CN108448279A - An S-type connector and a chip test socket using the connector - Google Patents
An S-type connector and a chip test socket using the connector Download PDFInfo
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- CN108448279A CN108448279A CN201810212763.0A CN201810212763A CN108448279A CN 108448279 A CN108448279 A CN 108448279A CN 201810212763 A CN201810212763 A CN 201810212763A CN 108448279 A CN108448279 A CN 108448279A
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- 238000012360 testing method Methods 0.000 title claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
- H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
本发明公开了一种S型连接器及应用该连接器的芯片测试座。所述芯片测试座包括底座和顶盖,所述底座和所述顶盖固定连接,所述顶盖上设有芯片容纳槽,所述底座上设置有第一凹槽、第二凹槽以及若干插孔,所述插孔内设置有上述的S型连接器,所述的S型连接器在所述插孔内可沿底座上下方向移动,所述第一凹槽内设置有与其相匹配第一弹性部件,所述第二凹槽内设置有与其相匹配第二弹性部件,所述第一弹性部件和所述第二弹性部件分别与所述S型连接器的两个内圆弧连接。本发明通过在底座上设置可上下移动的S型连接器,在芯片测试时,芯片压合前后连接器的长度不变,从而使测试座的阻抗不变,使芯片的测试误差更小。
The invention discloses an S-type connector and a chip test seat using the connector. The chip test socket includes a base and a top cover, the base and the top cover are fixedly connected, the top cover is provided with a chip receiving groove, and the base is provided with a first groove, a second groove and several Jack, the above-mentioned S-shaped connector is arranged in the said jack, and the said S-shaped connector can move along the up and down direction of the base in the said jack, and the said first groove is provided with the matching first An elastic component, a second elastic component matched with the second groove is arranged in the second groove, and the first elastic component and the second elastic component are respectively connected with two inner circular arcs of the S-shaped connector. In the present invention, an S-shaped connector that can move up and down is arranged on the base. When the chip is tested, the length of the connector before and after the chip is pressed remains unchanged, so that the impedance of the test seat remains unchanged and the test error of the chip is smaller.
Description
技术领域technical field
本发明涉及电子产品测试领域,尤其涉及一种S型连接器及应用该连接器的芯片测试座。The invention relates to the field of electronic product testing, in particular to an S-shaped connector and a chip test socket using the connector.
背景技术Background technique
随着电子电路的集成化程度越来越高,为了节省空间、简化电路设计,将多种功能。的电路集成设计封装在一个芯片模块内,如SIP、SOC技术。通常这类芯片的金手指或者焊盘都比较小。为了能精准无误的测试SIP/SOC封装的芯片的各种指标参数,通常采用高精密的pogo pin模组制作专门的测试座进行导通测试。pogo pin是一种应用于手机等电子产品中的精密连接器,其由针轴、弹簧、针管三个基本部件通过精密仪器铆压预压之后形成的弹簧式探针,其内部有一个精密的弹簧结构。采用pogo pin制作的芯片测试片底座,芯片压合前和芯片压合后pogo pin的长度不同,长度不同导致pogo pin的阻抗不同,不利于芯片测试时的误差计算。With the increasing integration of electronic circuits, in order to save space and simplify circuit design, multiple functions are integrated. The advanced circuit integration design is packaged in a chip module, such as SIP, SOC technology. Usually the gold fingers or pads of this type of chip are relatively small. In order to accurately test various index parameters of SIP/SOC packaged chips, high-precision pogo pin modules are usually used to make special test sockets for conduction testing. Pogo pin is a precision connector used in mobile phones and other electronic products. It consists of three basic parts: needle shaft, spring and needle tube. It is a spring-type probe formed by riveting and pre-pressing with precision instruments. There is a precision pin inside. spring structure. The base of the chip test piece made of pogo pins has different lengths before and after chip bonding. The different lengths lead to different impedances of the pogo pins, which is not conducive to error calculation during chip testing.
发明内容Contents of the invention
为了解决上述技术问题,本发明的目的是提供一种在芯片压合前后测试座自身的阻抗保持不变的S型连接器及应用该连接器的芯片测试座。In order to solve the above-mentioned technical problems, the object of the present invention is to provide an S-type connector whose impedance of the test socket itself remains unchanged before and after chip pressing, and a chip test socket using the connector.
本发明所采用的技术方案是:一种S型连接器,其包括片状导体,其形状为S型,其一端设置有芯片接触部,另一端设置有PCB接触部。The technical solution adopted in the present invention is: an S-shaped connector, which includes a sheet-shaped conductor in an S-shaped shape, with a chip contact portion at one end and a PCB contact portion at the other end.
一种芯片测试座,其包括底座和顶盖,所述底座和所述顶盖固定连接,所述顶盖上设有芯片容纳槽,所述底座上设置有第一凹槽、第二凹槽以及若干插孔,所述插孔内设置有上述的S型连接器,所述的S型连接器在所述插孔内可沿底座上下方向移动,所述第一凹槽内设置有与其相匹配第一弹性部件,所述第二凹槽内设置有与其相匹配第二弹性部件,所述第一弹性部件和所述第二弹性部件分别与所述S型连接器的两个内圆弧连接。A chip test seat, which includes a base and a top cover, the base and the top cover are fixedly connected, the top cover is provided with a chip receiving groove, and the base is provided with a first groove and a second groove and a plurality of sockets, the above-mentioned S-shaped connectors are arranged in the sockets, and the S-shaped connectors can move along the up and down direction of the base in the sockets, and the corresponding sockets are arranged in the first groove. Match the first elastic part, the second groove is provided with a matching second elastic part, the first elastic part and the second elastic part are respectively connected with the two inner arcs of the S-shaped connector connect.
进一步,所述第一弹性部件与所述第二弹性部件位置不平行。Further, the positions of the first elastic component and the second elastic component are not parallel.
进一步,第一弹性部件与所述第二弹性部件位置均为弹性胶条。Further, the positions of the first elastic component and the second elastic component are both elastic rubber strips.
进一步,所述第一凹槽与第二凹槽均为圆形凹槽,所述第一弹性部件与所述第二弹性部件位置均为圆柱体胶条,所述第一凹槽的内径小于第一弹性部件的直径,所述第二凹槽的内径小于第二弹性部件的直径。Further, the first groove and the second groove are both circular grooves, the positions of the first elastic part and the second elastic part are cylindrical rubber strips, and the inner diameter of the first groove is less than The diameter of the first elastic component and the inner diameter of the second groove are smaller than the diameter of the second elastic component.
进一步,所述底座设有若干定位销,所述顶盖上设置有与所述若干定位稍一一对应的通孔。Further, the base is provided with several positioning pins, and the top cover is provided with through holes corresponding to the several positioning pins one by one.
进一步,所述芯片容纳槽的其中一组对边上分别设有缺口。Further, one pair of opposite sides of the chip receiving groove is respectively provided with notches.
进一步,所述底座上设有若干铜螺母。Further, several copper nuts are arranged on the base.
本发明的有益效果是:本发明通过在底座上设置可上下移动的S型连接器,并通过设置第一弹性部件和第二弹性部件,使S型连接器在压合后能够复位。本发明在芯片压合前后连接器的长度不变,从而测试座自身的阻抗保持不变,使芯片的测试误差更小,另外本发明无需采用Pogo pin弹性探针,使得测试座的制作成本降低。The beneficial effects of the present invention are: the present invention arranges the S-shaped connector movable up and down on the base, and provides the first elastic component and the second elastic component, so that the S-shaped connector can be reset after being pressed. In the present invention, the length of the connector remains unchanged before and after the chip is pressed, so that the impedance of the test seat itself remains unchanged, and the test error of the chip is smaller. In addition, the present invention does not need to use Pogo pin elastic probes, so that the production cost of the test seat is reduced. .
