CN2556707Y - Heat radiator module - Google Patents
Heat radiator module Download PDFInfo
- Publication number
- CN2556707Y CN2556707Y CN 02237925 CN02237925U CN2556707Y CN 2556707 Y CN2556707 Y CN 2556707Y CN 02237925 CN02237925 CN 02237925 CN 02237925 U CN02237925 U CN 02237925U CN 2556707 Y CN2556707 Y CN 2556707Y
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- CN
- China
- Prior art keywords
- heat
- fan
- radiator
- heat radiator
- radiator module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiating device, in particular to a radiator module that is arranged above a CPU and used for assisting with emitting heat generated by a processor chip. The radiator module comprises a heat sink arranged on and jointed with the top surface of the CPU and a fan arranged above the heat sink. The heat sink is made of ceramic material with good heat conductivity and radiating performance and takes proper shapes of a sheet, a strip and a vortex, etc., and heat is exhausted by the fan, the radiator module is connected with proper position of a computer through an arranged ceramic conduit, heat generated by the CPU is exhausted out from the computer by adopting syphon tube theory, the fan is provided with a ceramic bearing for avoiding high temperature during a long-time running of the fan, and the surface of the radiator has a metallic coating layer with good heat conductivity.
Description
Technical field:
The utility model is meant a kind of heat abstractor, is meant a kind of heat spreader module that is used to assist to discharge the central processing unit chip heat on the central processing unit (CPU) that is installed on especially.
Background technology:
Development along with semiconductor industry, semi-conductor chip is constantly towards the high frequency development, this year, the arithmetic speed of central processing unit was at a tremendous pace especially, incident is high temperature under the high arithmetic speed, the high temperature how effectively central processing unit to be produced is discharged, central processing unit can be turned round under suitable temperature, become the emphasis of manufacturer's exploitation.
Existing heating radiator is to be installed on the central processing unit, be used to assist to discharge the heat that the central processing unit chip produces, it comprises a heat radiator mostly, this heat radiator is to be installed on above the central processing unit and with central processing unit to fit, the radiating fin that has suitable shape on it, one fan is arranged on the heat radiator in addition, be used for the heat of central processing unit that heat radiator is absorbed to discharge, to reduce temperature.Though existing heat radiator is made with the respond well copper of heat conduction and heat radiation, aluminium alloy, radiating effect is not best, still has the space of improvement, and its heat-insulating property is not good simultaneously, even can make the fan on the heat radiator produce high temperature.Have, the fan on the existing heating radiator is because the continuous running air draft (or air-supply, look computer-internal space and designing requirement) again, its metal bearing at high temperature, the life-span is limited.
Summary of the invention:
The purpose of this utility model is to overcome above defective, provides a kind of heat radiation, insulation effect good, avoids fan to turn round for a long time simultaneously and produces the heat spreader module of high temperature.
Above-mentioned purpose of the present utility model can be achieved through the following technical solutions, this heat spreader module comprise be installed on the central processing unit end face and with the heat radiator of its applying, and be installed on the fan of heat radiator top, the heat radiator of described heat spreader module is to make shapes such as sheet, bar, vortex shape by heat conduction, stupalith that heat dispersion is good, by fan heat is discharged; The heat radiator of this heat spreader module is provided with ceramic conduit and is connected to the computing machine appropriate location, by the U trap principle heat of central processing unit is discharged; The fan of this heat spreader module has ceramic bearing, the high temperature that can avoid fan to turn round for a long time and produce; The fin surface of above-mentioned heat spreader module is furnished with heat conductivility good metal layer.
Compared with the prior art, the utlity model has following advantage:
1. adiabatic, heat dispersion is good;
2. long service life;
3. can turn round for a long time continuously;
Description of drawings:
Fig. 1 is the stereographic map of the utility model heat spreader module.
Fig. 2 is the exploded view of the utility model heat spreader module.
1-central processing unit 2-heat radiator
20-radiating fin 21-metal level
3-fan 30-ceramic bearing
The 4-ceramic conduit
Embodiment:
Below in conjunction with drawings and Examples the utility model is described further.The design's heat spreader module is installed on the central processing unit 1, be used to assist to discharge the heat that the central processing unit chip produces, this heat spreader module comprises the heat radiator 2 that is installed on central processing unit 1 end face and fits with it, and the fan 3 that is installed on heat radiator 2 tops constitutes, this heat radiator 2 is by heat conduction, stupalith that heat dispersion is good such as aluminium oxide, zirconia, silit (SiC), crystalline silicon carbide, re-crystallized silicon carbide (ReSiC) constitutes suitable sheet, bar, the heat radiator fin of profiles such as vortex shape, present embodiment is a strip heat radiator fin, and borrow fan 3 to assist to discharge heat (or the air-supply that central processing unit 1 chip produces and heat radiator 2 is given in conduction, look computer-internal space and designing requirement), because stupalith has preferable heat conduction, heat dispersion, can effectively improve the heat spreader module radiating effect, more can be because of its preferable thermal insulation, the fan that can avoid being mounted thereon is subjected to heat conduction and overheated, produces fault.Ceramic conduit 4 is installed in this heat radiator 2, and is connected to computing machine appropriate location (as be installed in the fan place or near counter body fan place),, discharge outside the computing machine with the U trap principle with heat with central processing unit 1.Simultaneously, said fans 3 has ceramic bearing, can effectively avoid the fan spindle bearing generation high temperature that turns round for a long time, and fan life is prolonged.These heat radiator 2 surfaces or part surface are furnished with (modes such as plating or coating) one deck heat radiation, heat conduction, heat transfer property good metal layer 21, to improve the radiating efficiency of heat spreader module.
Claims (3)
1. heat spreader module, mainly comprise the heat radiator that is installed on the central processing unit end face and fits with it, the heat radiator top is provided with fan, and it is characterized in that: heat radiator is sheet or strip or vortex shape, and heat radiator is made by stupalith, is connected with ceramic conduit in the heat radiator.
2. heat spreader module according to claim 1, it is characterized in that: fan has ceramic bearing.
3. heat spreader module according to claim 1 is characterized in that: fin surface is furnished with the layer of metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02237925 CN2556707Y (en) | 2002-06-18 | 2002-06-18 | Heat radiator module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02237925 CN2556707Y (en) | 2002-06-18 | 2002-06-18 | Heat radiator module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2556707Y true CN2556707Y (en) | 2003-06-18 |
Family
ID=33711755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02237925 Expired - Fee Related CN2556707Y (en) | 2002-06-18 | 2002-06-18 | Heat radiator module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2556707Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1545000B (en) * | 2003-11-25 | 2010-05-12 | 刘权余 | Processing method of computer CPU heat sink and product thereof |
-
2002
- 2002-06-18 CN CN 02237925 patent/CN2556707Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1545000B (en) * | 2003-11-25 | 2010-05-12 | 刘权余 | Processing method of computer CPU heat sink and product thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |