WO2023133934A1 - 一种适用于 asic 倒装技术的柔性透明 led 显示屏 - Google Patents

一种适用于 asic 倒装技术的柔性透明 led 显示屏 Download PDF

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WO2023133934A1
WO2023133934A1 PCT/CN2022/073410 CN2022073410W WO2023133934A1 WO 2023133934 A1 WO2023133934 A1 WO 2023133934A1 CN 2022073410 W CN2022073410 W CN 2022073410W WO 2023133934 A1 WO2023133934 A1 WO 2023133934A1
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transparent substrate
led display
chip technology
flexible transparent
circuit
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PCT/CN2022/073410
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English (en)
French (fr)
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汤立文
叶宗和
董宇坤
尹志安
莫春鉴
丁武
马晓鑫
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珠海华萃科技有限公司
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Publication of WO2023133934A1 publication Critical patent/WO2023133934A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Definitions

  • the application belongs to the field of LED display, and in particular relates to a flexible transparent LED display suitable for ASIC flip-chip technology.
  • ASIC application-specific integrated circuits are designed by IC designers according to specific circuit requirements, and special logic circuits are designed. After the design is completed, the design netlist is generated and handed over to the chip manufacturer for tape-out. After tape-out, the internal logic circuit is fixed, and the function of the chip is also fixed. It is suitable for designing chips with large scale and high complexity, or products with high maturity and high output, and the cost will be relatively reduced. In terms of functionality, ASIC optimizes cell logic resources according to design requirements, and achieves optimal layout and routing to reduce routing delay and CELL delay.
  • IC and RGB three primary color materials only account for 1/10 of the overall area of the lamp bead, and other areas are wasted in wiring, corner joints, packaging and other on plastic molding materials.
  • the patent application discloses a flip-chip technology suitable for ASIC.
  • the main purpose of this application is to propose a suitable ASIC flip-chip technology to solve one of the above technical problems.
  • this application provides a flexible transparent LED display suitable for ASIC flip-chip technology, directly depositing RGB lamp beads on the surface of the transparent substrate A, and flipping the IC driver chip on the surface B of the transparent substrate.
  • the yield rate of IC driver chips will not be damaged due to poor deposition of RGB.
  • the technical solution adopted by this application is to provide a flexible transparent LED display suitable for ASIC flip-chip technology, including a transparent substrate, a logic circuit is buried inside the transparent substrate, and the logic circuit extends to Both sides of the transparent substrate are outside, and the two ends of the logic circuit are respectively connected with RGB lamp beads and a driver IC, and several RGB lamp beads are combined to form a display circuit; the logic circuit and display circuit are used to connect the RGB lamps beads with the driver IC.
  • the RGB lamp bead is fixedly connected to the transparent substrate and packaged in a water- and gas-blocking manner.
  • the RGB lamp bead is fixedly connected to the transparent substrate and packaged in a water- and gas-blocking manner.
  • the transparent substrate can be one of glass, PET, PEEK, CPI, PEI, PEN, PMMA, COC, COP, PC, LSR, FEP, SMMA, GPPS, PETG or PPSU, but not limited thereto .
  • the thickness of the transparent substrate is between 9um and 3cm.
  • the thickness of the transparent substrate is preferably between 25um and 1cm.
  • the material of the logic circuit and display circuit is one of conductive materials such as gold, silver, copper, stainless steel or alloys thereof, but not limited thereto.
  • the line width of the display circuit is between 1um and 5mm; the line thickness of the display circuit is between 0.1um and 300um.
  • the line width of the display circuit is preferably between 5um and 1.5mm, and the thickness of the display circuit is preferably between 1um and 200um.
  • the display circuit and the touch control circuit are designed in grid form to enhance their invisibility.
  • the red, green and blue phosphors in the RGB lamp bead are respectively gallium arsenide, gallium phosphide and gallium nitride or doped compounds and mixtures thereof, but not limited thereto.
  • the inorganic luminescent material is disposed on the surface of the transparent substrate by evaporation method and electrically connected with the logic circuit.