附图说明Description of drawings
下面结合附图对本发明的具体实施方式作进一步说明:The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing:
图1是本发明中S型连接器的结构图;Fig. 1 is a structural diagram of an S-type connector in the present invention;
图2是本发明中芯片测试座的整体示意图;Fig. 2 is the overall schematic diagram of the chip test seat in the present invention;
图3是本发明中芯片测试座的爆炸图;Fig. 3 is the exploded diagram of chip test seat among the present invention;
图4是本发明中S型连接器和第一弹性部件、第二弹性部件的装配图。Fig. 4 is an assembly diagram of the S-shaped connector, the first elastic component and the second elastic component in the present invention.
具体实施方式Detailed ways
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
如图1所示,其示出了一种S型连接器,其包括片状导体1,其形状为S型,其一端设置有芯片接触部2,另一端设置有PCB接触部3。片状导体1其材质为金属,优选采用铜。芯片接触部2用于与芯片的金手指或者焊盘连接,PCB接触部3用于与测试仪器的测试板连接。As shown in FIG. 1 , it shows an S-type connector, which includes a sheet conductor 1 in the shape of an S, with a chip contact portion 2 at one end and a PCB contact portion 3 at the other end. The sheet conductor 1 is made of metal, preferably copper. The chip contact part 2 is used for connecting with the golden finger or pad of the chip, and the PCB contact part 3 is used for connecting with the test board of the testing instrument.
如图2至图3所示,其示出了一种芯片测试座,其包括底座5和顶盖4,所述底座5和所述顶盖4固定连接,所述底座5设有若干定位销6,所述顶盖4上设置有与所述若干定位稍一一对应的通孔。顶盖4上设有芯片容纳槽7,芯片容纳槽7的形状大小与待测芯片想匹配。优选的,所述芯片容纳槽7的其中一组对边上分别设有缺口13,方便放置和取出待测芯片。底座上设置有第一凹槽8、第二凹槽9以及若干插孔10,所述插孔10内设置有上述的S型连接器,所述的S型连接器在所述插孔内可沿底座上下方向移动,所述第一凹槽8内设置有与其相匹配第一弹性部件11,所述第二凹槽9内设置有与其相匹配第二弹性部件12。第一弹性部件11与所述第二弹性部件12位置均为弹性胶条。As shown in Figures 2 to 3, it shows a chip test socket, which includes a base 5 and a top cover 4, the base 5 and the top cover 4 are fixedly connected, and the base 5 is provided with several positioning pins 6. The top cover 4 is provided with through holes corresponding to the plurality of positioning points one by one. The top cover 4 is provided with a chip receiving groove 7, and the shape and size of the chip receiving groove 7 are matched with the chip to be tested. Preferably, one pair of opposite sides of the chip receiving groove 7 is respectively provided with notches 13 to facilitate placement and removal of the chip to be tested. The base is provided with a first groove 8, a second groove 9 and several sockets 10, the socket 10 is provided with the above-mentioned S-type connector, and the S-type connector can be used in the socket Moving along the up and down direction of the base, the first groove 8 is provided with a matching first elastic member 11 , and the second groove 9 is provided with a matching second elastic member 12 . The positions of the first elastic component 11 and the second elastic component 12 are elastic strips.
优选的,所述第一凹槽8与第二凹槽9均为圆形凹槽,所述第一弹性部件11与所述第二弹性12部件位置均为圆柱体胶条,所述第一凹槽8的内径小于第一弹性部件11的直径,所述第二凹槽9的内径小于第二弹性部件12的直径。Preferably, the first groove 8 and the second groove 9 are circular grooves, and the positions of the first elastic part 11 and the second elastic part 12 are cylindrical rubber strips. The inner diameter of the groove 8 is smaller than the diameter of the first elastic component 11 , and the inner diameter of the second groove 9 is smaller than the diameter of the second elastic component 12 .
