CN206260190U - A kind of vacuum sealed radiating structure - Google Patents
A kind of vacuum sealed radiating structure Download PDFInfo
- Publication number
- CN206260190U CN206260190U CN201621138714.XU CN201621138714U CN206260190U CN 206260190 U CN206260190 U CN 206260190U CN 201621138714 U CN201621138714 U CN 201621138714U CN 206260190 U CN206260190 U CN 206260190U
- Authority
- CN
- China
- Prior art keywords
- electronic system
- metal substrate
- groove
- layer
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000001816 cooling Methods 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 29
- 239000002826 coolant Substances 0.000 claims description 12
- 238000005086 pumping Methods 0.000 claims description 7
- 238000005728 strengthening Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 230000035772 mutation Effects 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 27
- 238000005516 engineering process Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- -1 tin silk Chemical compound 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of vacuum sealed radiating structure, including electronic system, seal base, wherein, the electronic system includes metal substrate and electronic component, the metal substrate upper surface connects up, welds the electronic component, the metal substrate lower surface processes the cooling bath of bending, the processing of cooling bath outside individual layer or the double-layer seal groove, the flange connecting hole that the individual layer or the processing of double-layer seal groove outside are engaged with seal base.The utility model simplifies overall system architecture, reduces volume, mitigates weight raising heat exchanger effectiveness, realizes the self heat dissipation function of electronic system.
Description
Technical field
The utility model is related to a kind of vacuum sealed radiating structure, is particularly suited for radiating certainly for electronic system.
Background technology
In modern industry environment, increasingly progress greatly with production technology, the advancing by leaps and bounds of information calculating speed, memory technology day
Benefit is increased sharply, emerge in large numbers a large amount of high-power systems for realize control, calculate, the function, such as embedded high-power chip or device such as transmission
The electronic system of part.To ensure that powerful electronic system is normally run, various air-cooled, medium cooling heat sinks occur in succession, will
Air cooling fin is sealed with the heat sink of heat eliminating medium and is realized and electronic system by modes such as welding, crimping, bolt connections
Close-coupled, by taking away the waste heat of high-power system with heat sink heat exchange, realizes the radiating of electronic system.
Previous envelope radiator structure is as shown in figure 1, be provided with cooling pipe 33, coldplate 44 is welded on heat sink 22 on heat sink 22
Connect sealing cooling pipe 33.In the course of work of electronic system 11, circulating cooling medium, electronic system 11 are passed through in cooling pipe 33
The heat of upper generation carries out heat exchange by coldplate 44 with the cooling medium of circulation, reaches radiating purpose.Such radiating side
The subject matter of formula is to complete thermal coupling by coldplate 44 between heat eliminating medium and radiating element, and its thermal coupling effect is received
It is formed on the laminating degree of the processing, welding of coldplate 44 between uniformity, and coldplate 44 and electronic system 11.Heat sink 22 He
The thermal deformation produced in the welding process of coldplate 44 or the face of weld of out-of-flatness, cause the He of electronic system 11 in assembling process
Coldplate 44 cannot be brought into close contact, so as to produce portion of air interlayer, the air layer in heat exchanging process between two plates
Heat transfer efficiency is far smaller than metal material, influences thermal coupling efficiency.
Utility model content
The utility model discloses a kind of vacuum sealed radiating structure, including electronic system 2, seal base 6, wherein, institute
Stating electronic system 2 includes metal substrate and electronic component 1, and the metal substrate upper surface connects up, welds electronics unit device
Part 1, the metal substrate lower surface processes the cooling bath 5 of bending, the processing of the outside of the cooling bath 5 individual layer or double-layer seal
The flange connecting hole that groove 3, the individual layer or the processing of the outside of double-layer seal groove 3 are engaged with seal base 6.
Preferably, one central seal groove 3 of processing in the middle of the metal substrate of electronic system 2.
Preferably, the processing interlayer pumping groove 4 in the middle of double-layer seal groove 3, installs pumping adapter, even on seal base 6
Mechanical pump is connect, the cooling medium gone out from ground floor sealing leak is detached.
Preferably, the cooling bath 5 of metal substrate lower surface is the cooling bath being evenly arranged.
