JP3094362U - Heat spreader module - Google Patents

Abstract

(57) [Summary] To provide a heat spreader module. SOLUTION: It mainly comprises a heat dissipating plate installed on a CPU apex surface and in close contact with the CPU, and a fan installed above the heat dissipating plate. The heat-dissipating plate is made of a ceramic material having good heat conduction and heat dissipation, and is made of a ceramic material.
A heat-dissipating piece having an appropriate external shape such as a rod or a spiral is provided. The fan creates a chip for the CPU that helps dissipate the heat conducted to the heat spreader. A ceramic conduit may be provided on the heat-dissipating plate, connected to an appropriate place of the PC, and the heat of the CPU may be discharged to the outside of the PC by a siphon principle. In addition, since the fan includes a ceramic bearing, it is possible to effectively suppress the generation of high temperature due to long-time operation of the fan, and furthermore, the heat dissipating plate surface, or a part of the surface, has excellent heat dissipation and heat conduction. A metal layer can also be applied.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

  The present invention relates to a type of heat spreader module. Especially installed on a kind of CPU , Helps to dissipate the heat generated by the CPU, has excellent heat dissipation and heat insulation effects, and runs the fan for a long time. The present invention relates to a heat spreader module that can prevent the generation of high temperatures.

[0002]

[Prior art]

  With the development of the semiconductor industry, semiconductor chips are developing toward higher cycle rates. It In recent years, the processing speed of the CPU has been rapidly increased, and the high temperature generated by the increase in speed How to effectively discharge is a very important issue.   A well-known heat dissipator should be installed on the CPU to help dissipate the heat generated by the CPU chip. It Most of them include a heat-dissipating plate, and the heat-dissipating plate is installed in close contact with the CPU on the upper surface of the CPU. It The heat-dissipating plate has a heat-dissipating piece of an appropriate shape, and a fan is separately installed on the heat-dissipating plate. It The fan dissipates the heat from the heat-dissipating plate that has absorbed the heat of the CPU, achieving a temperature drop. To do.

[0003]  Known heat-dissipating plates are made of copper and aluminum alloy, which have excellent heat conduction and heat-dissipating effects. Its heat-dissipating effect is not the best. Moreover, it has poor heat insulation and is installed on top of it Fans that operate also have the drawback of generating high temperatures.   Furthermore, the fan on the known heat dissipator operates continuously and exhausts (or blows air. PC internal space (Depending on the design), the metal bearing will reach a high temperature and There is a limit.

[0004]

[Problems to be solved by the device]

  In order to solve the above-mentioned disadvantages of the known structure, the present invention imposes the provision of a heat dissipator module. The title.   The heat-dissipating plate is made of a ceramic material having good heat conduction and heat dissipation. Equipped with a plate-shaped, rod-shaped, spiral-shaped, or other suitable heat-dissipating piece made of Install a ceramic conduit in the heat dissipation plate, connect it to an appropriate place on the PC, and Since the heat of the heat is discharged to the outside of the PC by the siphon principle, excellent heat dissipation and heat insulation effects are achieved. To achieve.   In addition, the fan has ceramic bearings, which ensure long-term operation of the fan. It is possible to effectively suppress the generation of high temperature due to rolling.   In addition, the heat dissipation plate surface or a part of the surface is provided with a metal layer excellent in heat dissipation and heat conduction. It can also be applied.

[0005]

[Means for Solving the Problems]

  In order to solve the above problems, the present invention provides the following heat spreader module.   It is mainly installed on the top surface of the CPU and is a heat-dissipating plate that adheres closely to the CPU, and on the heat-dissipating plate. Consists of a fan installed on one side.

[0006]   That is, the present invention is as follows. (1) A heat-dissipating plate that is installed mainly on the top surface of the CPU and is in close contact with the CPU, above the heat-dissipating plate Configured by the fan to be installed, The heat-dissipating plate is made of a ceramic material having good heat conduction and heat dissipation. It has a plate-shaped, rod-shaped, spiral-shaped, etc. The fan causes the CPU chip to help dissipate the heat conducted to the heat spreader. A heat dissipator module characterized in that (2) Install a ceramic conduit on the heat-dissipating plate and connect it to an appropriate place on the PC. The heat of the CPU is discharged to the outside of the PC by the siphon principle. The heat spreader module of (1). (3) Since the fan has a ceramic bearing, it can be operated for a long time. Dispersion of the above (1), which is characterized in that the generation of high temperature due to Heater module. (4) A metal layer excellent in heat dissipation and heat conduction is applied to the surface of the heat dissipation plate or a part of the surface. The heat spreader module according to the above (1), characterized in that it can also be formed.