底座5上设有若干铜螺母14,顶盖4设置有对应通孔。当使用测试座测试芯片时,测试座放到测试仪器上,可通过螺母14固定。Several copper nuts 14 are provided on the base 5, and the top cover 4 is provided with corresponding through holes. When using the test socket to test the chip, the test socket is placed on the test instrument and can be fixed by the nut 14 .
如图4所示,所述第一弹性部件11和所述第二弹性部件12分别与所述S型连接器的两个内圆弧连接。所述第一弹性部件11与所述第二弹性部件12位置不平行。通过第一弹性部件11和第二弹性部件12,使S型连接器在压合后能够复位,在芯片测试时,芯片压合前后连接器的长度不变,从而使测试座的阻抗不变,使芯片的测试误差更小,另外本发明无需采用Pogo pin弹性探针,使得测试座的制作成本降低。As shown in FIG. 4 , the first elastic component 11 and the second elastic component 12 are respectively connected to two inner circular arcs of the S-shaped connector. The first elastic component 11 is not parallel to the second elastic component 12 . Through the first elastic member 11 and the second elastic member 12, the S-shaped connector can be reset after being pressed. When the chip is tested, the length of the connector before and after the chip is pressed remains unchanged, so that the impedance of the test socket remains unchanged. The test error of the chip is reduced, and the present invention does not need to use Pogo pin elastic probes, so that the production cost of the test seat is reduced.
以上是对本发明的较佳实施进行了具体说明,但本发明创造并不限于所述实施例,熟悉本领域的技术人员在不违背本发明精神的前提下还可做作出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围内。The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the described embodiments, and those skilled in the art can also make various equivalent deformations or replacements without violating the spirit of the present invention. , these equivalent modifications or replacements are all within the scope defined by the claims of the present application.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810212763.0A CN108448279A (en) | 2018-03-15 | 2018-03-15 | An S-type connector and a chip test socket using the connector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810212763.0A CN108448279A (en) | 2018-03-15 | 2018-03-15 | An S-type connector and a chip test socket using the connector |
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| CN108448279A true CN108448279A (en) | 2018-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810212763.0A Pending CN108448279A (en) | 2018-03-15 | 2018-03-15 | An S-type connector and a chip test socket using the connector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109188160A (en) * | 2018-11-02 | 2019-01-11 | 浙江万马集团特种电子电缆有限公司 | A kind of robot harness testing cassete |
| CN109884507A (en) * | 2019-03-20 | 2019-06-14 | 苏州和林微纳科技有限公司 | High frequency test socket for QFN chip |
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| US20080054924A1 (en) * | 2006-09-05 | 2008-03-06 | Wei Kuong Foong | Contact for interconnect system |
| KR101594993B1 (en) * | 2014-10-10 | 2016-02-17 | 정요채 | Test sockets for the semiconductor packages |
| CN105807213A (en) * | 2016-05-30 | 2016-07-27 | 青岛港湾职业技术学院 | Testing device for flat lead chip |
| CN208782077U (en) * | 2018-03-15 | 2019-04-23 | 深圳市鸿义通仪测有限公司 | A kind of chip test base |
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2018
- 2018-03-15 CN CN201810212763.0A patent/CN108448279A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080054924A1 (en) * | 2006-09-05 | 2008-03-06 | Wei Kuong Foong | Contact for interconnect system |
| KR101594993B1 (en) * | 2014-10-10 | 2016-02-17 | 정요채 | Test sockets for the semiconductor packages |
| CN105807213A (en) * | 2016-05-30 | 2016-07-27 | 青岛港湾职业技术学院 | Testing device for flat lead chip |
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| CN109188160A (en) * | 2018-11-02 | 2019-01-11 | 浙江万马集团特种电子电缆有限公司 | A kind of robot harness testing cassete |
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