WO2021227352A1 - Led显示模组、led显示屏及led显示模组的制造方法 - Google Patents

Led显示模组、led显示屏及led显示模组的制造方法 Download PDF

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Publication number
WO2021227352A1
WO2021227352A1 PCT/CN2020/121041 CN2020121041W WO2021227352A1 WO 2021227352 A1 WO2021227352 A1 WO 2021227352A1 CN 2020121041 W CN2020121041 W CN 2020121041W WO 2021227352 A1 WO2021227352 A1 WO 2021227352A1
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display module
led display
led
led chip
layer
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PCT/CN2020/121041
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English (en)
French (fr)
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孙天鹏
张金刚
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深圳市洲明科技股份有限公司
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Publication of WO2021227352A1 publication Critical patent/WO2021227352A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • This application relates to the technical field of display screens, in particular to an LED display module and an LED display screen.
  • LED display screens are developing towards higher definition and more perfect picture quality.
  • LED indoor small-pitch display has begun to develop from the original P1.0 or higher pitch products to P1.0 or lower.
  • the display clarity has been a qualitative leap.
  • Mini-LED display technology is mainly used. At present, according to the technical classification in this field, it is divided into surface mount technology SMD products, and PCB integrated packaging Mini-LED COB display products.
  • Mini-LED COB display refers to a display product in which the chip adopts flip-chip LED chips, the chip size is less than 300 ⁇ m on both sides of the chip, and the PCB substrate is used as the display carrier of the integrated package. According to different substrate materials, it can also be expanded to COG and COF. As the spacing shrinks, Mini-LED COB display products have better advantages in terms of reliability, manufacturing cost and display effect, and become the most popular technology in the industry at this stage.
  • An aspect of the present application provides an LED display module, including an LED chip, a filling layer is arranged around the LED chip, and an adhesive layer is covered at a position where the LED chip is not provided with the filling layer, and the adhesive layer is far away An optical film layer is provided on one side of the LED chip.
  • Another aspect of the present application provides an LED display screen, which includes the above-mentioned LED display module.
  • Another aspect of the present application provides a method for manufacturing an LED display module, including: assembling an LED chip on a light board; performing underfill processing on the LED chip to form a filling layer around the LED chip; and pasting the adhesive layer to the optical On the film layer; and attach the optical film layer with the adhesive layer to the surface of the LED chip.
  • FIG. 1 is a cross-sectional view of an LED display module according to an embodiment.
  • FIG. 2 is a manufacturing method of an LED display module according to an embodiment of the application.
  • LED chip 1. LED chip; 2. Filling layer; 3. Adhesive layer; 4. Optical film layer; 5. Light board; 6. Driver IC.
  • the glue used in this method is generally epoxy, silica gel or silicone resin type thermosetting material, and the glue is cured by heating by a mold press or directly by heating in an oven.
  • This method can solve the chip protection problem, it also has better water vapor protection performance.
  • the packaging process often requires high-temperature heating, generally at 80-150°C. The time varies from 1h to 8h. The high temperature experienced for a long time after the chip is die-bonded will have a serious impact on the overall system reliability of the module.
  • materials such as epoxy, silica gel or silicone resin
  • chemical reactions occur due to internal chemical bonds, which will cause shrinkage and expansion, resulting in stress on the packaging surface, resulting in problems such as lamp board warpage and chip structure damage.
  • An idea of the present application is that a filling layer is provided around the LED chip, and the position where the LED chip is not provided with the filling layer covers the adhesive layer. Both the filling layer and the adhesive layer can be made of normal temperature curing materials, and the reliability of the product is good.
  • an LED display module including an LED chip 1, a filling layer 2 is provided around the LED chip 1, and a position where the LED chip 1 is not provided with the filling layer 2 is covered with The adhesive layer 3 is provided with an optical film layer 4 on one side of the adhesive layer 3 away from the LED chip 1.
