CN217156674U - Gold finger test piece capable of being positioned and installed - Google Patents
Gold finger test piece capable of being positioned and installed Download PDFInfo
- Publication number
- CN217156674U CN217156674U CN202220154887.XU CN202220154887U CN217156674U CN 217156674 U CN217156674 U CN 217156674U CN 202220154887 U CN202220154887 U CN 202220154887U CN 217156674 U CN217156674 U CN 217156674U
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- beryllium copper
- insulating colloid
- circuit connecting
- finger test
- test piece
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Abstract
The utility model discloses a golden finger test piece of installation can fix a position, including insulating colloid, the location mounting hole that is used for the installation is seted up to the top of insulating colloid, and the screw fixation hole with the screw butt joint is seted up to the insulating colloid top of location mounting hole side, the front end of insulating colloid is connected with beryllium copper test assembly, and line connection spare is installed to the tail end of insulating colloid, and beryllium copper test assembly includes beryllium copper, lower beryllium copper and the head carbide body. The utility model discloses can fix a position the golden finger test piece of installation, the quantity phase-match of subassembly in the quantity of subassembly and the beryllium copper test subassembly in the circuit connecting piece, this golden finger test piece important position lies in head carbide body contact IC product and tests, adopts beryllium copper and beryllium copper down in the high carbide welding, replaces single beryllium copper test in the past, and life improves 3 ~ 4 times, and tests more stably to reduce purchasing cost and shorten operating personnel change time.
Description
Technical Field
The utility model relates to a golden finger test piece technical field specifically is a golden finger test piece of installation can fix a position.
Background
The gold finger test piece adopts the simplest beryllium copper to test an IC product, the beryllium copper has poor wear resistance under high-current and high-frequency tests, and the replacement frequency is high, so that the cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a golden finger test piece of location installation, the quantity of subassembly in the circuit connecting piece and the quantity phase-match of subassembly in the beryllium copper test subassembly, this golden finger test piece important position lies in head carbide body contact IC product and tests, adopt beryllium copper and beryllium copper down in the high carbide welding, replace single beryllium copper test in the past, life improves 3 ~ 4 times, and the test is more stable, thereby reduce purchasing cost and shorten operating personnel change time, the problem among the prior art has been solved.
In order to achieve the above object, the utility model provides a following technical scheme: the golden finger test piece capable of being positioned and installed comprises an insulating colloid, a positioning installation hole used for installation is formed in the upper portion of the insulating colloid, a screw fixing hole in butt joint with a screw is formed in the upper portion of the insulating colloid at the side end of the positioning installation hole, the front end of the insulating colloid is connected with a beryllium copper test assembly, and a line connecting piece is installed at the tail end of the insulating colloid.
Preferably, the beryllium copper testing component comprises an upper beryllium copper, a lower beryllium copper and a head hard alloy body, one end of the upper beryllium copper and one end of the lower beryllium copper are fixed at the side end of the insulating colloid, and the other end of the upper beryllium copper and the other end of the lower beryllium copper are welded with the head hard alloy body.
Preferably, at least five groups of the upper beryllium copper, the lower beryllium copper and the head hard alloy body are arranged, and the front end of each group of the upper beryllium copper and the lower beryllium copper is welded with the head hard alloy body.
Preferably, the upper beryllium copper and the lower beryllium copper are both 0.3mm beryllium copper.
Preferably, the positioning mounting holes and the screw fixing holes are arranged in two groups, and the two groups of positioning mounting holes and the screw fixing holes are symmetrically arranged on the insulating colloid.
