CN107484394A - A kind of power amplifier - Google Patents
A kind of power amplifier Download PDFInfo
- Publication number
- CN107484394A CN107484394A CN201710817757.3A CN201710817757A CN107484394A CN 107484394 A CN107484394 A CN 107484394A CN 201710817757 A CN201710817757 A CN 201710817757A CN 107484394 A CN107484394 A CN 107484394A
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- aluminium base
- pcb board
- heating power
- power component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 56
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000010438 heat treatment Methods 0.000 claims abstract description 52
- 239000004411 aluminium Substances 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 25
- 239000002184 metal Substances 0.000 abstract description 25
- 239000004519 grease Substances 0.000 abstract description 10
- 229920001296 polysiloxane Polymers 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 230000001788 irregular Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 101150095744 tin-9.1 gene Proteins 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Abstract
The embodiment of the invention discloses a kind of power amplifier, by heating power component be fixed on by way of paster with the aluminium base of power amplifier cage connection, non- heating power component is fixed on pcb board, aluminium base and pcb board are provided separately and be electrically connected with, realize to lead the heat that heating power component is sent by aluminium base and radiated on power amplifier shell, solve to connect metal heat sink in heating power component surface at present and smear the mode of heat-conducting silicone grease between metal heat sink and heating power component and radiated the process and difficulty that existing increase assembling processes, heat-conducting silicone grease, which smears the irregular bubble that easily produces, reduces the technical problem of radiating effect.
Description
Technical field
The present invention relates to power amplifier field, more particularly to a kind of power amplifier.
Background technology
Power amplifier (English name：Power amplifier), referred to as " power amplifier ", refer in given distortion rate condition
Under, maximum power output can be produced to drive the amplifier of a certain load (such as loudspeaker).Power amplifier is in whole sound equipment
The pivotal role of " tissue, coordination " is served in system, can dominate whole system to a certain extent provide good sound
Matter exports.
Due to the limitation of conversion efficiency, a part of electric energy is inevitably converted into heat energy in amplification process.This portion
Divide heat energy to be radiated using metal heat sink, just can guarantee that the safe and stable operation of equipment.Existing power amplifier
Radiating mode be：Using plug-in type power component, and the mode being screwed, the power component of heat will be produced
It is fixed on huge aluminium radiator or copper metal heat sink, the heat on the power component of heating is transmitted to gold
Belong to radiator, then heat is blown to beyond cabinet by heavy caliber fan, reaches the purpose of radiating.
But there are many technical problems in existing radiating mode.First, plug-in type power component is fixed using screw
On metal heat sink so that the radiating surface of heating power component is connected with metal heat sink but is difficult to accomplish to completely attach to,
Air gap inevitably is produced in contact surface, the conduction of heat is greatly hindered, causes in heating power component
Heat timely can not be transmitted on radiator, do not reach expected radiating effect, endanger the safety of heating power component.
Although this problem can be alleviated by way of smearing heat-conducting silicone grease, the process and difficulty of assembling processing are the increase in,
And heat-conducting silicone grease smearing is irregular still to produce thermal resistance air bubble, and the requirement to packaging technology is higher.
Secondly, the radiating surface of most of heating power component is connected with internal electrode, its electricity of different components
It is extremely different.Because radiator is aluminum or copper material, it is electric conductor, different types of heating power component is fixed on
When on same metal heat sink, it is necessary to be dielectrically separated from using the insulating concrete mica plate of high withstand voltage, significantly increase production
The technology difficulty of assembling, and cost is higher.
Then, because radiating element is closed in cabinet inside, cabinet becomes the obturator of heat, hinders dissipating for heat
Hair, so needing to increase aluminum or copper metal heat sink volume, in advance sharing the high temperature of heating power component
On huge metal heat sink, then blown out again by fan outside cabinet, can be only achieved the purpose of radiating；And aluminum or copper
The price of matter metal heat sink is very expensive, the cost of the product directly improved, and adds the weight of product.
Finally, using plug-in type heating power component and the mode of metal heat sink is screwed in, it is necessary to people
Work is secondary, and each heating power component is fixed with screw, very big to artificial consuming, and in order to ensure product
It is attractive in appearance, it is necessary to which the position of component fixed to each screw is controlled, production efficiency is relatively low.
The content of the invention
The embodiment of the invention discloses a kind of power amplifier, and heating power component is fixed on by way of paster
With on the aluminium base of power amplifier cage connection, non-heating power component being fixed on pcb board, by aluminium base and PCB
Plate is provided separately and is electrically connected with, and realizes the heat that heating power component is sent leading power amplifier by aluminium base
Radiated on shell, solve and connect metal heat sink and in metal heat sink and hair in heating power component surface at present
The mode that heat-conducting silicone grease is smeared between thermal power component is radiated the process and difficulty, heat conduction that existing increase assembling processes
Silicone grease, which smears the irregular bubble that easily produces, reduces the technical problem of radiating effect.
The embodiments of the invention provide power amplifier, including：Power amplifier shell, it is fixed on the power amplifier
Aluminium base, heating power component, pcb board, non-heating power component on inner surface of outer cover；
The heating power component is fixed on by way of paster on the aluminium base；
The non-heating power component is fixed on the pcb board；
The pcb board is fixed on above the aluminium base；
Circuit on the pcb board is electrically connected with the circuit on the aluminium base.
Preferably,
The power amplifier also includes conductive stud；
Circuit on the pcb board is electrically connected with by the circuit on the conductive stud and the aluminium base.
Preferably,
The conductive stud is copper stud.
Preferably,
The power amplifier also includes conductive screw；
Positioning hole is provided with the pcb board and the aluminium base；
The conductive stud is provided at both ends with screw hole；
The conductive screw is connected through the positioning hole with the conductive stud.
Preferably,
Heat emission hole is provided with the power amplifier shell.
Preferably,
Ventilating duct is formed between the pcb board and the aluminium base；
The heat emission hole is arranged on stating on power amplifier shell at the ventilating duct port.
Preferably,
Radiator fan is provided with ventilating duct between the pcb board and the aluminium base.
Preferably,
The radiator fan is arranged on the end of the ventilating duct.
Preferably,
The power amplifier shell is connected side with the aluminium base and is provided with radiator.
Preferably,
The spreader surface is provided with some grooves, for increasing heat radiation area.
As can be seen from the above technical solutions, the embodiment of the present invention has advantages below：
1st, the embodiments of the invention provide a kind of power amplifier, heating power component is fixed by way of paster
With on the aluminium base of power amplifier cage connection, non-heating power component is fixed on pcb board, by aluminium base and
Pcb board is provided separately and is electrically connected with, and realizes and the heat that heating power component is sent is led into power by aluminium base put
Radiated on big device shell, eliminate the metal heat sink of power amplifier enclosure, greatly reduce product into
This, while the volume of whole power amplifier is also greatly reduced, associated packaging, transport and warehouse cost are reduced,
Solve at present heating power component surface connect metal heat sink and metal heat sink and heating power component it
Between smear the mode of heat-conducting silicone grease and radiated the process and difficulty, the irregular appearance of heat-conducting silicone grease smearing of existing increase assembling processing
Being also easy to produce bubble reduces the technical problem of radiating effect, and the radiating surface of heating power component is by way of welding and aluminium
Substrate completely attaches to, and the phenomenon of thermal resistance air-gap is not present in inside, it can be ensured that the heat inside heating power component can
Quickly it is transmitted to completely on aluminium base, and then is transmitted on power amplifier shell and is radiated；Consolidated by way of paster
It is scheduled on can be replaced manually to heating power using SMT machine Surface Mount technologies on the aluminium base of power amplifier cage connection
The processes such as the plug-in unit of component, installation, cost of labor is both effectively reduced, and can ensures the aesthetic property of product, and lifts production
The uniformity of product.
2nd, because the radiating surface of most of heating power component is connected with internal electrode, its electricity of different components
It is extremely different, and radiator is aluminum or copper material, is electric conductor, so different types of heating power component is fixed
When on same metal heat sink, it is necessary to be dielectrically separated from using the insulating concrete mica plate of high withstand voltage, significantly increase life
The technology difficulty of assembling is produced, and cost is higher, therefore a kind of power amplifier use provided in an embodiment of the present invention will generate heat
Power component is fixed on aluminium base by way of paster, because aluminium base carries insulating barrier, so volume need not be set
Outer insulating materials, reduce the technology difficulty and cost of generation assembling.
3rd, the embodiments of the invention provide a kind of power amplifier, by high thermal conductivity aluminum matrix plate in assembling directly with metal machine
Bottom portion large area is connected, and metal chassis is changed into the absorber of heat by the obstruction body of heat, instead of heat dissipation metal
The function of device, and directly externally radiated using the huge surface of metal chassis, significantly improve the effect of radiating.
