CN220511525U - Micro-control high-conductivity heat dissipation power unit - Google Patents
Micro-control high-conductivity heat dissipation power unit Download PDFInfo
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- CN220511525U CN220511525U CN202321742348.9U CN202321742348U CN220511525U CN 220511525 U CN220511525 U CN 220511525U CN 202321742348 U CN202321742348 U CN 202321742348U CN 220511525 U CN220511525 U CN 220511525U
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- heat
- plate
- heat dissipation
- cabinet body
- conducting plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 73
- 238000003466 welding Methods 0.000 claims abstract description 25
- 238000009434 installation Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a micro-control high-conductivity heat dissipation power unit which comprises a heat conduction plate, a heat dissipation plate, a cabinet body and a fan, wherein the heat conduction plate is arranged on the cabinet body; the heat-conducting plate is fixedly connected with the cabinet body; the intelligent modules and the control modules are fixedly connected to the heat conducting plate through fixing screws; the heat-conducting plates are welded and fixed with a plurality of heat-radiating plates, the heat-radiating plates are arranged in parallel, and the heat-radiating plates are arranged in the cabinet body; the side part of the cabinet body is fixedly connected with a fan; the heat-conducting plate is of an integrated structure, the back surface of the heat-conducting plate is provided with a welding groove which is of a ladder-shaped structure, a heat exchange cavity is formed at the bottom of the welding groove, and a concave heat exchange core is fixed in the heat exchange cavity. The advantages are that: the integrated installation is convenient, and the volume is reduced. The heat dissipation plate adopts a drawing process, and the heat dissipation plate substrate and the heat dissipation fins form an integrated structure, so that the generation of contact thermal resistance between the heat dissipation fins and the heat dissipation plate is avoided, and the heat dissipation capacity of the heat dissipation plate is improved. Meanwhile, the processing technology of the radiating plate is simplified, and the mass production efficiency of products is improved.
Description
Technical Field
The utility model belongs to the field of high-conductivity heat dissipation, and particularly relates to a micro-control high-conductivity heat dissipation power unit for an intelligent control system.
Background
The heat pipe radiating module for controlling the power supply radiating in the first generation radiating system provided by a company for domestic special clients has stable and consistent technical indexes of various batches of products provided for the clients through the application of the clients for more than ten years, and is highly trusted and praised by the clients. At present, with the continuous innovation of new technologies and new technologies, the cooperation of a company and a client is continuously expanded, and the development work of upgrading and improving the heat dissipation device of a certain intelligent control system is carried out according to the latest development task requirements of the client. The original heat dissipation product type is a profile cooling mode and a water cooling mode, and the two modes have various defects in the aspects of heat dissipation power and use environment. With the development of intelligent technology, integration, intellectualization, platformization and miniaturization have become the significative assessment index of modern advanced intelligent control systems, and the original heat dissipation mode has become a key factor for restricting the research and development of new generation intelligent control systems.
In the prior art, patent application number CN202220949949.6 discloses a radiating superconducting module for a multifunctional control power supply, a cabinet body structure is adopted to seal a superconducting unit in the radiating superconducting module, so that integrated installation is convenient, and the volume is reduced. The lower part of the superconducting inner core is increased in the whole thickness, the heat exchange capacity of the lower reinforcing core is improved, the heat dissipation of the lower power supply module is met, and the heat dissipation requirement of the integrated layout of various power supply modules is met due to the arrangement of the superconducting inner core. The technical scheme adopts the superconducting inner core to improve the heat exchange capacity, but can only meet the heat dissipation of the lower power supply module, and has a narrow application range.
In order to meet the heat dissipation requirement of a new generation intelligent control system, the vacuum high-efficiency heat conduction technology is combined with the existing mature profile drawing technology and the shoveling wing technology to develop a novel high-conductivity heat dissipation power unit, so that the development of the novel high-conductivity heat dissipation power unit becomes a necessary way for solving the heat dissipation technical problem.
Disclosure of Invention
The utility model aims to provide a micro-control high-conductivity heat dissipation power unit, which improves heat dissipation efficiency, reduces volume and weight, and meets the requirement of a radiator in batches on the basis of meeting the heat dissipation requirement of an intelligent control system.
In order to achieve the above purpose, the present utility model is realized by the following technical scheme:
a micro-control high-conductivity heat dissipation power unit comprises a heat conduction plate, a heat dissipation plate, a cabinet body and a fan; the heat-conducting plate is fixedly connected with the front part of the cabinet body by a fastener; the intelligent modules and the control modules are fixedly connected to the heat conducting plate through fixing screws; the heat-conducting plates are welded and fixed with a plurality of heat-radiating plates, the heat-radiating plates are arranged in parallel, and the heat-radiating plates are arranged in the cabinet body; the side part of the cabinet body is fixedly connected with a fan;
the heat conducting plate is of an integrated structure and comprises a heat conducting plate counter bore, a welding groove, a heat exchange cavity and a concave heat exchange core; the periphery of the heat conducting plate is fixedly connected with the cabinet body; the front surface of the heat conducting plate is provided with a threaded hole I, and the threaded hole I is a blind hole; the back of the heat conducting plate is provided with a welding groove which is of a ladder-shaped structure, a heat exchange cavity is formed at the bottom of the welding groove, and a concave heat exchange core is fixed in the heat exchange cavity;
the heat dissipation plate comprises a heat dissipation plate base body and a sealing gasket, wherein the heat dissipation plate base body is of an integrated structure and comprises intracavity heat exchange rib sheets, heat dissipation fins, through cavities and heat transfer cavities, a plurality of heat transfer cavities are formed in the heat dissipation plate base body in a drawing mode, intracavity heat exchange rib sheets are arranged between the heat transfer cavities, and the inner part of the cold end of the heat dissipation plate base body is welded and sealed with the sealing gasket; the heat end of the heat-dissipating plate substrate is provided with a through cavity which is communicated with the heat transfer cavities, and the heat end of the heat-dissipating plate substrate is welded with the welding groove of the heat-conducting plate, so that the through cavity is communicated with the concave heat exchange core; the front and/or back of the heat dissipation plate base body is provided with a plurality of heat dissipation fins.
The cabinet body is of an integrated structure and comprises a hanging ring, a heat conducting plate mounting frame, a nut, a fixing plate, a fan mounting groove, an air outlet and an air inlet frame; the hanging ring is fixedly connected to the upper part of the cabinet body; the heat conducting plate installation frame and the cabinet body are integrally formed, and nuts for fixing the heat conducting plate are welded inside the heat conducting plate installation frame; the rear part of the cabinet body is provided with a fixed plate, and the fixed plate is provided with a through hole for connecting with the end part of the heat dissipation plate; one side of the cabinet body is provided with a fan installation groove, an air outlet is formed in the fan installation groove, and the other side of the cabinet body is provided with an air inlet frame.
The cabinet body is made of steel plates or aluminum plates.
The heat dissipation plate is made of copper plates or aluminum plates.
The sealing gasket is provided with a threaded hole II which is a blind hole.
The heat exchange cavity is fixedly connected with the concave heat exchange core in a sintering, welding or crimping mode.
Compared with the prior art, the utility model has the beneficial effects that:
1. a little accuse high heat dissipation power unit that leads for intelligent control system adopts cabinet body structure to seal the heating panel in it, and convenient integration installation reduces the volume.
2. The concave heat exchange core structure is adopted in the heat exchange cavity inside the heat conducting plate, so that the heat exchange area of the heat conducting plate is increased, and the heat exchange capacity of the heat conducting plate is improved.
3. The heat conducting plate and the heat radiating plate are manufactured by adopting a welding and sealing process, and the heat exchanging cavity of the heat conducting plate is directly communicated with the heat transferring cavity of the heat radiating plate through the through cavity, so that the heat on the heat conducting plate is successfully transferred to the heat transferring cavity of the heat radiating plate directly, the generation of contact thermal resistance in the heat conducting process is avoided, and the heat transferring capability of the product is further improved.