  • the beneficial effects of some embodiments of the present application are: the filling layer can protect the LED chip, block water and oxygen, and ensure the module has reliable electronic performance; the adhesive layer and the optical film layer contribute to the overall LED chip Physical protection is formed to protect the LED chip from external bumps, and form an optical lens effect to enhance the display effect; the filling layer and the adhesive layer can be cured at room temperature without high temperature baking, which can greatly reduce the internal stress of the product.
  • the LED display module of the present application has a simple structure and good product reliability.
  • the thickness value of the filling layer 2 is smaller than the height value of the LED chip 1.
  • the material of the filling layer 2 is room temperature curing epoxy resin, room temperature curing silicone rubber, room temperature curing silicone resin or instant adhesive.
  • the material of the filling layer can be selected as required, as long as it can be cured under normal temperature conditions.
  • the material of the adhesive layer 3 is OCA glue.
  • the soft nature of OCA glue makes it automatically fill the gap between the LED chips, and the optical film layer can form a plane encapsulation on the surface of the module. While achieving the optical lens effect, it is the chip Provide material protection to ensure its anti-collision and anti-scratch characteristics.
  • the thickness of the adhesive layer 3 is 0.07-4 mm.
  • the thickness of the adhesive layer can be set as required.
  • the material of the optical film layer 4 is PE or PET.
  • the thickness of the optical film layer 4 is 0.02-4 mm.
  • the material and thickness of the optical film layer can be set as required.
  • it also includes a light board 5 on which the LED chip 1 is arranged.
  • the driving IC 6 is arranged on a side of the light board 5 away from the LED chip 1, and the driving IC 6 is electrically connected to the LED chip 1.
  • Another aspect of the present application provides an LED display screen, which includes the above-mentioned LED display module.
  • An embodiment of the present application provides an LED display screen, which includes an LED display module.
  • the LED display module includes LED chips 1.
  • the number of LED chips 1 can be set as required. gap.
  • a filling layer 2 is provided around the LED chip 1.
  • the material of the filling layer 2 is room temperature curing epoxy resin, room temperature curing silicone rubber, room temperature curing silicone resin or instant adhesive.
  • the thickness of the filling layer 2 The value is smaller than the height value of the LED chip 1.
  • the position of the LED chip 1 where the filling layer 2 is not provided is covered with an adhesive layer 3, and an optical film layer 4 is provided on the side of the adhesive layer 3 away from the LED chip 1.
  • the material of the adhesive layer 3 is OCA (Optically Clear Adhesive) glue, and the thickness of the adhesive layer 3 is 0.07-4 mm.
  • the material of the optical film layer 4 is PE (Polyethylene) or PET (Polyethylene terephthalate), and the thickness of the optical film layer 4 is 0.02-4 mm.
  • the LED display module further includes a light board 5 and a driving IC 6, and the LED chip 1 is arranged on the light board 5.
  • the driving IC 6 is arranged on a side surface of the light board 5 away from the LED chip 1, and the driving IC 6 is electrically connected to the LED chip 1.
  • the present invention provides a method for manufacturing the above-mentioned LED display module. Referring to FIG. 2, the method includes the following steps:
  • COB technology can be used to assemble the chip, and the LED chip can be assembled using a die-bonding device or a mass transfer device.
  • SMT technology is used to mount the driver IC to obtain the PCBA driver board.
  • normal temperature curing epoxy resin normal temperature curing silicone rubber, normal temperature curing silicone resin or instant adhesive are used, which can be cured naturally without high temperature baking.
  • the glue is dotted around the LED chip by a glue dispensing device. Using the surface tension and capillary phenomenon of the liquid, the glue will automatically fill the bottom of the LED chip and cover the sides and pads of the LED chip. After curing, the glue will form a complete cured layer to protect the circuit chip structure from water vapor erosion.
  • the adhesive layer uses OCA glue
  • the optical film layer uses engineering plastics such as PE or PET, which has functions such as optical diffusion and blackening.
  • the entire process has no high temperature process, no stress release, simple process, high production efficiency, cost savings, and improved product reliability.
  • the LED display module and LED display provided by the present application have a simple structure, good product reliability, low production cost, and high production efficiency.

Abstract

一种LED显示模组包括LED芯片(1)，LED芯片(1)的周围设有填充层(2)，LED芯片(1)未设置填充层(2)的位置覆盖有粘接层(3)，粘接层(3)远离LED芯片(1)的一侧面上设有光学膜层(4)。

Description

LED显示模组、LED显示屏及LED显示模组的制造方法 技术领域
本申请涉及显示屏技术领域，尤其涉及一种LED显示模组及LED显示屏。
背景技术
随着LED显示技术的不断发展，LED显示屏的显示效果得到了快速提升，不论是像素间距，还是显示效果都有了巨大的进步。随着5G时代的来临，以及物联网、人工智能的推广，作为交互的重要信息显示窗口，LED显示屏以其无缝拼接，大屏幕显示的技术优势，将进一步得到广泛的应用。在户内小间距领域，LED显示屏正向着更高清、更完美的画质体现发展。目前，LED户内小间距显示已经开始由原来的P1.0以上间距产品，发展到P1.0以下。显示清晰度得到了质的飞跃。而在P1.0以下间距，主要以Mini-LED显示技术为主。目前在该领域中按照技术分类，分为表面贴装技术SMD产品，和以PCB集成封装的Mini-LED COB显示产品为主。
Mini-LED COB显示屏是指芯片采用倒装LED芯片，芯片尺寸在芯片两个边均小于300μm的尺度，采用PCB基板做为集成封装的显示载板的显示产品。根据不同的基板材料也可以扩展为COG和COF等。随着间距的缩小，Mini-LED COB显示产品在可靠性、制造成本和显示效果等方面均具备更好的优势，成为现阶段行业最火爆的技术。
发明内容
本申请的一方面提供一种LED显示模组，包括LED芯片，所述LED芯片的周围设有填充层，所述LED芯片未设置填充层的位置覆盖有粘接层，所述粘接层远离LED芯片的一侧面上设有光学膜层。
本申请的另一方面提供一种LED显示屏，包括以上所述的LED显示模组。
本申请的再一方面提供一种LED显示模组的制造方法，包括：在灯板上装配LED芯片；对LED芯片进行下填充处理，在LED芯片周围形成填充层；将 粘接层粘贴到光学膜层上；以及将带有粘接层的光学膜层贴装至LED芯片的表面。
本发明的一个或多个实施例的细节在下面的附图和描述中提出。本发明的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更好地描述和说明本申请的实施例，可参考一幅或多幅附图，但用于描述附图的附加细节或示例不应当被认为是对本申请的发明创造、目前所描述的实施例或优选方式中任何一者的范围的限制。
图1为本一个实施例的LED显示模组的剖视图。
图2为本申请一个实施例的LED显示模组的制造方法。
标号说明：
1、LED芯片；2、填充层；3、粘接层；4、光学膜层；5、灯板；6、驱动IC。
具体实施方式
为详细说明本申请的技术内容、所实现目的及效果，以下结合实施方式并配合附图予以说明。
在Mini-LED显示屏模组制造过程中，一种做法是将芯片固晶装配到灯板上后，再对灯板装有LED芯片的一面进行整体胶水灌封，形成一个整体封装。该方式所采用的胶水一般为环氧、硅胶或硅树脂类热固型材料，通过模压机加热或直接用烤箱加热进行胶水固化。该方式虽然能够解决芯片防护问题，且具备较好的水汽防护性能。但其封装过程往往需要高温加热，一般温度在80～150℃。时间在1h～8h不等。芯片固晶后经历较长时间的高温，对模组整体的系统可靠性会造成严重的影响。另外环氧、硅胶或硅树脂等材料在固化过程中，由于内部化学键会发生化学反应，会导致收缩、膨胀，形成封装面应力，导致灯板翘曲和芯片结构损伤等问题。
本申请的一个构思在于：在LED芯片的周围设有填充层，LED芯片未设置 填充层的位置覆盖粘接层，填充层和粘接层均可采用常温固化材料，产品的可靠性好。