4th, the embodiments of the invention provide a kind of power amplifier, heating power component is fixed by way of paster
With on the aluminium base of power amplifier cage connection, non-heating power component is fixed on pcb board, by aluminium base and
Pcb board is arranged to double-layer structure up and down, so that the aluminium base by non-heating power component and heating power component and high temperature
Plate separates, and effectively solves influence of the temperature to common component working life, improves the service life of product；Meanwhile aluminium base
A complete ventilating duct is formd between plate and pcb board, using the compression of ventilating duct, even if the radiation air using very little
Fan can produce higher wind speed, so as to quickly exclude the surface temperature of heating power component outside cabinet.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is a kind of internal structure schematic diagram of the power amplifier provided in the embodiment of the present invention；
Fig. 2 is that heating power component is combined with aluminium base in a kind of power amplifier provided in the embodiment of the present invention
Schematic diagram；
Fig. 3 is a kind of radiating schematic diagram of the power amplifier provided in the embodiment of the present invention.
Embodiment
The embodiment of the invention discloses a kind of power amplifier, and heating power component 8 is fixed by way of paster
On the aluminium base 2 being connected with power amplifier shell 7, non-heating power component 8 is fixed on pcb board 1, by aluminium base
2 and pcb board 1 be provided separately and be electrically connected with, realize and lead the heat that heating power component 8 is sent by aluminium base 2
Radiated on power amplifier shell 7, solve and connect metal heat sink on the surface of heating power component 8 at present and in gold
The mode that heat-conducting silicone grease is smeared between category radiator and heating power component 8 is radiated the work that existing increase assembling is processed
Sequence and difficulty, heat-conducting silicone grease, which smear the irregular bubble that easily produces, reduces the technical problem of radiating effect.
Fig. 1 to Fig. 3 is referred to, a kind of one embodiment of the power amplifier provided in the embodiment of the present invention includes：Work(
Rate amplifier shell 7, the aluminium base 2 being fixed on the inner surface of power amplifier shell 7, heating power component 8, pcb board 1,
Non- heating power component 8, heating power component 8 are fixed on by way of paster on aluminium base 2, non-heating power member device
Part 8 is fixed on pcb board 1, and pcb board 1 is fixed on above aluminium base 2, and the circuit on pcb board 1 and the circuit on aluminium base 2 are electrical
Connection；It should be noted that as shown in Fig. 2 aluminium base 2 is a kind of metal-based copper-clad plate with good heat radiating function, typically
It is made up of three-decker, is circuit layer (copper foil) 10, insulating barrier 11 and metal-based layer 12 respectively, heating power component 8 is
It is welded on circuit layer (copper foil) 10 by scolding tin 9, is combined into one the function of pcb board and metal heat sink so as to realize.
Power amplifier can also include conductive stud 3, the circuit on pcb board 1 pass through conductive stud 3 with aluminium base 2
Circuit be electrically connected with, wherein conductive stud 3 be preferably copper stud.
Power amplifier also includes conductive screw 4, and positioning hole, 3 liang of conductive stud are provided with pcb board 1 and aluminium base 2
End is provided with screw hole, and conductive screw 4 is connected through positioning hole with conductive stud 3.
In order to strengthen the radiating effect of power amplifier, heat emission hole 6 is provided with power amplifier shell 7, and pcb board 1
Ventilating duct is formed between aluminium base 2, heat emission hole 6 is preferably provided at stating on power amplifier shell 7 at ventilating duct port；
Radiator fan 5 is also provided with ventilating duct between pcb board 1 and aluminium base 2, radiator fan 5 is preferably provided at ventilating duct
End.
In order to further strengthen the radiating effect of power amplifier, side is connected with aluminium base 2 in power amplifier shell 7
Radiator 13 is also provided with, the surface of radiator 13 is provided with some grooves 14, for increasing heat radiation area；Need what is illustrated
It is that radiator 13 be able to can also be separately provided, if radiator with the integrative-structure of power amplifier shell 7 (as shown in Figure 2)
13 are structure as a whole with power amplifier shell 7, then radiator 13 can see a part for power amplifier shell 7.
As shown in figure 3, arrow represents a kind of radiating schematic diagram of power amplifier provided in an embodiment of the present invention in figure.
A kind of power amplifier provided by the present invention is described in detail above, for the general technology of this area
Personnel, according to the thought of the embodiment of the present invention, there will be changes in specific embodiments and applications, to sum up, this
Description should not be construed as limiting the invention.
Claims (10)
- A kind of 1. power amplifier, it is characterised in that including：Power amplifier shell, it is fixed on the power amplifier shell Aluminium base, heating power component, pcb board, non-heating power component on inner surface；The heating power component is fixed on by way of paster on the aluminium base；The non-heating power component is fixed on the pcb board；The pcb board is fixed on above the aluminium base；Circuit on the pcb board is electrically connected with the circuit on the aluminium base.