4. The heat dissipation plate adopts a drawing process, and the heat dissipation plate substrate and the heat dissipation fins form an integrated structure, so that the generation of contact thermal resistance between the heat dissipation fins and the heat dissipation plate is avoided, and the heat dissipation capacity of the heat dissipation plate is improved. Meanwhile, the processing technology of the cooling plate is simplified, the mass production efficiency of products is improved, the production cost of the cooling plate is reduced, and great assistance is provided for mass market application of the products.
Drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is a left side view of the present utility model.
Fig. 3 is a top view of the present utility model.
Fig. 4 is a front view of the cabinet.
Fig. 5 is a right side view of the cabinet.
FIG. 6 is a top view of the cabinet
Fig. 7 is a front view of the heat conductive plate.
Fig. 8 is a side view of a thermally conductive plate.
Fig. 9 is a rear view of the thermally conductive plate.
Fig. 10 is a sectional view of a heat sink.
Fig. 11 is a schematic view of a hot end structure of a heat dissipating plate.
Fig. 12 is a schematic view of a cold end structure of the heat dissipating plate.
Fig. 13 is a front view of the gasket.
Fig. 14 is a cross-sectional view of the gasket.
Fig. 15 is a schematic structural view of a concave heat exchange core.
In the figure: 1-a heat conducting plate 2-an intelligent module 3-a control module 4-a heat radiating plate 5-a heat radiating plate 6-a heat radiating plate three 7-a cabinet 8-a fixing screw 9-a countersunk screw 10-a fan 11-a lifting ring 12-a heat conducting plate mounting frame 13-a nut 14-a fixing plate 15-a through hole 16-a fan mounting groove 17-an air outlet 18-a fan fixing nut 19-an air inlet frame 20-a heat conducting plate counter bore 21-a threaded hole I22-a welding groove 23-a heat exchanging cavity 24-a concave heat exchanging core 25-a heat radiating plate substrate 26-an intracavity heat exchanging rib 27-a heat radiating fin 28-a through cavity 29-a welding flux 30-a sealing gasket 31-a threaded hole II 32-a heat transferring cavity.
Detailed Description
The present utility model will be described in detail below with reference to the drawings of the specification, but it should be noted that the practice of the present utility model is not limited to the following embodiments.
1-3, a micro-control high-conductivity heat dissipation power unit comprises a heat conduction plate 1, a heat dissipation plate, a cabinet 7 and a fan 10; the heat-conducting plate 1 is fixedly connected with the front part of the cabinet body 7 by adopting countersunk screws 9. The intelligent modules 2 and the control modules 3 are fixedly connected to the heat conducting plate 1 through fixing screws 8, and the intelligent modules 2 and the control modules 3 are arranged on the heat conducting plate 1 in a certain rule; the heat-conducting plate 1 and a plurality of heat-radiating plates are welded and fixed by adopting welding flux 29, the heat-radiating plates are mutually arranged in parallel, and the heat-radiating plates are arranged in the cabinet 7; the side of the cabinet 7 is fixedly connected with a fan 10 by bolts. The heat dissipation plate can be a first heat dissipation plate 4, a second heat dissipation plate 5 and a third heat dissipation plate 6 which are identical in three different sizes and structures, and the first heat dissipation plate 4, the second heat dissipation plate 5 and the third heat dissipation plate 6 are made of copper materials or aluminum materials.
Referring to fig. 7-9 and 15, the heat-conducting plate 1 is integrated and comprises a heat-conducting plate counter bore 20, a welding groove 22, a heat exchange cavity 23 and a concave heat exchange core 24; a plurality of heat-conducting plate counter bores 20 which are regularly arranged are processed on the periphery of the heat-conducting plate 1, and countersunk screws 9 pass through the heat-conducting plate counter bores 20 to fix the heat-conducting plate 1 on the heat-conducting plate mounting frame 12 of the cabinet 7; the front surface of the heat-conducting plate 1 is provided with a threaded hole I21, the threaded hole I21 is a blind hole, and the intelligent module 2 and the control module 3 are fixed on the heat-conducting plate 1 through screw connection by the threaded hole I21; the back of the heat conducting plate 1 is provided with a welding groove 22, the welding groove 22 is of a ladder-shaped structure, a heat exchange cavity 23 is formed at the bottom of the welding groove 22, and a concave heat exchange core 24 (such as a capillary structure in a heat pipe) is fixed in the heat exchange cavity 23; the heat exchange cavity 23 is fixedly connected with the concave heat exchange core 24 in a sintering, welding or crimping mode. The heat-conducting plate 1 and the concave heat-exchanging core 24 are made of copper materials and aluminum materials.