  • Fig. 1 is a design concept diagram of a flexible transparent LED display suitable for ASIC flip-chip technology described in this application.
  • Figure 2 shows the design concept of a general LED bead or Mini LED display module.
  • Figure 3 shows the design concept of direct deposition of RGB on the IC driving surface (ie: RGB on IC hamburger).
  • Embodiment A flexible transparent LED display suitable for ASIC flip-chip technology, including a transparent substrate, a logic circuit and a display circuit are buried inside the transparent substrate, and the logic circuit and the display circuit extend to the outside of both sides of the transparent substrate, and the logic circuit and The two ends of the display circuit are respectively connected with RGB lamp beads and a driver IC, and several RGB lamp beads are combined to form a display circuit; the logic circuit and the display circuit are used to connect the RGB lamp beads and the driver IC.
  • the RGB lamp beads are fixedly connected to the transparent substrate and packaged in a water- and gas-blocking manner.
  • CPI, PEI, PEN, PMMA, COC, COP, PC, LSR, FEP, SMMA, GPPS, PETG or PPSU but not limited thereto.
  • the thickness of the transparent substrate is between 9um and 3cm.
  • the thickness of the transparent substrate is preferably between 25um and 1cm.
  • This embodiment uses glass as a transparent collection, and the logic circuit and display circuit material is one of the conductive materials of gold, silver, copper, stainless steel or their alloys, but not limited thereto.
  • the logic circuit and display circuit of this embodiment The material is copper material.
  • the line width of the display circuit is between 1um and 5mm; the line thickness of the display circuit is between 0.1um and 300um.
  • the line width of the display circuit is preferably between 5um and 1.5mm, and the thickness of the display circuit is preferably between 1um and 200um.
  • the display circuit and the touch control circuit are designed in grid form to enhance their invisibility.
  • the red, green and blue phosphors in the RGB lamp beads are gallium arsenide, gallium phosphide and gallium nitride or their doped compounds and mixtures respectively, but not limited thereto, this embodiment adopts Gallium arsenide, gallium phosphide and gallium nitride are used as red, green and blue phosphors in RGB lamp beads.
  • the inorganic luminescent material is disposed on the surface of the transparent substrate by evaporation method and electrically connected with the logic circuit.
  • this patent application discloses a LED or MiniLED display film stack design that is suitable for ASIC flip-chip technology, and has light and thin, simple and controllable RGB light emission. It also has the advantages of flexibility and high transparency, and is conducive to the integration of RGB
  • the miniaturization of the three primary color modules can realize the function of colorful display. At the same time, it is cheaper than the RGB on IC stack structure in Figure 3, and can even be miniaturized.
  • the RGB material is directly deposited on the transparent substrate, and the separate packaging mode has more advantages in yield. There is no need to worry about the impact of the RGB deposition yield on the The yield rate of ASIC, its size is smaller than that of LEDs with built-in IC, and the component thickness is thinner.
  • the circuit material on the transparent base is replaced by the gold wire or stainless steel wire used in the traditional wire bonding in Figure 2, and the RGB lamp beads are directly deposited on the surface of the transparent substrate A, and then the IC driver chip is flipped on the transparent film.
  • the B side of the material, and at the opposite position, the embedded circuit in the transparent substrate is connected to the interface of the RGB and the IC driver chip; finally, the A and B sides of the transparent substrate are packaged with water and gas barrier materials.
  • Figure 1 is a side view of the stacked structure of the flexible transparent LED display with the ASIC flip-chip technology of the patent invention, where the RGB lamp beads are directly deposited on the surface of the transparent substrate A, and the IC driver chip is flip-chip mounted on the surface B of the transparent substrate, inside the transparent substrate Buried lines connect the RGB lamp beads with the interface of the IC driver chip, and finally package the AB surfaces of the transparent substrate with water-blocking and gas-blocking materials.
