CN217156675U

CN217156675U - Parallel connection type golden finger test piece

Info

Publication number: CN217156675U
Application number: CN202220154909.2U
Authority: CN
Inventors: 徐伟晋; 徐群武; 朱燕燕; 周德华; 梁家瑞; 周小峰
Original assignee: Dongguan Jinyue Hardware Technology Co ltd
Current assignee: Dongguan Jinyue Hardware Technology Co ltd
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2022-08-09
Anticipated expiration: 2032-01-20

Abstract

The utility model discloses a splice formula golden finger test piece, including beryllium copper two, location mounting hole, first afterbody line connection PCB and insulating colloid, beryllium copper two sets up in one side of golden finger piece, and beryllium copper two is provided with two, the front end and the rear end of beryllium copper two all are provided with beryllium copper three, beryllium copper two and beryllium copper three's below all is provided with beryllium copper one, first afterbody line connection PCB sets up the opposite side at golden finger piece, and first afterbody line connection PCB is provided with four, four first afterbody line connection PCB's below all is provided with second afterbody line connection PCB. The head of the utility model adopts high-hardness tungsten carbide copper and beryllium copper to weld, and has long service life and strong conductivity.

Description

Parallel connection type golden finger test piece

Technical Field

The utility model relates to a test piece technical field specifically is a concatenation formula golden finger test piece.

Background

Gold fingers (connecting fingers) are computer hardware such as: all signals between the memory bank and the memory slot, between the display card and the display card slot and the like are transmitted through the golden fingers. The gold finger consists of a plurality of golden conductive contacts, which are called "gold fingers" because their surfaces are gold plated and the conductive contacts are arranged like fingers. The gold finger is actually covered with a layer of gold on the copper-clad plate through an electroplating process, because the gold has extremely strong oxidation resistance, an internal circuit can be protected from being corroded, the electric conductivity is also very strong, signal loss can not be caused, and meanwhile, the gold has extremely strong ductility, so that the contact area between the contacts can be larger under proper pressure, the contact resistance is reduced, and the signal transmission efficiency is improved. Because the plating layer is only tens of microns thick, the plating layer is easy to wear, and therefore, the original piece with the golden finger is not required to be pulled out and inserted so as to prolong the service life. In the prior art, the gold finger test piece adopts the simplest beryllium copper to test an IC product, and the beryllium copper has poor wear resistance and quick replacement frequency under high-current and high-frequency tests, so that the cost is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a connect formula golden finger test piece, its head adopt high stereoplasm tungsten carbide copper to weld with beryllium copper, and life is high and electric conductive property is strong, has solved the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a parallel-connection type golden finger test piece comprises a second beryllium copper piece, positioning and mounting holes, a first tail circuit connecting PCB and an insulating colloid, wherein the second beryllium copper piece is arranged on one side of the golden finger piece, the number of the second beryllium copper piece is two, the front end and the rear end of the second beryllium copper piece are both provided with a third beryllium copper piece, the first beryllium copper piece is arranged below the second beryllium copper piece and the third beryllium copper piece, the first tail circuit connecting PCB is arranged on the other side of the golden finger piece, the number of the first tail circuit connecting PCBs is four, and the number of the four first tail circuit connecting PCBs is four.

Preferably, the thicknesses of the beryllium copper I, the beryllium copper II and the beryllium copper III are all 0.2 mm.

Preferably, the positioning and mounting holes are formed in the gold finger sheets, and two positioning and mounting holes are formed in the positioning and mounting holes.

Preferably, the insulating colloid is arranged on the outer wall of the gold finger piece.

Preferably, one end of each of the second beryllium copper and the third beryllium copper is welded and connected with a second head part hard tungsten carbide copper, and one end of the first beryllium copper is welded and connected with a first head part hard tungsten carbide copper.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a head adopts high stereoplasm tungsten carbide copper and beryllium copper to weld, and life is high and electric conductive property is strong, and the test is also more stable to reduced purchasing cost and shortened operating personnel and changed the time, can use widely.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a perspective view of the present invention;

fig. 4 is an enlarged view of a portion a of fig. 3 according to the present invention.