Preferably, the circuit connecting piece comprises an upper tail circuit connecting end and a lower tail circuit connecting end, one end of the upper tail circuit connecting end and one end of the lower tail circuit connecting end are both fixed on the insulating colloid, and the number of the components in the circuit connecting piece is matched with the number of the components in the beryllium copper testing component.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the golden finger test piece can be positioned and installed, the other ends of the upper beryllium copper and the lower beryllium copper are welded with the head hard alloy body, the upper beryllium copper, the lower beryllium copper and the head hard alloy body are not less than five groups, the front ends of the upper beryllium copper and the lower beryllium copper in each group are welded with the head hard alloy body, the upper beryllium copper and the lower beryllium copper are both 0.3mm beryllium copper, the positioning mounting holes and the screw fixing holes are respectively two groups, and the two groups of positioning mounting holes and the screw fixing holes are symmetrically arranged on the insulating colloid, the circuit connecting piece comprises an upper tail circuit connecting end and a lower tail circuit connecting end, the upper tail circuit connecting end and the lower tail circuit connecting end are both fixed on the insulating colloid, the number of the components in the circuit connecting piece is matched with the number of the components in the beryllium copper test component, the golden finger test piece is characterized in that the head hard alloy body contacts with an IC product for testing, the upper beryllium copper and the lower beryllium copper are welded by the high-hardness alloy, the previous single beryllium copper test is replaced, the service life is prolonged by 3-4 times, and the test is more stable, so that the purchase cost is reduced, and the replacement time of operators is shortened.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an overall structure front view of the present invention;
FIG. 3 is an enlarged view of the point A of FIG. 1 according to the present invention;
fig. 4 is a side view of the whole structure of the present invention.
In the figure: 1. insulating colloid; 2. positioning the mounting hole; 3. screw fixing holes; 4. a beryllium copper test component; 41. beryllium copper is coated; 42. beryllium copper is added; 43. a head cemented carbide body; 5. a line connector; 51. an upper tail line connection end; 52. lower tail circuit connection end.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a gold finger test piece capable of being positioned and mounted comprises an insulating colloid 1, a positioning mounting hole 2 for mounting is formed above the insulating colloid 1, a screw fixing hole 3 butted with a screw is formed above the insulating colloid 1 at the side end of the positioning mounting hole 2, a beryllium copper test assembly 4 is connected to the front end of the insulating colloid 1, a circuit connecting piece 5 is mounted at the tail end of the insulating colloid 1, the beryllium copper test assembly 4 comprises an upper beryllium copper 41, a lower beryllium copper 42 and a head hard alloy body 43, one end of the upper beryllium copper 41 and one end of the lower beryllium copper 42 are fixed at the side end of the insulating colloid 1, the other end of the upper beryllium copper 41 and the other end of the lower beryllium copper 42 are welded to the head hard alloy body 43, at least five groups of the upper beryllium copper 41, the lower beryllium copper 42 and the head hard alloy body 43 are arranged, and the front ends of the upper beryllium copper 41 and the lower beryllium copper 42 in each group are welded to the head hard alloy body 43, the upper beryllium copper 41 and the lower beryllium copper 42 are both 0.3mm beryllium copper, two groups of positioning and mounting holes 2 and two groups of screw fixing holes 3 are arranged, two groups of positioning and mounting holes 2 and screw fixing holes 3 are symmetrically arranged on the insulating colloid 1, the circuit connecting piece 5 comprises an upper tail circuit connecting end 51 and a lower tail circuit connecting end 52, one ends of the upper tail circuit connecting end 51 and the lower tail circuit connecting end 52 are both fixed on the insulating colloid 1, the number of components in the circuit connecting piece 5 is matched with that of the beryllium copper testing component 4, the important position of the golden finger test piece lies in that the head hard alloy body 43 contacts an IC product for testing, the upper beryllium copper 41 and the lower beryllium copper 42 are welded by high hard alloy to replace the previous single beryllium copper test, the service life is prolonged by 3-4 times, and the test is more stable, so that the purchase cost is reduced and the replacement time of an operator is shortened.