  • this design can reduce the overall size by more than 10 times ;
  • the IC driver chip yield is not damaged due to poor deposition of RGB.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请公开了一种适用于ASIC倒装技术的柔性透明LED显示屏，属于LED现实技术领域，包括透明基板，所述透明基板内部埋设有逻辑电路，所述逻辑电路延伸至所述透明基板两侧外部，且所述逻辑电路两端分别连接有RGB灯珠以及驱动IC；所述逻辑电路用于连接所述RGB灯珠与所述驱动IC。本申请直接沉积RGB灯珠于透明基材A表面上面，IC驱动芯片倒装于透明基板B面，于透明基材内埋线路将RGB灯珠与IC驱动芯片接口进行连接，最后对透明基材的两面分别进行阻水阻气材料的封装，IC驱动芯片厚度可因为RGB驱动电路内嵌于透明基材而降低，IC驱动芯片良率不因为沉积RGB不良而损坏。

Description

一种适用于ASIC倒装技术的柔性透明LED显示屏
本申请要求于2022年01月12日提交中国专利局、申请号为202210032898.5、发明名称为“一种适用于ASIC倒装技术的柔性透明LED显示屏”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于LED显示领域，特别涉及一种适用于ASIC倒装技术的柔性透明LED显示屏。
 背景技术
专用集成电路是由IC设计人员根据特定的电路需求，设计专用的逻辑电路，在设计完成后生成设计网表，交给芯片制造厂家流片。在流片之后，内部逻辑电路就固定了，芯片的功能也就固定的。其适用于用于设计规模大，复杂度比较高的芯片，或者是成熟度高，产量比较大的产品，成本相对也会因此下降。在功能性而言，ASIC是根据设计需求，最优化cell逻辑资源，并且做到最优布局走线，降低走线延迟和CELL延时。
如下图2所示为一般的LED灯珠或是MiniLED显示模块的设计概念：IC与RGB三原色材料只占灯珠面积整体的1/10，其他区域则浪费于打线、接角、封装与其他塑胶成型材料上。
最近有个比较新的技术称为IC表面直接沉积RGB，也就是如图3所示的RGB on IC汉堡包) 叠构。但是这叠购的缺点就是需要增加IC上面的布线，且RGB沉积良率也会影响到价格昂贵的IC，同时IC的成本也跟着提升许多。
有鉴于此，本申请专利揭露一种适合ASIC倒装技术。
 技术问题
本申请的主要目的是提出一种适合ASIC倒装技术，以解决上述技术问题之一。
 技术解决方案
针对现有技术存在的问题，本申请提供了一种适用于ASIC倒装技术的柔性透明LED显示屏直接沉积RGB灯珠于透明基材A表面上面，IC驱动芯片倒装于透明基板B面，IC驱动芯片良率不因为沉积RGB不良而损坏。
为解决上述技术问题，本申请采用的技术方案是：提供一种适用于ASIC倒装技术的柔性透明LED显示屏，包括透明基板，所述透明基板内部埋设有逻辑电路，所述逻辑电路延伸至所述透明基板两侧外部，且所述逻辑电路两端分别连接有RGB灯珠以及驱动IC，若干所述RGB灯珠组合成显示电路；所述逻辑电路與显示电路用于连接所述RGB灯珠与所述驱动IC。
优选的，所述RGB灯珠与所述透明基板固定连接，且进行阻水阻气封装。
优选的，所述RGB灯珠与所述透明基板固定连接，且进行阻水阻气封装。
优选的，透明基材可为玻璃、PET、PEEK、CPI、PEI、PEN、PMMA、COC、COP、PC、LSR、FEP、SMMA、GPPS、PETG或PPSU中的一种，但不以此为限。
优选的，所述透明基板厚度介于9um到3cm之间。
进一步而言，所述透明基板厚度介于25um到1cm之间尤佳。
优选的，所述逻辑电路與显示电路材料为金、银、铜、不锈钢或其合金之导电材料中的一种，但不以此为限。
优选的，所述显示电路的线路宽度介于1um到5mm之间；所述显示电路的线路厚度介于0.1um到300um之间。
进一步而言，所述显示电路的线路宽度介于5um到1.5mm之间尤佳，所述显示电路的厚度介于1um到200um之间尤佳。
优选的，所述显示电路与所述触控电路呈网格状设计，以提升其不可视性。