请参照图1，本申请另一方面提供一种LED显示模组，包括LED芯片1，所述LED芯片1的周围设有填充层2，所述LED芯片1未设置填充层2的位置覆盖有粘接层3，所述粘接层3远离LED芯片1的一侧面上设有光学膜层4。
从上述描述可知，本申请的一些实施例的有益效果在于：填充层可对LED芯片进行保护，阻隔水和氧，保证模组具有可靠的电子性能；粘接层和光学膜层对LED芯片整体形成物理防护，可以保护LED芯片对外界磕碰的隔绝，并形成光学透镜效果，提升显示效果；填充层和粘接层均可采用常温固化材料，无需进行高温烘烤，可大大降低产品内应力。本申请的LED显示屏模组的结构简单，产品的可靠性好。
进一步的，所述填充层2的厚度值小于所述LED芯片1的高度值。
进一步的，所述填充层2的材质为常温固化环氧树脂、常温固化硅橡胶、常温固化硅树脂或瞬干胶。
由上述描述可知，填充层的材质可以根据需要进行选择，只要在常温条件下可以固化即可。
进一步的，所述粘接层3的材质为OCA胶。
由上述描述可知，OCA胶自身的柔软特性使其可自动填充到LED芯片间的缝隙内，结合过光学膜层可在模组表面形成一个平面包封，在达到光学透镜效果的同时，为芯片提供物料防护，保障其防碰撞，防刮擦的等特性需求。
进一步的，所述粘接层3的厚度为0.07～4mm。
由上述描述可知，粘接层的厚度可以根据需要进行设置。
进一步的，所述光学膜层4的材质为PE或PET。
进一步的，所述光学膜层4的厚度为0.02～4mm。
由上述描述可知，光学膜层的材质和厚度可以根据需要进行设置。
进一步的，还包括灯板5，所述LED芯片1设置于所述灯板5上。
进一步的，还包括驱动IC6，所述驱动IC6设置于所述灯板5远离LED芯片1的一侧面上，且所述驱动IC6与所述LED芯片1电连接。
本申请的另一方面提供一种LED显示屏，包括以上所述的LED显示模组。
本申请的一个实施例提供一种LED显示屏，包括LED显示模组，LED显示模组包括LED芯片1，LED芯片1的数目可以根据需要进行设置，相邻两个LED芯片1之间设有间隙。本实施例中，LED芯片1的周围设有填充层2，填充层2的材质为常温固化环氧树脂、常温固化硅橡胶、常温固化硅树脂或瞬干胶，优选的，填充层2的厚度值小于LED芯片1的高度值。LED芯片1未设置填充层2的位置覆盖有粘接层3，粘接层3远离LED芯片1的一侧面上设有光学膜层4。粘接层3的材质为OCA(Optically Clear Adhesive)胶，且粘接层3的厚度为0.07～4mm。光学膜层4的材质为PE(Polyethylene，聚乙烯)或PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)，且光学膜层4的厚度为0.02～4mm。
本实施例中，LED显示模组还包括灯板5和驱动IC6，LED芯片1设置于灯板5上。驱动IC6设置于灯板5远离LED芯片1的一侧面上，且驱动IC6与LED芯片1电连接。
本再一方面提供一种以上所述LED显示模组的制造方法，参图2，包括如下步骤：
1、在灯板上装配LED芯片。
本实施例中，装配芯片可采用COB技术，利用固晶设备或巨量转移设备进行LED芯片的装配。在装配LED芯片之前，先采用SMT技术进行驱动IC的贴装，得到PCBA驱动板。
2、对LED芯片进行下填充处理，在LED芯片周围形成填充层。
进行填充处理时，采用的是常温固化环氧树脂、常温固化硅橡胶、常温固化硅树脂或瞬干胶，无需进行高温烘烤就可自然固化。具体的，在进行填充处理时利用点胶设备将胶液点印到LED芯片周围，利用液体的表面张力和毛细现象，胶液会自动填充到LED芯片底部及包覆LED芯片侧边及焊盘，固化后胶液会形成完整的固化层，保护电路芯片结构不受到水汽侵蚀。
3、将粘接层粘贴到光学膜层上。
本实施例中，粘接层采用OCA胶，光学膜层采用PE或PET等工程塑料， 具备光学扩散和加黑等功能。
4、将带有粘接层的光学膜层贴装至LED芯片的表面。
贴装时，可在真空状态下进行，避免产生气泡，真空度的大小可以根据需要进行设置。利用OCA胶自身的柔软特性可自动填充到LED芯片之间的缝隙内，结合光学膜层可在模组表面形成平面包封，达到光学透镜效果的同时，为LED芯片提供物料防护，保障其防碰撞，防刮擦的等特性需求。