In summary, the following steps: the golden finger test piece capable of being positioned and installed in the utility model has the advantages that the other ends of the upper beryllium copper 41 and the lower beryllium copper 42 are welded with the head hard alloy body 43, at least five groups of the upper beryllium copper 41, the lower beryllium copper 42 and the head hard alloy body 43 are arranged, the front ends of the upper beryllium copper 41 and the lower beryllium copper 42 in each group are welded with the head hard alloy body 43, the upper beryllium copper 41 and the lower beryllium copper 42 are respectively 0.3mm beryllium copper, two groups of the positioning mounting holes 2 and the screw fixing holes 3 are arranged, the two groups of the positioning mounting holes 2 and the screw fixing holes 3 are symmetrically arranged on the insulating colloid 1, the circuit connecting piece 5 comprises an upper tail circuit connecting end 51 and a lower tail circuit connecting end 52, one ends of the upper tail circuit connecting end 51 and one end of the lower tail circuit connecting end 52 are fixed on the insulating colloid 1, the number of the components in the circuit connecting piece 5 is matched with the number of the components in the beryllium copper test component 4, the golden finger test piece is positioned in the head hard alloy body 43 contacting with the IC product for testing, the upper beryllium copper 41 and the lower beryllium copper 42 are welded by high-hardness alloy to replace the conventional single beryllium copper test, so that the service life is prolonged by 3-4 times, and the test is more stable, thereby reducing the purchase cost and shortening the replacement time of operators.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a golden finger test strip of location installation, includes insulating colloid (1), its characterized in that: the testing device is characterized in that a positioning mounting hole (2) for mounting is formed in the upper portion of the insulating colloid (1), a screw fixing hole (3) in butt joint with a screw is formed in the upper portion of the insulating colloid (1) at the side end of the positioning mounting hole (2), the front end of the insulating colloid (1) is connected with a beryllium copper testing component (4), and a line connecting piece (5) is mounted at the tail end of the insulating colloid (1).
2. The gold finger test strip capable of being positioned and installed according to claim 1, wherein: the beryllium copper testing component (4) comprises upper beryllium copper (41), lower beryllium copper (42) and a head hard alloy body (43), one end of the upper beryllium copper (41) and one end of the lower beryllium copper (42) are fixed at the side end of the insulating colloid (1), and the other end of the upper beryllium copper (41) and the other end of the lower beryllium copper (42) are welded with the head hard alloy body (43).
3. The gold finger test strip capable of being positioned and installed according to claim 2, wherein: at least five groups of upper beryllium copper (41), lower beryllium copper (42) and head hard alloy bodies (43) are arranged, and the front ends of the upper beryllium copper (41) and the lower beryllium copper (42) of each group are welded with the head hard alloy bodies (43).
4. The gold finger test strip capable of being positioned and installed according to claim 2, wherein: the upper beryllium copper (41) and the lower beryllium copper (42) are both 0.3mm beryllium copper.
5. The gold finger test strip capable of being positioned and installed according to claim 1, wherein: the positioning mounting holes (2) and the screw fixing holes (3) are arranged in two groups, and the two groups of positioning mounting holes (2) and the screw fixing holes (3) are symmetrically arranged on the insulating colloid (1).
6. The gold finger test strip capable of being positioned and installed according to claim 1, wherein: the circuit connecting piece (5) comprises an upper tail circuit connecting end (51) and a lower tail circuit connecting end (52), one end of the upper tail circuit connecting end (51) and one end of the lower tail circuit connecting end (52) are fixed on the insulating colloid (1), and the number of components in the circuit connecting piece (5) is matched with the number of components in the beryllium copper testing component (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220154887.XU CN217156674U (en) | 2022-01-20 | 2022-01-20 | Gold finger test piece capable of being positioned and installed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220154887.XU CN217156674U (en) | 2022-01-20 | 2022-01-20 | Gold finger test piece capable of being positioned and installed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217156674U true CN217156674U (en) | 2022-08-09 |
Family
ID=82688718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220154887.XU Active CN217156674U (en) | 2022-01-20 | 2022-01-20 | Gold finger test piece capable of being positioned and installed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217156674U (en) |
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2022
- 2022-01-20 CN CN202220154887.XU patent/CN217156674U/en active Active
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