Preferably, the cooling bath 5 of metal substrate lower surface is the cooling bath of nonuniform mutation operator, is needing to strengthen heat dissipation region
Increase cooling groove density and realize that local strengthening is heated.
The invention also discloses a kind of electronic system from radiator structure, including electronic system 2, seal base 6, its
In, the electronic system 2 includes metal substrate and electronic component 1, and the metal substrate upper surface connects up, welds the electronics
Component 1, the metal substrate lower surface processes overall groove structure 55；Distributing fin 7 is processed on seal base 6 to cold
But the flow direction of medium is planned, or distributing fin 7 is processed inside the overall groove structure 55 of the substrate of electronic system 2；Institute
State the processing of the outside of overall groove structure 55 individual layer or double-layer seal groove 3, the individual layer or the processing of the outside of double-layer seal groove 3 with
The flange connecting hole that seal base 6 is engaged.
Preferably, rubber o-ring or solid wire ring or bullet are used in individual layer or double-layer seal groove, central seal groove
Property metal, the sealing of completion is tightened by bolt.
The utility model mainly solves following technical problem：(1) Department of Electronics being adapted to heat eliminating medium directly contact is provided
System baseplate material, using metal material as electronic system substrate, the metal material coefficient of heat conduction is high, is conducive to high power device
The quick heat exchange of part；(2) by heat eliminating medium passageway machining in electronic system substrate, system is made no longer to need heat dispersion heat sink, letter
Change overall system architecture, reduce volume, mitigate weight, realize the self heat dissipation function of electronic system；(3) electronic system base is realized
The sealing of heat eliminating medium in plate；(4) the strengthening local cooling technology of the high-power component of electronic system is realized；(5) this practicality is new
Type processes heat eliminating medium passage or heat eliminating medium flow-guiding structure on the metal substrate of electronic system, makes heat eliminating medium in electricity
Circulation, i.e. heat eliminating medium and electronic system directly contact are completed in the metal substrate of subsystem, heat exchanger effectiveness is improved, electricity is realized
The self heat dissipation function of sub- system.
Brief description of the drawings
Fig. 1 is：Previous vacuum sealed radiating structure；
Fig. 2 is：The vacuum sealing of the electronic system according to embodiment 1 is from radiator structure；
Fig. 3 is：The vacuum sealing of the electronic system according to embodiment 2 is from radiator structure；
Fig. 4 is：The vacuum sealing of the electronic system according to embodiment 3 is from radiator structure；
Fig. 5 is：Non-homogeneous cooling bath sectional view of the vacuum sealing of the electronic system according to embodiment 4 from radiator structure；
Fig. 6 is：Non-homogeneous cooling bath top view of the vacuum sealing of the electronic system according to embodiment 4 from radiator structure；
Fig. 7 is：The vacuum sealing of the electronic system according to embodiment 5 is from radiator structure.
Specific embodiment
The utility model is made with detailed description below in conjunction with drawings and Examples：
As shown in Fig. 2 the utility model discloses a kind of vacuum sealing of electronic system from radiator structure, in electronic system
Heat eliminating medium groove is processed on substrate, and the heat eliminating medium for circulating is filled with, heat eliminating medium in electronic system internal flow, directly
Contacted with electronic system, there is provided good radiating efficiency.
Wherein, electronic system 2 uses metal substrate, and one side metal substrate thermal conductivity factor is big compared to polymeric substrates, leads
Hot property preferably, be easy to process heat eliminating medium passage, and the good ductility in its surface is just by another aspect metal material substrate
In the sealing of heat eliminating medium.Depending on metal substrate thickness is according to substrate strength and pressure cooling medium, it is proposed that metal substrate thickness
More than 4mm.The wiring of metal substrate upper surface, welding electronic component 1, metal substrate lower surface processing cooling bath 5, cooling bath 5
Outside processes individual layer or double-layer seal groove 3 is used for the sealing of cooling medium, individual layer or the processing of double-layer seal groove outside with it is close
The flange connecting hole that back cover plate 6 is engaged.After completing the machining of metal substrate lower surface, insulating layer coating and waterproof layer are applied,
Ensure the insulating properties of lower surface.
It is effective sealing of cooling medium in cooling bath 5 in completion metal substrate, the utility model is matched somebody with somebody using double-layer seal
The sealing means of co-clip layer pumping.Embodiment 1 as shown in Figure 2, the metal substrate lower surface processing double-layer seal groove of electronic system 2
3, rubber o-ring, the solid wire ring such as soft gold such as tin silk, annealing copper wire, filamentary silver, indium silk, aluminium wire, spun gold can be used in seal groove
Category, elastic metallic such as hollow metal O-ring, c-type circle etc., or liquid metal etc., sealing ring is according to the actual requirements and pretightning force
Selection.The sealing between the cooling bath 5 and seal base 6 that complete electronic system 2 is tightened finally by bolt.Double-layer seal groove 3
Centre processing interlayer pumping groove 4, installs pumping adapter on seal base 6, connects mechanical pump, and detaching may seal from ground floor
The cooling medium for leaking out, is further ensured that sealing effectiveness.
The electronic system 2 larger for the length of side, edge compresses the effect for being not enough to reach excellent sealing, can be in electronic system
Central seal groove 3 strengthens sealing, embodiment as shown in Figure 32, using more soft material together for processing in the middle of 2 metal substrate
Material completes to seal as sealing ring.When close pressure cooling medium is excessive, metal substrate and the core of seal base 6 need to be reduced
During deflection, fastening bolt can be installed to strengthen center thrust in heart position in a substrate.
Can select the requirement of the leak rate of cooling medium and type of refrigerant and pressure more practical close according to system
Seal structure, double-layer sealing structure, Huo Zhedan can also be selected in addition to double-layer seal described above coordinates interlayer air extraction structure
Layer sealing structure, embodiment as shown in Figure 43.
Uniform cooling bath embodiment is applied to the electronic system of power relative equilibrium above, for locally lying in high power consumption
Element need strengthening local cooling electronic system can using the non-homogeneous cooling bath 5 of embodiment 4 as shown in Figure 5 and Figure 6,
The method for strengthening heat dissipation region increase cooling groove density is needed to realize that local strengthening is heated.Such as Fig. 5, the right side electricity of electronic system 2
Sub- component is more concentrated, and the side cooling bath design is more intensive.The design of cooling bath 5 is adjusted flexibly according to actual needs, and
It is not limited to the embodiment.Fig. 5 is non-homogeneous cooling bath sectional view, and Fig. 6 is non-homogeneous cooling bath top view.
Be opened in cooling medium guiding gutter on electronic system substrate by above example, also can as shown in Fig. 7 embodiments 5,
Overall groove structure 55 is milled out on the substrate of electronic system 2, stream of the distributing fin 7 to cooling medium is processed on seal base 6
To being planned, or distributing fin 7 is processed inside the overall groove 5 of the substrate of electronic system 2.
Above example is plane pressing sealing structure, by plane by sealing ring individual layer or double-layer seal groove,
Crimp in central seal groove, reaches sealing effectiveness, in figure by taking rectangular channel as an example, is not limited to the utility model, its
His shape seal groove, such as dovetail groove, half slot, triangular groove etc. can apply in the sealing structure, seal loop-shaped
Can be chosen according to actual conditions, for example circle, rectangle, square, I-shaped etc..
The above, only the utility model preferably specific embodiment, but protection domain of the present utility model is not
This is confined to, any one skilled in the art can readily occur in the technical scope that the utility model is disclosed
Change or replacement, should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with
The scope of the claims is defined.
Claims (7)
1. a kind of vacuum sealed radiating structure, including electronic system (2), seal base (6), wherein, electronic system (2) bag
Metal substrate and electronic component (1) are included, the metal substrate upper surface connects up, welds the electronic component (1), the gold
Category base lower surface processes the cooling bath (5) of bending, and cooling bath (5) outside processes individual layer or double-layer seal groove (3),
The flange connecting hole that the individual layer or the processing of double-layer seal groove (3) outside are engaged with seal base (6).
2. vacuum sealed radiating structure as claimed in claim 1, it is characterised in that in the metal substrate of electronic system (2)
Between processing central seal groove (3) together.
3. vacuum sealed radiating structure as claimed in claim 1, it is characterised in that the processed clip in the middle of double-layer seal groove (3)
Layer pumping groove (4), on seal base (6) install pumping adapter, connect mechanical pump, detach from ground floor sealing leak go out it is cold
But medium.
4. vacuum sealed radiating structure as claimed in claim 1, it is characterised in that the cooling bath (5) of metal substrate lower surface
It is the cooling bath being evenly arranged.
5. vacuum sealed radiating structure as claimed in claim 1, it is characterised in that the cooling bath (5) of metal substrate lower surface
It is the cooling bath of nonuniform mutation operator, realizes that local strengthening is heated needing reinforcement heat dissipation region to increase cooling groove density.
6. a kind of vacuum sealed radiating structure, including electronic system (2), seal base (6), wherein, electronic system (2) bag
Metal substrate and electronic component (1) are included, the metal substrate upper surface connects up, welds the electronic component (1), the gold
Category base lower surface processes overall groove structure (55)；Distributing fin (7) is processed on seal base (6) to cooling medium
Flow direction is planned, or distributing fin (7) is processed into internal in the overall groove structure (55) of electronic system (2) substrate；It is described
The overall processing of groove structure (55) outside individual layer or double-layer seal groove (3), the individual layer or double-layer seal groove (3) outside add
The flange connecting hole that work is engaged with seal base (6).
7. the vacuum sealed radiating structure as any one of claim 1-6, it is characterised in that individual layer or double-layer seal
Rubber o-ring or solid wire ring or elastic metallic are used in groove, central seal groove, the sealing of completion is tightened by bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621138714.XU CN206260190U (en) | 2016-10-19 | 2016-10-19 | A kind of vacuum sealed radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621138714.XU CN206260190U (en) | 2016-10-19 | 2016-10-19 | A kind of vacuum sealed radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206260190U true CN206260190U (en) | 2017-06-16 |
Family
ID=59023239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621138714.XU Active CN206260190U (en) | 2016-10-19 | 2016-10-19 | A kind of vacuum sealed radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206260190U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496108A (en) * | 2018-11-23 | 2019-03-19 | 李洪刚 | A kind of phase-change heat sink manufacture craft |
-
2016
- 2016-10-19 CN CN201621138714.XU patent/CN206260190U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496108A (en) * | 2018-11-23 | 2019-03-19 | 李洪刚 | A kind of phase-change heat sink manufacture craft |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100499980C (en) | Radiation fin assembly and heat radiating device applied the same | |
| US11156409B2 (en) | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | |
| CN105870081A (en) | Waveform micro-channel heat exchanger | |
| CN201667332U (en) | Semiconductor power module | |
| CN106535564A (en) | Liquid cooling type heat radiator | |
| TW201810560A (en) | Power module and manufacturing method thereof | |
| CN206024380U (en) | Air-cooled radiator heat pipe press-loading process structure | |
| CN108260331A (en) | It is a kind of to carry efficient radiator using double-side efficient water-cooling spiral structure | |
| CN209517844U (en) | A kind of power cell radiator structure | |
| CN206260190U (en) | A kind of vacuum sealed radiating structure | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN201138905Y (en) | Integrate heat radiating device under condition of small space and multiple heat supplies | |
| CN209731686U (en) | A kind of circuit board | |
| CN209729888U (en) | High reliablity heat radiation module | |
| CN206075226U (en) | A kind of bus type heat pipe type water-cooling heat radiating system | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN101707192A (en) | Heat-radiation packaging structure and method for packaging high-power component pipe core thereof | |
| CN106304811B (en) | A kind of electronic system from radiator structure | |
| CN207744321U (en) | It is a kind of to carry efficient radiator using double-side efficient water-cooling spiral structure | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| CN217363612U (en) | Heat pipe mounting structure of radiator | |
| CN210381441U (en) | High-temperature-resistant circuit board | |
| CN208157417U (en) | A kind of power tube | |
| CN114850811A (en) | Method for processing radiator | |
| CN113438868A (en) | Ultrathin heat dissipation device and heat dissipation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200820 Address after: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee after: Institute of Microelectronics of the Chinese Academy of Sciences Address before: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee before: Aerospace Information Research Institute,Chinese Academy of Sciences Effective date of registration: 20200820 Address after: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee after: Aerospace Information Research Institute,Chinese Academy of Sciences Address before: 9 Dengzhuang South Road, Haidian District, Beijing 100094 Patentee before: Academy of Opto-Electronics, Chinese Academy of Sciences |