CN216930418U - Via hole structure of PCB - Google Patents

Abstract

The utility model relates to a via hole structure of a PCB, which is applied to the PCB and comprises: a via hole penetrating through the PCB; the first bonding pad is arranged on one surface of the PCB and surrounds the periphery of the through hole, and is used for electrically connecting the PCB and the through hole; and a second pad extending from the outer periphery of the via hole and partially covering the first pad, wherein a solder paste layer is printed on the second pad, and the second pad is electrically connected with the first pad and the via hole.

Description

Via hole structure of PCB

Technical Field

The utility model relates to a via hole, in particular to a via hole structure of a PCB (printed circuit board).

Background

At present, the efficiency of the existing ICT (In-Circuit Test) Test is low due to the defect of oxidation of VIA holes, because the VIA holes cannot be printed with solder paste and leak copper, and the copper is seriously oxidized In the air and after high-temperature welding, so that a Test needle cannot be well detected.

In view of the above, the present invention provides a via hole of a PCB, which can avoid the defect of low testing efficiency due to the defect of oxidation.

Disclosure of Invention

The utility model aims to provide a via hole structure which can avoid the defect of low testing efficiency caused by the defect of oxidation.

To achieve the above object, the present invention provides a via hole structure of a PCB, applied to a PCB, comprising:

a via hole penetrating through the PCB;

the first bonding pad is arranged on one surface of the PCB and surrounds the periphery of the through hole, and is used for electrically connecting the PCB and the through hole; and

and the second bonding pad extends out from the outer periphery of the through hole and partially covers the first bonding pad, a tin paste layer is printed on the second bonding pad, and the second bonding pad is in conductive connection with the first bonding pad and the through hole.

Preferably, the first pad has a copper-plated conductive layer.

Preferably, the second bonding pad has a copper-plated conductive layer under the solder paste layer.

Compared with the prior art, the via hole structure of the PCB board has the advantages that the second pad extends out of the periphery of the via hole on the basis of the original first pad, the test probe is directly contacted with the tin paste layer of the second pad, the tin paste layer is printed on the surface of the second pad, so that the test cannot be influenced, the defect of low test efficiency caused by the defect of oxidation can be avoided, and in addition, the test probe is not directly contacted with the first pad, so that the conducting layer of the first pad cannot be pierced, and the protection effect is realized.

[ description of the drawings ]

Fig. 1 is a schematic plan view of a via hole structure of a PCB according to the present invention.

[ detailed description ] embodiments

Referring to fig. 1, the present invention provides a via structure of a PCB, which is applied to a PCB 1 and includes a via 10, a first pad 11 and a second pad 12.

The via hole 10 penetrates through the PCB board 1.

The first pad 11 is disposed on a surface of the PCB 1 and surrounds a periphery of the via 10, for electrically connecting the PCB 1 and the via 10.

The second pad 12 extends from the outer periphery of the via hole 11 and partially covers the first pad 11, a solder paste layer (not labeled) is printed on the second pad 12, and the second pad 12 is electrically connected to the first pad 11 and the via hole 10.

When the conductivity of the via hole 10 is to be tested, the test probe can be directly contacted with the solder paste layer of the second pad 12, because the solder paste layer is printed on the surface of the second pad 12, the test probe cannot be affected if the solder paste layer is oxidized, and moreover, because the test probe does not directly contact with the first pad 11, the conductive layer of the first pad 11 cannot be pierced, in this embodiment, the conductive layer of the first pad 11 is a copper-plated conductive layer, and the second pad 12 has a copper-plated conductive layer below the solder paste layer.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (3)

1. The utility model provides a via hole structure of PCB board, it is applied to on a PCB board, its characterized in that contains:

a via hole penetrating through the PCB;

the first bonding pad is arranged on one surface of the PCB and surrounds the periphery of the through hole, and is used for electrically connecting the PCB and the through hole; and

and the second bonding pad extends out from the outer periphery of the through hole and partially covers the first bonding pad, a tin paste layer is printed on the second bonding pad, and the second bonding pad is in conductive connection with the first bonding pad and the through hole.

2. The via structure of PCB board of claim 1, wherein the first pad has a copper plated conductive layer.

3. The via structure of PCB of claim 2, wherein the second pad has a copper-plated conductive layer under the solder paste layer.

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