CN214901887U - Wireless AP heat abstractor - Google Patents
Wireless AP heat abstractor Download PDFInfo
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- CN214901887U CN214901887U CN202121316038.1U CN202121316038U CN214901887U CN 214901887 U CN214901887 U CN 214901887U CN 202121316038 U CN202121316038 U CN 202121316038U CN 214901887 U CN214901887 U CN 214901887U
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- heat dissipation
- wireless
- heat
- dissipation body
- chip
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Abstract
The utility model discloses a wireless AP heat abstractor, including the mount pad, the cover is equipped with the heat dissipation body on the mount pad, and wireless AP sets up between heat dissipation body and mount pad, is provided with the heating panel between heat dissipation body and the wireless AP. The utility model discloses a copper aluminium combines cooling system, copper product heating panel and the inseparable laminating of chip, conduct the chip heat to the heating panel completely, then reach radiating effect with heat-conduction to the heat dissipation body.
Description
Technical Field
The utility model belongs to the technical field of, concretely relates to wireless AP heat abstractor.
Background
At present, when a wireless AP (access point) is installed, a single heat dissipation system is not available, the heat productivity of a chip is high, the temperature greatly affects the performance of the AP chip, and when the temperature of a working environment is high, the performance of the chip is reduced sharply, the communication effect is poor, and the normal working requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that not enough among the above-mentioned prior art is directed at, provide a wireless AP heat abstractor, solve among the current product because of the bad chip temperature of heat dissipation too high lead to AP communication performance to reduce the scheduling problem.
The utility model adopts the following technical scheme:
a wireless AP heat dissipation device comprises a mounting seat, wherein a heat dissipation body is sleeved on the mounting seat, a wireless AP is arranged between the heat dissipation body and the mounting seat, a heat dissipation plate is arranged between the heat dissipation body and the wireless AP, the heat dissipation body is of a circular structure, and heat dissipation fins are arranged on the surface of the heat dissipation body.
Specifically, the heat dissipation fins are of fan-shaped structures and are arranged along the radial direction of the heat dissipation body.
Further, the angle of fan-shaped structure is 0 ~ 360.
Further, the angle of the fan-shaped structure is 104 °.
Specifically, the heat dissipation body and the heat dissipation plate are connected through welding.
Specifically, the heat dissipation plate is a copper plate.
Specifically, wireless AP passes through the screw and is connected with heat dissipation body and mount pad respectively.
Specifically, the surface of the heat dissipation body is provided with a corrosion-resistant layer.
Specifically, the surface of the base is provided with a corrosion-resistant layer.
Specifically, the base is movably connected with the heat dissipation body.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
the utility model relates to a wireless AP heat abstractor, because of the chip calorific capacity is more concentrated, it can't effectively derive the heat simply to use traditional aluminum alloy (coefficient of heat conductivity is 96 ~ 180W/m.K) heat dissipation, and red copper coefficient of heat conductivity is up to 400W/m.K, so adopt red copper material heating panel earlier can effectively evenly leading-in heating panel with the chip calorific capacity, increase heat source heating surface area in other words, the heating panel is again through the solder paste welding with the radiator, the face of weld thermal resistance can neglect, therefore the heat can effectively lead-in to the radiator, and dispel the heat through the fin on the radiator, thereby reduce the chip temperature, guarantee communication performance.
Furthermore, the heat dissipation mode comprises three modes of convection, radiation and conduction, the scheme adopts a natural convection mode, the natural convection mainly depends on effective heat dissipation area to dissipate heat, the heat dissipation area of the heat dissipation device is greatly increased by using the fins, and the heat of the chip can be conducted to the surfaces of the fins to dissipate heat.
Furthermore, the fins are arranged along the radial direction of the heat dissipation body in a sunflower type mode, so that surrounding cold air can smoothly enter gaps among the fins, and heat on the fins is taken away.
Furthermore, the structure of the fan-shaped heat dissipation fin mainly depends on the heating power and the position of the chip, and the higher the power is, the larger the heat dissipation area is required, and the larger the fan-shaped angle is.
Further, what heat dissipation body and heating panel adopted is the tin cream welding mode, can guarantee that the tin cream filling rate is more than 90%, and heat dissipation body and heating panel contact surface almost are the complete contact promptly, do not have the clearance, if there is the clearance in the contact surface, just have air filling, and the heat conductivity of air is the range upon range of, and the heat just can't effectively be derived.
Furthermore, the heat dissipation plate is made of red copper, because the heat conductivity coefficient of the red copper is far higher than that of the aluminum alloy by 400W/m.K, and is 96-180W/m.K, the heat of the chip can be more completely and uniformly conducted to the copper plate with a larger area and then conducted to the heat dissipation body. If use the aluminum alloy or directly let heat dissipation body and chip laminating, because of the chip face of generating heat is too little, the heat is very concentrated, even the heat dissipation body has sufficient heat radiating area, also can be because the heat is too concentrated and can't carry out effective heat dissipation.
Furthermore, when AP is fixed, heat-conducting silicone grease with the thickness of 0.1mm needs to be evenly coated on the heating chip, and then the heating chip and the heat dissipation plate are tightly attached through fixing by screws.