- 2. power amplifier according to claim 1, it is characterised in that also including conductive stud；Circuit on the pcb board is electrically connected with by the circuit on the conductive stud and the aluminium base.
- 3. power amplifier according to claim 2, it is characterised in that the conductive stud is copper stud.
- 4. power amplifier according to claim 2, it is characterised in that also including conductive screw；Positioning hole is provided with the pcb board and the aluminium base；The conductive stud is provided at both ends with screw hole；The conductive screw is connected through the positioning hole with the conductive stud.
- 5. according to the power amplifier described in claim 1, it is characterised in that be provided with radiating on the power amplifier shell Hole.
- 6. according to the power amplifier described in claim 5, it is characterised in that formed between the pcb board and the aluminium base logical Air channel；The heat emission hole is arranged on stating on power amplifier shell at the ventilating duct port.
- 7. according to the power amplifier described in claim 6, it is characterised in that the ventilation between the pcb board and the aluminium base Radiator fan is provided with road.
- 8. according to the power amplifier described in claim 7, it is characterised in that the radiator fan is arranged on the end of the ventilating duct Portion.
- 9. power amplifier according to claim 1, it is characterised in that the power amplifier shell and the aluminium base Connection side is provided with radiator.
- 10. power amplifier according to claim 9, it is characterised in that the spreader surface is provided with some grooves, For increasing heat radiation area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817757.3A CN107484394A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817757.3A CN107484394A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107484394A true CN107484394A (en) | 2017-12-15 |
Family
ID=60584307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710817757.3A Pending CN107484394A (en) | 2017-09-12 | 2017-09-12 | A kind of power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484394A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387803A (en) * | 2018-04-26 | 2018-08-10 | 艾乐德电子（南京）有限公司 | A kind of electronic load test device |
| CN108463051A (en) * | 2018-03-28 | 2018-08-28 | 珠海松下马达有限公司 | A kind of servo-driver |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2883448A1 (en) * | 2005-03-17 | 2006-09-22 | Siemens Vdo Automotive Sas | Amplifier/radio receiving set for car, has radiator evacuating heat dissipated by power amplifier, which is placed between printed circuit board and radiator, and screws for maintaining amplifier in support on radiator |
| CN200969664Y (en) * | 2006-05-12 | 2007-10-31 | 杨忠广 | Minisize waterproof vehicle mounted audio-frequency amplifier |
| CN202135321U (en) * | 2011-06-28 | 2012-02-01 | 杭州杭正电子科技有限公司 | Power amplifier |
| CN102882384A (en) * | 2012-09-18 | 2013-01-16 | 芜湖宏宇汽车电子有限责任公司 | Surface-mounted metal oxide semiconductor field effect transistor (MOSFET) inversion module technology for power of motor controller of new energy automobile |
| CN203167491U (en) * | 2013-04-11 | 2013-08-28 | 兰晓红 | Electric vehicle controller |
| CN203675518U (en) * | 2013-12-12 | 2014-06-25 | Tcl康钛汽车信息服务（深圳）有限公司 | Embedded vehicle case |
| CN205212744U (en) * | 2015-11-13 | 2016-05-04 | 东风电动车辆股份有限公司 | Exchange asynchronous machine controller drive power modular structure |
| CN205378461U (en) * | 2015-12-28 | 2016-07-06 | 广东高标电子科技有限公司 | Controller for electric vehicle |
| US20170133998A1 (en) * | 2014-09-08 | 2017-05-11 | Murata Manufacturing Co., Ltd. | Composite component and front-end module |
| CN206332931U (en) * | 2016-11-29 | 2017-07-14 | 浙江天则通信技术有限公司 | A kind of power amplification device for wireless video transmission |
| CN206332788U (en) * | 2016-12-29 | 2017-07-14 | 广州飞达音响股份有限公司 | A kind of linear array sound equipment |
| CN207201208U (en) * | 2017-09-12 | 2018-04-06 | 广州市天歌音响设备有限公司 | A kind of power amplifier |
-
2017