[0007]   The heat-dissipating plate is made of a ceramic material having good heat conduction and heat dissipation. It is provided with a heat dissipation piece having an appropriate external shape such as a plate shape, a rod shape, or a spiral shape which is made of a material. This The fan causes chips in the CPU to help dissipate heat conducted to the heat spreader. In addition, a ceramic conduit is installed in the heat-dissipating plate and connected to an appropriate place on the PC, The heat of the CPU can be discharged to the outside of the PC by the siphon principle.   In addition, the fan has ceramic bearings, which allows the fan to operate for long periods of time. It is possible to effectively suppress the generation of high temperature due to the heat dissipation plate surface or a part of the surface. It is also possible to apply a metal layer having excellent heat dissipation and heat conduction.

[0008]

[Embodiment of device]

  As shown in FIGS. 1 and 2, the present invention is mainly installed on the CPU 1, and the CPU 1 is installed on the CPU 1. Helps to dissipate the heat generated.   The heat dissipator module is installed on the apex surface of the CPU1, and the heat dissipating adheres to the CPU1. It is composed of a plate 2 and a fan 3 installed above the heat dissipation plate 2.   The heat-dissipating plate 2 is made of a ceramic material having good heat conduction and heat dissipation. The ceramic Materials are aluminum oxide, zirconium oxide, silicon carbide, crystalline silicon carbide , Recrystallized silicon carbide, plate-shaped, rod-shaped, or spiral composed of the above materials A heat dissipating piece 20 having a suitable outer shape such as a shape is provided. In this embodiment, the bar block-shaped heat dissipation piece 2 is used. Use 0.   The fan 3 generates chips of the CPU 1 and discharges heat conducted to the heat dissipation plate 2. help. The method is exhaust or blown air, and depends on the internal space of the PC and the design.

[0009]   Since the ceramic material has good heat conductivity and heat dissipation, it can effectively dissipate heat The heat-dissipating effect of the joule can be improved.   In addition, the ceramic material has good thermal insulation, so It is possible to eliminate the risk that the battery 3 will be overheated due to heat conduction and will break down.

[0010]   Also, due to the internal design of a certain type of PC, due to lack of space, the upper side of the heat-dissipating plate 2 (or the side If the fan 3 cannot be installed in the heat dissipating plate 2, the ceramic conduit 4 is installed in the heat dissipating plate 2. It can also be installed. The conduit 4 is installed in a suitable place on the PC (fan installation place, or P C case fan position), and the heat of the CPU 1 is transferred to the siphon principle (heat is temperature Is sucked from where it is low) and then discharged to the outside of the PC.

[0011]   Further, since the fan 3 includes the ceramic bearing 30, the fan bearing is It is possible to effectively suppress the generation of high temperature due to long-term operation of the fan, and the life of the fan. The life can be extended.   The surface of the heat-dissipating plate 2 or a part of the surface is electroplated or coated. According to this method, the metal layer 21 excellent in heat dissipation and heat conduction can also be applied. this Thereby, the heat dissipation efficiency of the heat dissipation module is further improved.

[0012]

[Effect of device]

  As described above, the heat dissipation plate of the present invention is made of a ceramic material with good heat conduction and heat dissipation. Manufactured and composed of the ceramic material, having a suitable external shape such as plate, rod, spiral, etc. It is equipped with a heat-dissipating piece, and a ceramic conduit is installed in the heat-dissipating plate to suit the PC. To connect to a proper place and to discharge the heat of the CPU to the outside of the PC by the siphon principle Excellent in heat dissipation and heat insulation. Furthermore, the fan of the present invention has a ceramic bearing. As a result, it is possible to effectively suppress the generation of high temperature due to long-term operation of the fan. It In addition, the heat-dissipating plate surface of the present invention, or a part of the surface of the heat-dissipating plate, is excellent in heat dissipation and heat conduction. A metal layer can also be applied to further improve the heat dissipation efficiency of the heat dissipation module. You can

[Brief description of drawings]

FIG. 1 is a perspective view of the present invention.

FIG. 2 is a three-dimensional exploded view of the present invention.

[Explanation of symbols]

1 CPU 2 Heat dissipation plate 20 Heat dissipation piece 21 metal layer 30 ceramic bearings 4 Ceramic conduit

Claims (4)

[Scope of utility model registration request] 1. A heat dissipating plate mainly installed on the apex surface of the CPU, which is in close contact with the CPU, and a fan installed above the heat dissipating plate. , A plate-shaped, rod-shaped, spiral-shaped, or other suitable heat-dissipating piece made of the ceramic material, the CPU chip being generated by the fan to assist in discharging heat conducted to the heat-dissipating plate. Characteristic heat sink module. 2. The heat dissipator according to claim 1, wherein a ceramic conduit is installed in the heat dissipating plate and is connected to an appropriate place of the PC, and the heat of the CPU is discharged to the outside of the PC by the siphon principle. module. 3. The heat dissipator module according to claim 1, wherein the fan comprises a ceramic bearing, so that generation of high temperature due to long-term operation of the fan can be effectively suppressed. 4. The heat spreader module according to claim 1, wherein a metal layer excellent in heat dissipation and heat conduction can be applied to the surface of the heat dissipation plate or a part of the surface thereof.