Furthermore, the surface of the heat dissipation body is subjected to powder spraying surface treatment, so that the requirements of color, attractiveness and corrosion resistance are met, and the surface of the heat dissipation body can be prevented from being corroded when the heat dissipation body is used in a severe environment (such as high temperature and high humidity).
Furthermore, the surface of the base is subjected to powder spraying surface treatment, so that the requirements of color, attractiveness and corrosion resistance are met, and the surface of the heat dissipation body can be prevented from being corroded when the base is used in a severe environment (such as high temperature and high humidity).
Furthermore, the base is movably connected with the heat dissipation body, so that the heat dissipation body is easy to disassemble, assemble and maintain.
To sum up, the utility model discloses a copper aluminium combines cooling system, and the copper product heating panel closely laminates with the chip, conducts the chip heat to the heating panel completely, then reaches radiating effect with heat-conduction to the heat dissipation body.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Wherein: 1. a heat dissipation body; 2. a heat dissipation plate; 3. a wireless AP; 4. a screw; 5. and (7) mounting a seat.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it should be noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or several components may exist at the same time. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; either mechanically or electrically, and may be internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
It should be further noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, the utility model discloses a wireless AP heat abstractor, including heat dissipation body 1, heating panel 2, wireless AP3, screw 4 and mount pad 5, wireless AP3 sets up in mount pad 5, and wireless AP3 passes through screw 4 to be connected with heat dissipation body 1, is provided with heating panel 2 between heat dissipation body 1 and the wireless AP 3.
The heat dissipation body 1 is radially provided with heat dissipation fins of a fan-shaped structure, the angle of each heat dissipation fin is 104 degrees, the angle is determined according to the power and the position of a chip, and the adjustment range is 0-360 degrees.
The heat dissipation body 1 and the heat dissipation plate 2 are welded together by using solder paste to form an AP heat dissipation system, and the wireless AP3 is fixed on the assembly of the heat dissipation body 1 and the heat dissipation plate 2 through screws 4.
The heat dissipation body 1 is made of aluminum alloy, and a corrosion-resistant layer is formed by surface powder spraying treatment.
The heat sink 2 is made of red copper.
The base 5 is made of aluminum alloy, and a corrosion-resistant layer is formed by surface powder spraying treatment.
The base 5 is fixed to the heat dissipation body 1 by screws.
To sum up, the utility model discloses wireless AP heat abstractor adopts copper aluminium to combine cooling system, and the radiating mode is natural convection, and simple structure effectively dispels the heat to calorific capacity centralized chip, has reduced the chip temperature, has improved wireless AP's communication performance.
The above contents are only for explaining the technical idea of the present invention, and the protection scope of the present invention cannot be limited thereby, and any modification made on the basis of the technical solution according to the technical idea of the present invention all fall within the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a wireless AP heat abstractor, its characterized in that includes mount pad (5), and the cover is equipped with heat dissipation body (1) on mount pad (5), and wireless AP (3) set up between heat dissipation body (1) and mount pad (5), is provided with heating panel (2) between heat dissipation body (1) and wireless AP (3), and heat dissipation body (1) is circular structure, and the surface is provided with heat radiation fins.
2. The heat sink for wireless APs according to claim 1, wherein the heat sink fins are fan-shaped and arranged along the radial direction of the heat sink body (1).
3. The wireless AP heat dissipation device of claim 2, wherein the angle of the fan-shaped structure is 0-360 °.
4. The wireless AP heat sink of claim 3, wherein the angle of the fan-shaped structure is 104 °.
5. The wireless AP heat dissipation device according to claim 1, wherein the heat dissipation body (1) and the heat dissipation plate (2) are connected by welding.
6. The wireless AP heat dissipation device according to claim 1, wherein the heat dissipation plate (2) is a copper plate.
7. The wireless AP heat dissipation device according to claim 1, wherein the wireless AP (3) is connected with the heat dissipation body (1) and the mounting seat (5) through screws (4).
8. The wireless AP heat sink according to claim 1, wherein the surface of the heat sink body (1) is provided with a corrosion-resistant layer.
9. The wireless AP heat sink according to claim 1, wherein a surface of the mount (5) is provided with a corrosion-resistant layer.
10. The heat dissipation device for wireless APs according to claim 1, wherein the mounting base (5) is movably connected with the heat dissipation body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121316038.1U CN214901887U (en) | 2021-06-11 | 2021-06-11 | Wireless AP heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121316038.1U CN214901887U (en) | 2021-06-11 | 2021-06-11 | Wireless AP heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214901887U true CN214901887U (en) | 2021-11-26 |
Family
ID=78899610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121316038.1U Active CN214901887U (en) | 2021-06-11 | 2021-06-11 | Wireless AP heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214901887U (en) |
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2021
- 2021-06-11 CN CN202121316038.1U patent/CN214901887U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230517 Address after: Room 517, 5th Floor, Building 23, Jiangsu Information Service Industry Base, Guangling District, Yangzhou City, Jiangsu Province, 225006 Patentee after: Zhonghuan Mathematical Science (Jiangsu) Intelligent Technology Co.,Ltd. Address before: No.1-2, 15th floor, building G2, HUanpu science and Technology Industrial Park, tianguqi Road, Yunshui 1st Road, high tech Zone, Xi'an, Shaanxi 710000 Patentee before: Shaanxi Hanlin Yixun Intelligent Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |