CN1545000B - Processing method of computer CPU heat sink and product thereof - Google Patents
Processing method of computer CPU heat sink and product thereof Download PDFInfo
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- CN1545000B CN1545000B CN 200310111057 CN200310111057A CN1545000B CN 1545000 B CN1545000 B CN 1545000B CN 200310111057 CN200310111057 CN 200310111057 CN 200310111057 A CN200310111057 A CN 200310111057A CN 1545000 B CN1545000 B CN 1545000B
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- heat
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- radiator
- conducting strip
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Abstract
The invention discloses a method to manufacture a computer CPU cooler, including the following steps: 1) making cooling fins made of laminas and heat-conducting fins, where the heat-conducting fins are plane so that they can closely contact; 2) make fixed holes in these heat-conducting fins; 3) forming an included angle between an lamina and a heat-conducting fin of each cooling fin by pressing inan equispaced increasing mode, which makes these laminas form a uniformly-distributed sector structure after all the cooling fins are fixed in a mode of overlapping mutually; 4) smearing heat-conducting glue or paste on two surfaces of a heat-conducting fin of each cooling fin; 5) overlapping these cooling fins and closely fixing them with screws and nuts. It also discloses a computer CPU coolermade by the foregoing method, which makes the CPU reduce working temperature by at least 4-6 degrees. And this is evident for an AMD-K7 CPU chip.
Description
Technical field
The present invention relates to the job operation and the computer CPU heat sink of computer CPU heat sink.
Background technology
Because the work of computing machine mainly relies on the high-speed computation of CPU; CPU is when running up; usually can produce a large amount of heats; surface temperature can reach 50-80 ℃; CPU inside is then gone up Baidu even up to 80 ℃ especially; and the working temperature of CPU is greatly in 50 degree Celsius; temperature too high stability and serviceable life that then has a strong impact on CPU; thereby badly influence the serviceability and the stability of complete machine; cause slow, the system in case of system halt of travelling speed, even cause chip to burn or the fan of CPU burns.For the heat that CPU is produced leaves, on CPU, fix a heating radiator usually with certain internal cavity, and at cavity internal fixation fan, principle according to the heat convection current, CPU passes to heating radiator with heat, relends the wind-force that helps fan and quickens convection current, and heat is distributed.
Existing on the market at present cpu heat can be divided into three major types: the one, and air-cooled, the 2nd, water-cooled, the 3rd, electronic refrigeration type.Air-cooled is the most generally use on the market a kind of, and the cpu heat of the civilian computer in the whole world has 90% to be that employing is air-cooled.Air-cooled at present " cpu heat " all is integrated heatsink.Integrated heatsink is that the heat conductor of a monoblock (metal) is processed by process equipments such as milling machines, though, the job operation of this heating radiator is simple, but, the problem that exists is owing to be subjected to the restriction of process equipment and technological level, the radiator fin of integrated heatsink too thick (more than 1mm), overall area of dissipation is little, the more and more difficult heat radiation requirement that adapts to computer CPU.Along with the develop rapidly of technology, the dominant frequency of CPU is more and more higher, and it is increasing to generate heat, and traditional cpu heat is difficult to adapt to present CPU speed of development.The CPU heat dissipation problem has become the bottleneck that improves CPU speed.
Summary of the invention
Purpose of the present invention is intended to overcome above-mentioned the deficiencies in the prior art, proposes a kind of job operation and computer CPU heat sink that can effectively improve the computer CPU heat sink of gilled radiator heat dispersion.
Realize the technical scheme of above-mentioned purpose: a kind of job operation of computer CPU heat sink comprises the steps:
6) make the required specification that processed by blade and conducting strip integral body and the heat radiator of quantity, conducting strip is the plane, and it overlappedly can closely be contacted by the plane fixedly the time;
7) in described conducting strip, offer fixed orifice;
8) each bending blade is become the heating radiator required form;
9) evenly smear heat-conducting glue or heat-conducting cream at two faces of the conducting strip of described each heat radiator;
10) described each heat radiator that is coated with heat conduction mastic or heat-conducting cream is overlapped and closely fixing with screw rod, nut.
Describedly become the method for heating radiator required form to be each bending blade: the blade of each heat radiator 1 of heating radiator and the angle between the conducting strip be according to the mode drawing that uniformly-spaced increases progressively, and makes it work as the overlapped blade after fixing of each heat radiator and become equally distributed sector structure.
Described heat-conducting glue or heat-conducting cream can be heat-conducting silicone greases.
A kind of computer CPU heat sink, comprise groups of fins, standing screw and nut, each heat radiator of groups of fins is processed by blade and conducting strip integral body, conducting strip is the plane, have fixed orifice on the conducting strip, the two sides of conducting strip evenly is coated with heat-conducting glue or heat-conducting cream, it is overlapped and by the fixed orifice screw rod to be coated with each heat radiator of heat-conducting cream, nut closely contact is fixing, the blade of each heating radiator of front and back and the angle between the conducting strip are according to the mode drawing that uniformly-spaced increases progressively, make it work as the overlapped blade after fixing of each heat radiator and become equally distributed sector structure. adopt technique scheme, beneficial technical effects of the present invention is: 1, by on the conducting strip of each radiator fin, smearing heat-conducting glue or heat-conducting cream, filled up " room " of contact point from physical arrangement, make between heat radiator and the heat radiator and become contact very closely connected " face contact " by " point contacts ", thereby the pyroconductivity between radiator fin and the radiator fin improves greatly, the integral body of having improved heating radiator is very effectively conducted heat and radiating efficiency .2, by at the blade of each heating radiator of front and back and the angle between the conducting strip according to the mode drawing that uniformly-spaced increases progressively, make it work as the overlapped blade after fixing of each heat radiator and become equally distributed sector structure, guaranteed the radiating effect .3 of radiator integral equilibrium, actual measurement shows, if coat heat-conducting glue (cream) and the pyroconductivity that is not coated with heat-conducting glue (cream) heating radiator difference training even tens of training mutually. we are on same test platform, cpu heat with same structure and specification is tested, and the working temperature of coating heat-conducting glue (cream) and not being coated with heat-conducting glue (cream) CPU differs the 4-6 degree. and especially more obvious on the cpu chip of AMD K7 framework.Stability and the serviceable life of CPU have obviously been improved.
Description of drawings
Fig. 1 is a kind of structural representation of heat radiator.
Fig. 2 is the heat radiating fin structure synoptic diagram that is coated with heat-conducting silicone grease
Fig. 3 is a heating radiator mansion TV structure synoptic diagram of being dressed up shape by the described groups of fins of Fig. 2.
Embodiment
Below in conjunction with Fig. 1 to Fig. 4, the present invention is further detailed explanation:
A kind of job operation of computer CPU heat sink comprises the steps:
1) make the required specification that processed by blade 2 and conducting strip 3 integral body and the heat radiator 1 of quantity, conducting strip 3 is the plane, and it overlappedly can closely be contacted by the plane fixedly the time;
2) in described conducting strip 3, offer fixed orifice 4;
3) blade 2 of each heat radiator 1 of heating radiator and the angle between the conducting strip 3 be according to the mode drawing that uniformly-spaced increases progressively, and makes it work as the overlapped 2 one-tenth equally distributed sector structures of blade (as shown in Figure 3) after fixing of each heat radiator 1;
4) evenly smear heat-conducting glue or heat-conducting cream 6 at two faces of the conducting strip 3 of described each heat radiator 1, also can smear other heat-conducting glue with good heat conductive performance or heat-conducting cream;
5) described each heat radiator 1 that is coated with heat-conducting silicone grease 6 or other heat conduction mastic or heat-conducting cream is overlapped and closely fixing with screw rod 7, nut 8.