In the figure: 1. beryllium copper I; 2. beryllium copper II; 3. beryllium copper III; 4. positioning the mounting hole; 5. the first tail circuit is connected with the PCB; 6. the second tail circuit is connected with the PCB; 7. a first head cemented tungsten carbide copper; 8. second hard tungsten copper carbide head; 9. and insulating colloid.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, a parallel-connection type gold finger test strip includes two beryllium copper 2, a positioning mounting hole 4, a first tail line connection PCB5 and an insulating colloid 9, the two beryllium copper 2 are disposed on one side of the gold finger strip, the two beryllium copper 2 are disposed, the front end and the rear end of the two beryllium copper 2 are both provided with three beryllium copper 3, the lower portions of the two beryllium copper 2 and the three beryllium copper 3 are both provided with the first beryllium copper 1, the first tail line connection PCB5 is disposed on the other side of the gold finger strip, the number of the first tail line connection PCBs 5 is four, and the lower portions of the four first tail line connection PCBs 5 are both provided with a second tail line connection PCB 6.

The thicknesses of the first beryllium copper 1, the second beryllium copper 2 and the third beryllium copper 3 are all 0.2 mm.

The positioning mounting holes 4 are formed in the gold finger sheets, the two positioning mounting holes 4 are formed, and the positioning mounting holes 4 are convenient for installation and positioning of the gold finger sheets.

Insulating colloid 9 sets up on the outer wall of golden finger piece, and insulating colloid 9 has excellent insulating nature, and protection components and parts normally work under high-voltage environment.

One ends of the second beryllium copper 2 and the third beryllium copper 3 are respectively connected with a second head part hard tungsten carbide copper 8 in a welding mode, one end of the first beryllium copper 1 is connected with a first head part hard tungsten carbide copper 7 in a welding mode, the head part hard tungsten carbide copper and the beryllium copper are welded, the conductivity is stronger, and the service life is effectively prolonged.

In summary, the following steps: the utility model discloses the important position lies in head contact IC product and tests, adopts high stereoplasm tungsten carbide copper welding beryllium copper, replaces single beryllium copper test in the past after, and life improves 2 ~ 3 times, and tests more stably to reduce purchasing cost and shorten operating personnel change time.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a parallelly connected formula golden finger test piece, includes beryllium copper two (2), location mounting hole (4), first afterbody circuit connection PCB (5) and insulating colloid (9), its characterized in that: the gold finger piece is characterized in that the second beryllium copper (2) is arranged on one side of the gold finger piece, the two beryllium copper (2) are arranged, the third beryllium copper (3) is arranged at the front end and the rear end of the second beryllium copper (2), the first beryllium copper (1) is arranged below the second beryllium copper (2) and the third beryllium copper (3), the first tail circuit connecting PCB (5) is arranged on the other side of the gold finger piece, the number of the first tail circuit connecting PCBs (5) is four, and the number of the four first tail circuit connecting PCBs (5) is provided with the second tail circuit connecting PCB (6).

2. The jointed golden finger test strip of claim 1, wherein: the thicknesses of the beryllium copper I (1), the beryllium copper II (2) and the beryllium copper III (3) are all 0.2 mm.

3. The jointed golden finger test strip of claim 1, wherein: the positioning mounting holes (4) are formed in the gold finger sheets, and the number of the positioning mounting holes (4) is two.

4. The jointed golden finger test strip of claim 1, wherein: and the insulating colloid (9) is arranged on the outer wall of the gold finger piece.

5. The jointed golden finger test strip of claim 1, wherein: one ends of the second beryllium copper (2) and the third beryllium copper (3) are respectively welded with a second head part hard tungsten carbide copper (8), and one end of the first beryllium copper (1) is welded with a first head part hard tungsten carbide copper (7).