CN107426950A - A kind of electronic device natural heat dissipation device - Google Patents
A kind of electronic device natural heat dissipation device Download PDFInfo
- Publication number
- CN107426950A CN107426950A CN201710601491.9A CN201710601491A CN107426950A CN 107426950 A CN107426950 A CN 107426950A CN 201710601491 A CN201710601491 A CN 201710601491A CN 107426950 A CN107426950 A CN 107426950A
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- China
- Prior art keywords
- heat
- substrate
- fin
- electronic device
- heat dissipation
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of electronic device natural heat dissipation device, the heat abstractor are made up of substrate, the radiating fin being arranged on substrate and rear shell；The radiating fin uses W type structures, vertical substrate arrangement, and processing interrupts in corner；The rear shell is manufactured by heat-insulating material, is close to substrate back.In the course of work, heat abstractor is arranged vertically, and heat caused by electronic device is delivered on aluminum flat board via heat pipe, and aluminum flat board is placed in the rear shell, the substrate with the radiator is bonded again, and heat is lost in environment finally by W type radiating fins.Utilize the distinctive arrangement of W type fins, add area of dissipation, reduce contact flow of the gas with fin, considerably increase the air inflow of horizontal direction, so that heat transfer temperature difference becomes big, heat transfer free convection efficiency is improved, so as to reach the extension electronic device life-span, improves the purpose of equipment dependability.
Description
Technical field
The invention belongs to technical field of heat dissipation, and in particular to it is each that one kind is applied to chemical industry, metallurgy, air-conditioning, telecommunications etc.
Industry needs to strengthen the electronic device natural heat dissipation device under the high heat flux in the equipment of radiating.
Background technology
With developing rapidly for electronics and mechanics of communication, the use of high performance chipses and integrated circuit is more and more extensive.Electricity
The development of sub- industry follows Moore's Law always：When price is constant, open ended transistor size on integrated circuit, about often
It will be doubled every 18~24 months, performance will also lift one times.Therefore the power of electronic device chip constantly increases, in addition
Equipment volume increasingly reduces, and causes FU surface heat flux constantly to increase, temperature constantly rises.With the liter of temperature
Height, when more than its rated value, the crash rate of electronic component is exponentially increased, and correspondingly reduces the reliability of equipment.To protect
The stability of electronic apparatus system parameter is demonstrate,proved, improves the service behaviour and reliability of electronic equipment, must just carry out heat to equipment
Design, makes its operating temperature be less than rated temperature.The main type of cooling of electronic device has active and passive type at present.Typically
For, active heat dissipation capacity is much larger than passive heat radiation amount, but need not supply the energy because passive heat radiation has, performance can
By the advantages that stable, safe, noiseless and manufacturing cost is relatively low, increasingly attract attention.Also, due to environmental suitability
It is required that some interiors of products do not allow to install fan, and its shell opposing seal, central heat source is typically arranged on equipment bottom
Portion or internal side of shell, and carry out increasing heat radiation area by radiated rib or fin, radiated by natural heat dissipation mode.
For be widely used in communication, networking industry natural heat dissipation module, analyze its slave module internal heat resource (heating member
Part) understood to the radiation processes of external environment, the radiating thermal resistance of module housing side be much larger than inside modules thermal contact resistance and
The link thermal resistance such as heat conduction, convection current.The radiating of shell side then includes Natural Heat Convection and heat loss through radiation, particularly it is therein from
Right thermal-convection resistance is high (account for whole module thermal resistance more than 50%), is the institute for restricting the key that module heat dissipating ability improves
.It is continuously increased as natural heat dissipation module dissipation is horizontal, how fully reduces the thermal resistance of natural heat dissipation module housing side, increases
Strong module heat dissipating ability, it is to reduce the horizontal inevitable requirement of module temperature, and ensures the operation of natural heat dissipation module normal table
Premise.Being limited in view of Modular surface situation and temperature levels, the reinforcing of its radiation heat transfer and optimization space are limited, so from
The augmentation of heat transfer of right radiating module need to strengthen the Natural Heat Convection ability of its shell side, therefore conventional researcher couple
This has carried out substantial amounts of experiment and numerical simulation study.The fin structure applied to Natural Heat Convection module mainly has flat at present
Plate fin, corrugated fin and louvered fin.Plate fin has easy to process, and manufacturing cost is low, is easy to large-scale production
The advantages that, but in produce reality through commonly used two vertical plates fin for, thereon partially due to gas flow temperature is higher,
Heat transfer temperature difference diminishes, so its heat-sinking capability also correspondingly deteriorates.Corrugated fin and louvered fin are complicated, it is tired to process
Difficulty, flow resistance is larger, and there is also class for the upper part for the vertical corrugated fin and louvered fin used in actual production
It is similar to the shortcomings that concertedness is poor between flow field velocity vector thermograde in two vertical plates fin.In consideration of it, current equipment
Thermal design have become the key issue for restricting the industry development of new techniques such as electronic communication.Therefore, needing exploitation one kind badly can
Electronic equipment internal temperature under high heat flux is significantly reduced, improves the high-efficiency radiator of equipment dependability.
The content of the invention
Higher for two vertical plates fin upper air temperature set forth above, flow velocity is smaller to cause free convection heat transfer to be imitated
The technical problem that fruit deteriorates, the present invention provide a kind of temperature that can effectively reduce heater element in heat dissipation equipment under the conditions of natural heat dissipation
Degree, extend the life-span so as to reach, improve the electronic device natural heat dissipation device of equipment dependability.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：Including set gradually from bottom to top adiabatic rear shell,
Thermal source aluminium sheet, substrate and W type radiating fins, the W types radiating fin corner disconnect, are arranged symmetrically on substrate；The heat
Source aluminium sheet is arranged in adiabatic rear shell, and is close to substrate back.
The opening angle a of described W type radiating fins is 45 °~90 °.
Described W types radiating fin disconnects the ratio between spot size d and substrate width size L d/L=0.03~0.10.
The ratio between described W types radiating fin fin thickness l and spacing of fin p width dimensions L l/p=0.05~0.10.
Described W type radiating fins are evenly arranged on substrate.Described rear shell insulation.
Electronic device work caused by heat be delivered to via heat pipe on thermal source aluminium sheet, thermal source aluminium sheet again with the radiating
Device substrate is bonded, and heat is lost in environment finally by W type radiating fins.Enter gas phase with two vertical plates fin bottom portion
Than W type radiating fins change the intake method of air so that more air air inlets from horizontal direction, increase heat exchange temperature
Difference, heat exchange area is increased, so as to substantially increase heat exchange efficiency.
The present invention compared with prior art, has advantages below：
1) heat exchange area is increased.The inclined fin arrangement of W type radiating fins, relative to conventional vertical flat board wing
Piece, heat-dissipating space is more efficiently make use of, while fin efficiency is ensured, increase heat exchange area, enhanced heat exchange
Effect.
2) intake method is changed.Traditional two vertical plates fin is mainly from bottom inflow, and air is along gravity direction
Rise, exchanged heat with fin.Direct result caused by this intake method is that substrate upper air temperature gradually rises, heat exchange
The temperature difference diminishes；Simultaneously as the process CIMS in air inlet is big, the thickness of thermal boundary layer is big so that heat exchange property is deteriorated.W types dissipate
Hot fin causes the main intake method of air to be horizontally oriented air inlet so that it is attached that more cold airs are directly entered fin
Closely, heat transfer process is participated in so that gas flow reduces, and heat transfer temperature difference increase, the overall heat exchange property of fin is strengthened.
3) air inflow is added.The air inlet of W type radiating fin horizontal directions mainly interrupts position at fin turning.Compare
In V-type fin, W type radiating fins considerably increase the air inflow of horizontal direction so that more air inlets can reach fin bottom
Portion, or even substrate is washed away, so as to reach the purpose for strengthening radiating effect.
4) present invention is simple in construction.On conventional vertical flat plate radiation architecture basics, do not change fin height, retain original
Heat-dissipating space, only change the arrangement of fin；Do not increase diagonal rib, arc structure, be effectively retained its flow resistance compared with
It is small, easy to process, the advantages such as manufacturing cost is low.
5) efficient radiating efficiency.It is 100W in electronic device power, when ambient temperature is 25 DEG C, at present in industry
On the basis of conventional vertical flat radiator, substrate averagely cools less than 2.5 DEG C wide variety of gilled radiator, utilizes
Hot pipe technique can reach average 3.8 DEG C of temperature drop, and W types radiating fin can reach 5.1 DEG C of highest temperature drop in the present invention, average
3.9 DEG C of temperature drop.
Brief description of the drawings
The present invention is further described for described embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the explosive view of the present invention.
Fig. 2 is the front view of the present invention.
Fig. 3 is the left view of the present invention.
Fig. 4 is that structure of the present invention and the temperature measuring point temperature comparisons of conventional vertical plate fin radiator scheme.
1 in figure, W type radiating fins, 2, substrate, 3, aluminium sheet thermal source, 4, adiabatic rear shell.
Embodiment
Referring to accompanying drawing 1, heat abstractor of the invention includes W types radiating fin 1 and is arranged on the bottom of W types radiating fin 1
The substrate 2 in portion, and the thermal source aluminium sheet 3 at the back side of substrate 2 is close to, and the adiabatic rear shell 4 of the parcel thermal source aluminium sheet 3；Institute
The disconnection of the corner of W types radiating fin 1 is stated, is distributed on the substrate 2.Wherein, the opening angle a of described W types radiating fin 1
For 45 °~90 °；Described W types radiating fin 1 disconnection the ratio between spot size d and the width dimensions L of substrate 2 d/L=0.03~
0.10；The ratio between the thickness l and spacing of fin p width dimensions L of described W types radiating fin 1 l/p=0.05~0.10.
Electronic device work caused by heat be delivered to via heat pipe on aluminium sheet thermal source, aluminium sheet thermal source again with the radiating
Device substrate is bonded, and heat is lost in environment finally by W type radiating fins.By changing the intake method of air, make
The air inlet from horizontal direction of more air is obtained, and fin area is quickly left along ramp way, reduces air flow, is increased
Heat transfer temperature difference, increases heat exchange area, so as to substantially increase heat exchange efficiency.
It is one embodiment of the present of invention below, substrate height H is 355mm, and substrate width L is 210mm, substrate thickness b
For 3mm.For w type radiating fins, opening angle a is 60 °, and fin thickness l is 1.8mm, and spacing of fin p is 11.2mm.5 surveys
Warm spot is evenly arranged on substrate.Five thermal source general power 100W, on substrate with arrangement, 35 DEG C of environment temperature.For this
Structural parameters, the respectively heat exchange to conventional vertical plate fin radiator and structure of the present invention carry out numerical value meter with flow behavior
Calculate, while the Temperature Distribution on two kinds of structural substrates is analyzed.Using above-mentioned efficent electronic device radiator, with biography
The two vertical plates fin radiator of system is compared, and 5 temperature measuring point Temperature Distributions are as shown in Figure 3.From figure 3, it can be seen that with it is traditional
Two vertical plates fin radiator is compared, and using structure of the present invention, substrate temperature highest reduces about 5.1 DEG C, significantly strengthens convection current and changes
Heat.
Claims (5)
- A kind of 1. electronic device natural heat dissipation device, it is characterised in that：Including set gradually from bottom to top adiabatic rear shell (4), Thermal source aluminium sheet (3), substrate (2) and W types radiating fin (1), W types radiating fin (1) corner disconnect, and are arranged symmetrically in base On plate (2)；The thermal source aluminium sheet (3) is arranged in adiabatic rear shell (4), and is close to substrate (2) back side.
- 2. electronic device natural heat dissipation device according to claim 1, it is characterised in that：Described W types radiating fin (1) Opening angle a be 45 °~90 °.
- 3. electronic device natural heat dissipation device according to claim 1, it is characterised in that：Described W types radiating fin (1) Disconnect the ratio between spot size d and substrate (2) width dimensions L d/L=0.03~0.10.
- 4. electronic device natural heat dissipation device according to claim 1, it is characterised in that：Described W types radiating fin (1) The ratio between fin thickness l and spacing of fin p width dimensions L l/p=0.05~0.10.
- 5. electronic device natural heat dissipation device according to claim 1, it is characterised in that：Described W types radiating fin (1) It is evenly arranged on substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710601491.9A CN107426950A (en) | 2017-07-21 | 2017-07-21 | A kind of electronic device natural heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710601491.9A CN107426950A (en) | 2017-07-21 | 2017-07-21 | A kind of electronic device natural heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107426950A true CN107426950A (en) | 2017-12-01 |
Family
ID=60431009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710601491.9A Pending CN107426950A (en) | 2017-07-21 | 2017-07-21 | A kind of electronic device natural heat dissipation device |
Country Status (1)
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| CN (1) | CN107426950A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040753A (en) * | 2020-10-13 | 2020-12-04 | 中国石油大学(华东) | 5G communication equipment heat abstractor |
| CN113207263A (en) * | 2021-03-26 | 2021-08-03 | 苏州久越金属科技有限公司 | High-heat-dissipation 5G communication equipment cavity and glue-free copper pipe burying process thereof |
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| CN1553502A (en) * | 2003-05-27 | 2004-12-08 | 建亨精密股份有限公司 | Radiating fin structure |
| CN101487584A (en) * | 2009-02-25 | 2009-07-22 | 华南理工大学 | Heat radiating module for high-power LED lamp |
| CN201894855U (en) * | 2010-11-22 | 2011-07-13 | 苏州市中衡压力容器制造有限公司 | Defoaming device of plate type falling film evaporator |
| JP2014022680A (en) * | 2012-07-23 | 2014-02-03 | Fanuc Ltd | Servo amplifier including heat sink having shortened flow passage for natural convection |
| CN203704437U (en) * | 2013-12-02 | 2014-07-09 | 广东富信科技股份有限公司 | Semiconductor refrigeration integrated system |
| CN204757802U (en) * | 2015-02-09 | 2015-11-11 | 上海良机冷却设备有限公司 | Cooling tower is with hanging tilting fin |
| CN204902190U (en) * | 2015-06-24 | 2015-12-23 | 珠海格力电器股份有限公司 | Radiator, controller and air conditioner |
| CN205232663U (en) * | 2015-12-15 | 2016-05-11 | 肥东凯利电子科技有限公司 | Turbulent flow type machine controller radiating bottom plate |
| CN205961665U (en) * | 2016-08-17 | 2017-02-15 | 苏州市永创金属科技有限公司 | Diclinic wing radiator |
| CN106817884A (en) * | 2017-02-28 | 2017-06-09 | 西安交通大学 | A kind of electronic-device radiator |
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2017
- 2017-07-21 CN CN201710601491.9A patent/CN107426950A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1553502A (en) * | 2003-05-27 | 2004-12-08 | 建亨精密股份有限公司 | Radiating fin structure |
| CN101487584A (en) * | 2009-02-25 | 2009-07-22 | 华南理工大学 | Heat radiating module for high-power LED lamp |
| CN201894855U (en) * | 2010-11-22 | 2011-07-13 | 苏州市中衡压力容器制造有限公司 | Defoaming device of plate type falling film evaporator |
| JP2014022680A (en) * | 2012-07-23 | 2014-02-03 | Fanuc Ltd | Servo amplifier including heat sink having shortened flow passage for natural convection |
| CN203704437U (en) * | 2013-12-02 | 2014-07-09 | 广东富信科技股份有限公司 | Semiconductor refrigeration integrated system |
| CN204757802U (en) * | 2015-02-09 | 2015-11-11 | 上海良机冷却设备有限公司 | Cooling tower is with hanging tilting fin |
| CN204902190U (en) * | 2015-06-24 | 2015-12-23 | 珠海格力电器股份有限公司 | Radiator, controller and air conditioner |
| CN205232663U (en) * | 2015-12-15 | 2016-05-11 | 肥东凯利电子科技有限公司 | Turbulent flow type machine controller radiating bottom plate |
| CN205961665U (en) * | 2016-08-17 | 2017-02-15 | 苏州市永创金属科技有限公司 | Diclinic wing radiator |
| CN106817884A (en) * | 2017-02-28 | 2017-06-09 | 西安交通大学 | A kind of electronic-device radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040753A (en) * | 2020-10-13 | 2020-12-04 | 中国石油大学(华东) | 5G communication equipment heat abstractor |
| CN113207263A (en) * | 2021-03-26 | 2021-08-03 | 苏州久越金属科技有限公司 | High-heat-dissipation 5G communication equipment cavity and glue-free copper pipe burying process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171201 |