- 2017-09-12 CN CN201710817757.3A patent/CN107484394A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2883448A1 (en) * | 2005-03-17 | 2006-09-22 | Siemens Vdo Automotive Sas | Amplifier/radio receiving set for car, has radiator evacuating heat dissipated by power amplifier, which is placed between printed circuit board and radiator, and screws for maintaining amplifier in support on radiator |
| CN200969664Y (en) * | 2006-05-12 | 2007-10-31 | 杨忠广 | Minisize waterproof vehicle mounted audio-frequency amplifier |
| CN202135321U (en) * | 2011-06-28 | 2012-02-01 | 杭州杭正电子科技有限公司 | Power amplifier |
| CN102882384A (en) * | 2012-09-18 | 2013-01-16 | 芜湖宏宇汽车电子有限责任公司 | Surface-mounted metal oxide semiconductor field effect transistor (MOSFET) inversion module technology for power of motor controller of new energy automobile |
| CN203167491U (en) * | 2013-04-11 | 2013-08-28 | 兰晓红 | Electric vehicle controller |
| CN203675518U (en) * | 2013-12-12 | 2014-06-25 | Tcl康钛汽车信息服务（深圳）有限公司 | Embedded vehicle case |
| US20170133998A1 (en) * | 2014-09-08 | 2017-05-11 | Murata Manufacturing Co., Ltd. | Composite component and front-end module |
| CN205212744U (en) * | 2015-11-13 | 2016-05-04 | 东风电动车辆股份有限公司 | Exchange asynchronous machine controller drive power modular structure |
| CN205378461U (en) * | 2015-12-28 | 2016-07-06 | 广东高标电子科技有限公司 | Controller for electric vehicle |
| CN206332931U (en) * | 2016-11-29 | 2017-07-14 | 浙江天则通信技术有限公司 | A kind of power amplification device for wireless video transmission |
| CN206332788U (en) * | 2016-12-29 | 2017-07-14 | 广州飞达音响股份有限公司 | A kind of linear array sound equipment |
| CN207201208U (en) * | 2017-09-12 | 2018-04-06 | 广州市天歌音响设备有限公司 | A kind of power amplifier |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463051A (en) * | 2018-03-28 | 2018-08-28 | 珠海松下马达有限公司 | A kind of servo-driver |
| CN108463051B (en) * | 2018-03-28 | 2024-04-02 | 珠海松下马达有限公司 | Servo driver |
| CN108387803A (en) * | 2018-04-26 | 2018-08-10 | 艾乐德电子（南京）有限公司 | A kind of electronic load test device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102333414B (en) | Heat dissipation structure, manufacturing method for same and electronic device with same | |
| CN105811854B (en) | A kind of electric machine controller | |
| US9843250B2 (en) | Electro hydro dynamic cooling for heat sink | |
| CN107484394A (en) | A kind of power amplifier | |
| CN210629278U (en) | Rectifier bridge of brushless direct current generator | |
| CN207201208U (en) | A kind of power amplifier | |
| CN202231950U (en) | Radiating structure and electronic equipment employing same | |
| CN102711367A (en) | Heat-conducting aluminum base plate and manufacturing method of heat-conducting aluminum base plate | |
| CN205283932U (en) | Heat dissipating PCB | |
| CN208836465U (en) | A kind of high-power low pressure inverter structure | |
| CN108183094A (en) | A kind of combined heat radiating system | |
| CN107404098A (en) | A kind of heat-resisting bus duct | |
| CN208637314U (en) | Support Capacitor radiator structure and drive motor controller | |
| CN208445922U (en) | A kind of heat dissipation of sealing air flue formula power amplifier and power supply unit | |
| CN203277095U (en) | High-power commercial induction cooker capacitor | |
| CN202549867U (en) | Photovoltaic junction box | |
| CN203057683U (en) | Circuit board radiating structure | |
| CN206077833U (en) | A kind of high thermal conductivity aluminium base | |
| CN208353787U (en) | A kind of power amplifier heat dissipating device | |
| CN206165079U (en) | Load | |
| CN215819171U (en) | Circuit board heat radiation structure | |
| CN210670721U (en) | Electric control board with heat dissipation structure | |
| CN218071292U (en) | Integrated power module with good heat dissipation | |
| CN212751732U (en) | Energy-saving emission-reducing bus duct | |
| CN202957449U (en) | Semiconductor pumping solid laser |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180926 Address after: 511442 No. 16, west line industrial zone, Keng Tau Village, Panyu District South Village, Guangzhou, Guangdong province (self declaration) Applicant after: Tiangong (Guangzhou) audio equipment Co.,Ltd. Address before: 510000 Part 16 of West Line Industrial Zone, Keng Tau Village, Panyu District South Village, Guangzhou, Guangdong Applicant before: GUANGZHOU STVDIO DUE EQUIPMENT CO.,LTD. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |
|
| RJ01 | Rejection of invention patent application after publication |