08 | 胜丽国际股份有限公司 | 非回焊式感测镜头 |
US11743569B2 (en) | 2016-03-12 | 2023-08-29 | Ningbo Sunny Opotech Co., Ltd. | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof |
-
2003
- 2003-11-07 CN CNU2003201026504U patent/CN2658949Y/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100442496C (zh) * | 2006-08-01 | 2008-12-10 | 南茂科技股份有限公司 | 补强型薄膜覆晶封装构造 |
CN105744130A (zh) * | 2016-03-12 | 2016-07-06 | 宁波舜宇光电信息有限公司 | 摄像模组及其感光组件和制造方法 |
CN105744130B (zh) * | 2016-03-12 | 2019-10-18 | 宁波舜宇光电信息有限公司 | 摄像模组及其感光组件和制造方法 |
US11743569B2 (en) | 2016-03-12 | 2023-08-29 | Ningbo Sunny Opotech Co., Ltd. | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof |
CN111935384A (zh) * | 2020-08-28 | 2020-11-13 | 昆山丘钛微电子科技有限公司 | 一种感光组件、摄像模组、终端设备及制备方法 |
CN115312548A (zh) * | 2021-05-05 | 2022-11-08 | 胜丽国际股份有限公司 | 非回焊式感测镜头 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: QIBANG SCI-TECH CO., LTD. Free format text: FORMER OWNER: INTERNATIONAL SEMICONDUCTOR TECHNOLOGY LTD. Effective date: 20110525 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: KAOHSIUNG EXPORT PROCESSING ZONE, TAIWAN, CHINA TO: NO. 3, LI-HSIN 5TH ROAD, EAST DISTRICT, HSINCHU CITY, HSINCHU SCIENCE AND INDUSTRIAL PARK, TAIWAN, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110525 Address after: Taiwan, China Hsinchu science and Technology Industrial Park, Hsinchu East Road, No. five, No. 3 Patentee after: Chipbond Technology Corporation Address before: China Taiwan Kaohsiung processing export zone Patentee before: International Semiconductor Technology Ltd. |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20131107 Granted publication date: 20041124 |