Referring to fig. 10-14, the heat dissipating plate comprises a heat dissipating plate substrate 25 and a sealing pad 30, the heat dissipating plate substrate 25 is in an integrated structure, and comprises an intracavity heat exchanging fin 26, a heat dissipating fin 27, a through cavity 28 and a heat transferring cavity 32, wherein a plurality of heat transferring cavities 32 are formed in the heat dissipating plate substrate 25 by drawing, the intracavity heat exchanging fin 26 is arranged between the heat transferring cavities 32, the intracavity heat exchanging fin 26 and the heat transferring cavities 32 can be formed in one step by adopting a drawing process,
the cold end inside of the heat radiation plate base 25 is welded and sealed with the sealing gasket 30; the hot end of the heat-dissipating plate matrix 25 is provided with a through cavity 28, the through cavity 28 is communicated with a plurality of heat transfer cavities 32, and the hot end of the heat-dissipating plate matrix 25 is welded with the welding groove 22 of the heat-conducting plate 1, so that the through cavity 28 is communicated with the concave heat exchange core 24; the heat ends of the heat-dissipating plate substrates 25 are placed on the welding grooves 22 of the heat-conducting plate 1 in a one-to-one correspondence, and are welded and sealed with the sealing grooves of the heat-conducting plate 1 by adopting the welding flux 29. The front and/or back of the heat-dissipating plate base 25 is provided with a plurality of heat-dissipating fins 27, the heat-dissipating fins 27 are directly processed and formed on the heat-dissipating plate base 25 by adopting a shoveling fin process, and the heat-dissipating fins 27 and the heat-dissipating plate base 25 are of an integrated structure. The sealing gasket 30 is provided with a threaded hole II 31, and the threaded hole II 31 is a blind hole. The fixing bolt is matched and fastened with the threaded hole II 31 to fix the cold end of the radiating plate on the fixing plate 14 of the cabinet 7. The sealing gasket 30 is made of copper or aluminum;
referring to fig. 4-6, the cabinet 7 is of an integrated structure and comprises a hanging ring 11, a heat conducting plate mounting frame 12, a nut 13, a fixing plate 14, a fan mounting groove 16, an air outlet 17 and an air inlet frame 19; the hanging ring 11 is fixedly connected to the upper part of the cabinet body 7 and is fixedly connected through threads; the heat conducting plate mounting frame 12 and the cabinet body 7 are integrally formed, and nuts 13 which are tightly matched with countersunk head screws 9 for fixing the heat conducting plate 1 are welded around the inner part of the heat conducting plate mounting frame 12; the rear part of the cabinet body 7 is provided with a fixed plate 14, through holes 15 which are regularly arranged are processed on the fixed plate 14, bolts penetrate through the through holes 15 of the fixed plate 14 and are tightly matched with threaded holes II 31 at the cold end of the radiating plate, and the radiating plate is fixed in the cabinet body 7; a fan mounting groove 16 is formed in one side of the cabinet 7, a plurality of air outlets 17 are formed in the fan mounting groove 16, a certain number of regularly arranged fan fixing nuts 18 are welded in the cabinet 7 around the air outlets 17, and the fan 10 is fixed outside the air outlets 17 of the fan mounting groove 16 of the cabinet 7 by adopting threaded matching of bolts and the fan fixing nuts 18; the other side of the cabinet 7 is provided with an air inlet frame 19. The cabinet body 7 is made of steel plates or aluminum plates, and a welding process is adopted at the four-frame flanging interface of the cabinet body 7 to form an integrated structure; the inner and outer surfaces of the cabinet body 7 are subjected to corrosion prevention treatment by adopting electrophoresis, spraying or galvanization technology.
Claims (6)
1. The micro-control high-conductivity heat dissipation power unit is characterized by comprising a heat conduction plate, a heat dissipation plate, a cabinet body and a fan; the heat-conducting plate is fixedly connected with the front part of the cabinet body by a fastener; the intelligent modules and the control modules are fixedly connected to the heat conducting plate through fixing screws; the heat-conducting plates are welded and fixed with a plurality of heat-radiating plates, the heat-radiating plates are arranged in parallel, and the heat-radiating plates are arranged in the cabinet body; the side part of the cabinet body is fixedly connected with a fan;
the heat conducting plate is of an integrated structure and comprises a heat conducting plate counter bore, a welding groove, a heat exchange cavity and a concave heat exchange core; the periphery of the heat conducting plate is fixedly connected with the cabinet body; the front surface of the heat conducting plate is provided with a threaded hole I, and the threaded hole I is a blind hole; the back of the heat conducting plate is provided with a welding groove which is of a ladder-shaped structure, a heat exchange cavity is formed at the bottom of the welding groove, and a concave heat exchange core is fixed in the heat exchange cavity;
the heat dissipation plate comprises a heat dissipation plate base body and a sealing gasket, wherein the heat dissipation plate base body is of an integrated structure and comprises intracavity heat exchange rib sheets, heat dissipation fins, through cavities and heat transfer cavities, a plurality of heat transfer cavities are formed in the heat dissipation plate base body in a drawing mode, intracavity heat exchange rib sheets are arranged between the heat transfer cavities, and the inner part of the cold end of the heat dissipation plate base body is welded and sealed with the sealing gasket; the heat end of the heat-dissipating plate substrate is provided with a through cavity which is communicated with the heat transfer cavities, and the heat end of the heat-dissipating plate substrate is welded with the welding groove of the heat-conducting plate, so that the through cavity is communicated with the concave heat exchange core; the front and/or back of the heat dissipation plate base body is provided with a plurality of heat dissipation fins.
2. The micro-control high-conductivity heat dissipation power unit according to claim 1, wherein the cabinet body is of an integrated structure and comprises a hanging ring, a heat conducting plate mounting frame, a nut, a fixing plate, a fan mounting groove, an air outlet and an air inlet frame; the hanging ring is fixedly connected to the upper part of the cabinet body; the heat conducting plate installation frame and the cabinet body are integrally formed, and nuts for fixing the heat conducting plate are welded inside the heat conducting plate installation frame; the rear part of the cabinet body is provided with a fixed plate, and the fixed plate is provided with a through hole for connecting with the end part of the heat dissipation plate; one side of the cabinet body is provided with a fan installation groove, an air outlet is formed in the fan installation groove, and the other side of the cabinet body is provided with an air inlet frame.
3. The micro-control high-conductivity heat dissipation power unit according to claim 2, wherein the cabinet body is made of steel plates or aluminum plates.
4. The micro-control high-conductivity heat dissipation power unit according to claim 1, wherein the heat dissipation plate is made of a copper plate or an aluminum plate.
5. The micro-control high-conductivity heat dissipation power unit according to claim 1, wherein the sealing gasket is provided with a threaded hole II, and the threaded hole II is a blind hole.
6. The micro-control high-conductivity heat dissipation power unit according to claim 1, wherein the heat exchange cavity is fixedly connected with the concave heat exchange core in a sintering, welding or crimping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321742348.9U CN220511525U (en) | 2023-07-04 | 2023-07-04 | Micro-control high-conductivity heat dissipation power unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321742348.9U CN220511525U (en) | 2023-07-04 | 2023-07-04 | Micro-control high-conductivity heat dissipation power unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511525U true CN220511525U (en) | 2024-02-20 |
Family
ID=89869431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321742348.9U Active CN220511525U (en) | 2023-07-04 | 2023-07-04 | Micro-control high-conductivity heat dissipation power unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511525U (en) |
-
2023
- 2023-07-04 CN CN202321742348.9U patent/CN220511525U/en active Active
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