CN217156677U - Stepped golden finger test piece - Google Patents
Stepped golden finger test piece Download PDFInfo
- Publication number
- CN217156677U CN217156677U CN202220156842.6U CN202220156842U CN217156677U CN 217156677 U CN217156677 U CN 217156677U CN 202220156842 U CN202220156842 U CN 202220156842U CN 217156677 U CN217156677 U CN 217156677U
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- golden finger
- finger test
- test piece
- beryllium copper
- stepped
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Abstract
The utility model discloses a echelonment golden finger test piece, including beryllium copper, screw fixation hole, afterbody wiring auxiliary hole and insulating colloid, beryllium copper sets up in one side of golden finger test piece, and beryllium copper is provided with two, afterbody wiring auxiliary hole sets up in the inside of golden finger test piece opposite side afterbody line connection PCB, and afterbody wiring auxiliary hole is provided with two. The head of the utility model is welded by high hard alloy and beryllium copper, and has long service life and good stability.
Description
Technical Field
The utility model relates to a golden finger test piece technical field specifically is a echelonment golden finger test piece.
Background
Before the chip enters the market, whether each pin contact can be conducted or not needs to be tested so as to judge whether the chip can be normally used or not. In the testing process, the chip to be tested needs to be communicated with the testing circuit board to test the conduction condition of the circuit board, but components on the testing circuit board are communicated through welding, and the chip to be tested cannot be welded on the testing circuit board to be tested. The simplest beryllium copper test IC product is adopted in the existing golden finger test piece, the beryllium copper has poor wear resistance under high-current and high-frequency tests, and the replacement frequency is high, so that the cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a echelonment golden finger test piece, head adopt high carbide and beryllium copper to weld, and life is high and stability is good, has solved the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the stepped golden finger test piece comprises beryllium copper, two screw fixing holes, two tail wiring auxiliary holes and insulating colloid, wherein the beryllium copper is arranged on one side of the golden finger test piece, the tail wiring auxiliary holes are formed in the tail circuit connected with the PCB on the other side of the golden finger test piece, and the two tail wiring auxiliary holes are formed.
Preferably, the thickness of the beryllium copper is 0.4 mm.
Preferably, one end of each of the two beryllium copper is welded and connected with a head hard alloy.
Preferably, the screw fixing holes are formed in the golden finger test piece, and the number of the screw fixing holes is two.
Preferably, two positioning mounting holes are formed between the two screw fixing holes, and two positioning mounting holes are formed in each positioning mounting hole.
Preferably, the insulating colloid is arranged on the outer wall of the golden finger test piece.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses a head contact IC product tests, adopts high carbide welding beryllium copper, replaces single beryllium copper test back in the past, and life improves 3 ~ 4 times, and tests more stably to reduce purchasing cost and shorten operating personnel change time.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a perspective view of the present invention;
fig. 4 is an enlarged view of a portion a of fig. 3 according to the present invention.
In the figure: 1. hard alloy of head; 2. beryllium copper; 3. screw fixing holes; 4. positioning the mounting hole; 5. a tail wiring auxiliary hole; 6. and insulating colloid.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, a stepped gold finger test strip includes beryllium copper 2, screw fixing holes 3, two tail wiring auxiliary holes 5, and an insulating colloid 6, where the beryllium copper 2 is disposed on one side of the gold finger test strip, the two beryllium copper 2 are disposed, the two tail wiring auxiliary holes 5 are disposed inside a circuit board connected to a PCB at the other side of the gold finger test strip, and the two tail wiring auxiliary holes 5 are disposed.
The thickness of beryllium copper 2 is 0.4mm, makes the life after the test improve 3 ~ 4 times.
One end of each of the two beryllium copper 2 is connected with a head hard alloy 1 in a welding mode, and the beryllium copper 2 is welded by adopting high hard alloy, so that the stability is better.
The screw fixing holes 3 are formed in the golden finger test piece, the number of the screw fixing holes 3 is two, and the screw fixing holes 3 are convenient for fixing the golden finger test piece firmly by screws.
Be provided with location mounting hole 4 between two screw fixation holes 3, and location mounting hole 4 is provided with two, and location mounting hole 4 has guaranteed the location when golden finger test piece installs.
The insulating colloid 6 is arranged on the outer wall of the golden finger test piece, and the insulating colloid 6 is used as a surface protective layer on the golden finger test piece and has good electrical insulation performance.
In summary, the following steps: the utility model discloses a weld head carbide 1 and 0.4mm beryllium copper 2, adopt high carbide welding beryllium copper 2, replace single beryllium copper 2 test in the past after, life improves 3 ~ 4 times, and tests more stably to reduce purchasing cost and shorten operating personnel change time.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a echelonment golden finger test piece, includes beryllium copper (2), screw fixation hole (3), afterbody wiring auxiliary hole (5) and insulating colloid (6), its characterized in that: the golden finger test piece is characterized in that the beryllium copper (2) is arranged on one side of the golden finger test piece, the beryllium copper (2) is provided with two holes, the tail wiring auxiliary hole (5) is arranged in the PCB connected with the tail circuit on the other side of the golden finger test piece, and the tail wiring auxiliary hole (5) is provided with two holes.
2. The stepped golden finger test strip according to claim 1, wherein: the thickness of the beryllium copper (2) is 0.4 mm.
3. The stepped golden finger test strip according to claim 1, wherein: one end of each of the two beryllium copper (2) is connected with a head hard alloy (1) in a welding way.
4. The stepped golden finger test strip according to claim 1, wherein: the screw fixing holes (3) are formed in the golden finger test piece, and the number of the screw fixing holes (3) is two.
5. The stepped golden finger test strip according to claim 4, wherein: two positioning mounting holes (4) are formed between the screw fixing holes (3), and two positioning mounting holes (4) are formed.
6. The stepped golden finger test strip according to claim 1, wherein: and the insulating colloid (6) is arranged on the outer wall of the golden finger test piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220156842.6U CN217156677U (en) | 2022-01-20 | 2022-01-20 | Stepped golden finger test piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220156842.6U CN217156677U (en) | 2022-01-20 | 2022-01-20 | Stepped golden finger test piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217156677U true CN217156677U (en) | 2022-08-09 |
Family
ID=82689351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220156842.6U Active CN217156677U (en) | 2022-01-20 | 2022-01-20 | Stepped golden finger test piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217156677U (en) |
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2022
- 2022-01-20 CN CN202220156842.6U patent/CN217156677U/en active Active
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