A kind of computer CPU heat sink, comprise the groups of fins of forming by a plurality of heat radiator 1, heat-conducting silicone grease 6, standing screw 7 and nut 8, each heat radiator 1 is processed by blade 2 and conducting strip 3 integral body, heat radiator 1 tool recess 5, make its overlapped back formation that is shaped that the open-ended cavity of fan can be installed, conducting strip 3 is planes, evenly be coated with the heat-conducting glue or the heat-conducting cream of heat-conducting silicone grease 6 or other excellent heat conductivity performance in the conducting strip 3, adopt the method for silk-screen to smear when smearing, be coated with each heat radiator 1 overlapped back of heat-conducting silicone grease 6 and fixture block 9 be set by fixed orifice screw rod 7, nut 8 closely connects and fixes, the blade 2 of each heat radiator 1 of heating radiator and the angle between the conducting strip 3 are according to the mode drawing that uniformly-spaced increases progressively, be that the angle (α) between the blade equates before and after the overlapping fixing back, make it work as the overlapped 2 one-tenth equally distributed sector structures of blade after fixing of each heat radiator 1.
During use, heating radiator is fixed on the CPU by heat-conducting glue, and in the inner chamber of heating radiator fan is installed, fan can carry out efficiently radiates heat to CPU by external power supply.
Must be pointed out that the indefiniteness that the foregoing description is only made the present invention illustrates.But person of skill in the art will appreciate that, do not departing under aim of the present invention and the scope that can make various modifications, replacement and change to the present invention, these modifications, replacement and change still belong to protection scope of the present invention.
Claims (5)
1. the job operation of a computer CPU heat sink is characterized in that comprising the steps:
1) make the required specification that processed by blade and conducting strip integral body and the heat radiator of quantity, conducting strip is the plane, and it overlappedly can closely be contacted by the plane fixedly the time;
2) in described conducting strip, offer fixed orifice;
3) with the blade of each heat radiator of heating radiator and the angle between the conducting strip according to the mode drawing that uniformly-spaced increases progressively, make it work as the overlapped blade after fixing of each heat radiator and become equally distributed sector structure;
4) evenly smear heat-conducting glue or heat-conducting cream at two faces of the conducting strip of described each heat radiator;
5) described each heat radiator that is coated with heat conduction mastic or heat-conducting cream is overlapped and closely fixing with screw rod, nut.
2. according to the job operation of the described computer CPU heat sink of claim 1, it is characterized in that: described smearing is to adopt the method for silk-screen to smear.
3. according to the job operation of claim 1 or 2 described computer CPU heat sinks, it is characterized in that: described heat-conducting glue or heat-conducting cream can be heat-conducting silicone greases.
4. computer CPU heat sink, it is characterized in that: comprise groups of fins, standing screw and nut, each heat radiator of groups of fins is processed by blade and conducting strip integral body, conducting strip is the plane, have fixed orifice on the conducting strip, the two sides of conducting strip evenly is coated with heat-conducting glue or heat-conducting cream, it is overlapped and by the fixed orifice screw rod to be coated with each heat radiator of heat-conducting cream, nut closely contact is fixing, before and after the blade of each heating radiator and the angle between the conducting strip according to the mode drawing that uniformly-spaced increases progressively, make it work as the overlapped blade after fixing of each heat radiator and become equally distributed sector structure.
5. according to the described computer CPU heat sink of claim 4, it is characterized in that: described heat radiator tool notch configuration makes and forms the open-ended cavity that fan can be installed behind its overlapped bending forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310111057 CN1545000B (en) | 2003-11-25 | 2003-11-25 | Processing method of computer CPU heat sink and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310111057 CN1545000B (en) | 2003-11-25 | 2003-11-25 | Processing method of computer CPU heat sink and product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1545000A CN1545000A (en) | 2004-11-10 |
| CN1545000B true CN1545000B (en) | 2010-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310111057 Expired - Fee Related CN1545000B (en) | 2003-11-25 | 2003-11-25 | Processing method of computer CPU heat sink and product thereof |
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| Country | Link |
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| CN (1) | CN1545000B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2533575Y (en) * | 2002-02-20 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink assembly |
| CN2556707Y (en) * | 2002-06-18 | 2003-06-18 | 庄育丰 | Heat radiator module |
-
2003
- 2003-11-25 CN CN 200310111057 patent/CN1545000B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2533575Y (en) * | 2002-02-20 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink assembly |
| CN2556707Y (en) * | 2002-06-18 | 2003-06-18 | 庄育丰 | Heat radiator module |
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| Publication number | Publication date |
|---|---|
| CN1545000A (en) | 2004-11-10 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20111125 |