优选的，所述RGB灯珠中的红绿蓝无机发光材料分别为砷化镓、磷化镓与氮化镓或是其掺杂化合物与混合物，但不以此为限。
优选的，无机发光材料使用蒸镀法设置于透明基材的表面与所述逻辑电路电性连接。
 有益效果
直接沉积RGB灯珠于透明基材表面上面，IC驱动芯片倒装于透明基板另一面，于透明基材内埋线路将RGB灯珠与IC驱动芯片接口进行连接，最后对透明基材的两面分别进行阻水阻气材料的封装，此设计可缩小整体尺寸；IC驱动芯片良率不因为沉积RGB不良而损坏。
 附图说明
图1是本申请所述的一种适用于ASIC倒装技术的柔性透明LED显示屏的设计概念图。
图2为一般的LED灯珠或是MiniLED显示模块的设计概念。
图3为IC驱动表面直接沉积RGB（即：RGB on IC汉堡包)叠构的设计概念。
 本发明的实施方式
以下通过特定的具体实施例说明本申请的具体实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本申请的优点及功效。本申请也可以其他不同的方式予以实施，即，在不背离本申请所揭示的范畴下，能予不同的修饰与改变。
实施例：一种适用于ASIC倒装技术的柔性透明LED显示屏，包括透明基板，透明基板内部埋设有逻辑电路與显示电路，逻辑电路與显示电路延伸至透明基板两侧外部，且逻辑电路與显示电路两端分别连接有RGB灯珠以及驱动IC，若干RGB灯珠组合成显示电路；逻辑电路與显示电路用于连接RGB灯珠与驱动IC。
在本实施例中，RGB灯珠与透明基板固定连接，且进行阻水阻气封装，RGB灯珠与透明基板固定连接，且进行阻水阻气封装，透明基材可为玻璃、PET、PEEK、CPI、PEI、PEN、PMMA、COC、COP、PC、LSR、FEP、SMMA、GPPS、PETG或PPSU中的一种，但不以此为限。优选的，所述透明基板厚度介于9um到3cm之间。进一步而言，所述透明基板厚度介于25um到1cm之间尤佳。
本实施例采用玻璃作为透明集采，逻辑电路與显示电路材料为金、银、铜、不锈钢或其合金之导电材料中的一种，但不以此为限，本实施例逻辑电路與显示电路材料采用铜质材料。优选的，所述显示电路的线路宽度介于1um到5mm之间；所述显示电路的线路厚度介于0.1um到300um之间。
进一步而言，所述显示电路的线路宽度介于5um到1.5mm之间尤佳，所述显示电路的厚度介于1um到200um之间尤佳。
优选的，所述显示电路与所述触控电路呈网格状设计，以提升其不可视性。
在本实施例中，RGB灯珠中的红绿蓝无机发光材料分别为砷化镓、磷化镓与氮化镓或是其掺杂化合物与混合物，但不以此为限，本实施例采用砷化镓、磷化镓与氮化镓作为RGB灯珠中的红绿蓝无机发光材料。
在本实施例中，无机发光材料使用蒸镀法设置于透明基材的表面与逻辑电路电性连接。
本申请的工作过程和工作原理如下。
有鉴于此，本申请专利揭露一种适合ASIC倒装技术，且兼具轻薄且简易可控RGB发光的LED或MiniLED显示膜叠构设计，同时拥有柔性且高透明的优势，并有利于将RGB三原色模块微小化(相较于图2)，便可实现多彩显示的功能。同时比图3的RGB on IC叠构来的更便宜，甚至可以更微小化，直接沉积RGB材料于透明基板，分开封装的模式则更具备有良率优势，无须担心RGB沉积的良率影响到ASIC的良率，其尺寸比内置IC的LEDs尺寸更小，元件厚度更薄。
本实施例将透明基上面的线路材料取代图2的传统打线所使用的金线或不锈钢线，直接沉积RGB灯珠于透明基材A表面上面，然后再将IC驱动芯片倒装于透明膜材的B面，并在相对位置上于透明基材内埋线路将RGB与IC驱动芯片接口进行连接；最后将透明基板的A面与B面进行阻水阻气材料的封装作业。
图1为本专利发明ASIC倒装技术的柔性透明LED显示屏叠构侧视图，直接沉积RGB灯珠于透明基材A表面上面，IC驱动芯片倒装于透明基板B面，于透明基材内埋线路将RGB灯珠与IC驱动芯片接口进行连接，最后对透明基材的AB面分别进行阻水阻气材料的封装，相较于习知技术图2，此设计可缩小整体尺寸10倍以上；相较于习知技术图3，IC驱动芯片良率不因为沉积RGB不良而损坏。
以上所述仅为本申请的实施例，并非因此以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (8)

  1. 一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：
    包括透明基板，所述透明基板内部埋设有逻辑电路，所述逻辑电路延伸至所述透明基板两侧外部，且所述逻辑电路两端分别连接有RGB灯珠以及驱动IC，若干所述RGB灯珠组合成显示电路；所述逻辑电路用于连接所述RGB灯珠与所述驱动IC。
  2. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述RGB灯珠与所述透明基板固定连接，且进行阻水阻气封装。
  3. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述RGB灯珠与所述透明基板固定连接，且进行阻水阻气封装。
  4. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：透明基材为玻璃、PET、PEEK、CPI、PEI、PEN、PMMA、COC、COP、PC、LSR、FEP、SMMA、GPPS、PETG或PPSU中的一种，但不以此为限。
  5. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述透明基板厚度介于9um到3cm之间。
  6. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述逻辑电路與显示电路的电路材料均为金、银、铜、不锈钢或其合金之导电材料中的一种，但不以此为限。
  7. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述逻辑电路與显示电路的线路宽度介于1um到5mm之间；所述显示电路的线路厚度介于0.1um到300um之间，所述显示电路与所述触控电路呈网格状设计，以提升其不可视性。根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：所述RGB灯珠中的红绿蓝无机发光材料分别为砷化镓、磷化镓与氮化镓或是其掺杂化合物与混合物，但不以此为限。
  8. 根据权利要求1所述的一种适用于ASIC倒装技术的柔性透明LED显示屏，其特征在于：无机发光材料使用蒸镀法设置于透明基材的表面与所述逻辑电路电性连接。
PCT/CN2022/073410 2022-01-12 2022-01-24 一种适用于 asic 倒装技术的柔性透明 led 显示屏 WO2023133934A1 (zh)

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CN207250028U (zh) * 2017-09-15 2018-04-17 维沃移动通信有限公司 一种显示模组、显示屏和移动终端
CN207833841U (zh) * 2018-02-12 2018-09-07 木林森股份有限公司 一种新型的cob显示模组
CN209641250U (zh) * 2019-04-09 2019-11-15 刘博伦 Led倒装显示屏
CN110827709A (zh) * 2019-11-26 2020-02-21 苏州佳世达电通有限公司 显示模组
CN211320089U (zh) * 2019-12-31 2020-08-21 利亚德光电股份有限公司 驱动发光单元及具有其的led显示屏模组
WO2021227352A1 (zh) * 2020-05-13 2021-11-18 深圳市洲明科技股份有限公司 Led显示模组、led显示屏及led显示模组的制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207250028U (zh) * 2017-09-15 2018-04-17 维沃移动通信有限公司 一种显示模组、显示屏和移动终端
CN207833841U (zh) * 2018-02-12 2018-09-07 木林森股份有限公司 一种新型的cob显示模组
CN209641250U (zh) * 2019-04-09 2019-11-15 刘博伦 Led倒装显示屏
CN110827709A (zh) * 2019-11-26 2020-02-21 苏州佳世达电通有限公司 显示模组
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