本实施例中，整个过程无高温过程，无应力释放，过程简单生产效率高，可节约成本，又能提升产品的可靠性能。
综上所述，本申请提供的一种LED显示模组及LED显示屏，其结构简单，产品可靠性好，制作成本低，生产效率高。
以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等同变换，或直接或间接运用在相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (19)

  1. 一种LED显示模组，包括LED芯片，其特征在于，所述LED芯片的周围设有填充层，所述LED芯片未设置填充层的位置覆盖有粘接层，所述粘接层远离LED芯片的一侧面上设有光学膜层。
  2. 根据权利要求1所述的LED显示模组，其特征在于，所述填充层的厚度值小于所述LED芯片的高度值。
  3. 根据权利要求1所述的LED显示模组，其特征在于，所述填充层的材质为常温固化环氧树脂、常温固化硅橡胶、常温固化硅树脂或瞬干胶。
  4. 根据权利要求1所述的LED显示模组，其特征在于，所述粘接层的材质为OCA胶。
  5. 根据权利要求1所述的LED显示模组，其特征在于，所述粘接层的厚度为0.07～4mm。
  6. 根据权利要求1所述的LED显示模组，其特征在于，所述光学膜层的材质为PE或PET。
  7. 根据权利要求1所述的LED显示模组，其特征在于，所述光学膜层的厚度为0.02～4mm。
  8. 根据权利要求1所述的LED显示模组，其特征在于，还包括灯板，所述LED芯片设置于所述灯板上。
  9. 根据权利要求8所述的LED显示模组，其特征在于，还包括驱动IC，所述驱动IC设置于所述灯板远离LED芯片的一侧面上，且所述驱动IC与所述LED芯片电连接。
  10. 一种LED显示屏，其特征在于，包括权利要求1-9任意一项所述的LED显示模组。
  11. 一种LED显示模组的制造方法，包括：
    在灯板上装配LED芯片；
    对LED芯片进行下填充处理，在LED芯片周围形成填充层；
    将粘接层粘贴到光学膜层上；及
    将带有粘接层的光学膜层贴装至LED芯片的表面。
  12. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述填充层的厚度值小于所述LED芯片的高度值。
  13. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述填充层的材质为常温固化环氧树脂、常温固化硅橡胶、常温固化硅树脂或瞬干胶。
  14. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述粘接层的材质为OCA胶。
  15. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述粘接层的厚度为0.07～4mm。
  16. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述光学膜层的材质为PE或PET。
  17. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述光学膜层的厚度为0.02～4mm。
  18. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述对LED芯片进行下填充处理包括利用点胶设备将胶液点印到LED芯片周围。
  19. 根据权利要求11所述的LED显示模组的制造方法，其特征在于，所述将带有粘接层的光学膜层贴装至LED芯片的表面在真空状态下进行。
PCT/CN2020/121041 2020-05-13 2020-10-15 Led显示模组、led显示屏及led显示模组的制造方法 WO2021227352A1 (zh)

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