CN221079927U - Copper-based high-heat-conductivity composite material conversion target and X-ray tube - Google Patents
Copper-based high-heat-conductivity composite material conversion target and X-ray tube Download PDFInfo
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- CN221079927U CN221079927U CN202322263032.8U CN202322263032U CN221079927U CN 221079927 U CN221079927 U CN 221079927U CN 202322263032 U CN202322263032 U CN 202322263032U CN 221079927 U CN221079927 U CN 221079927U
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- 239000002131 composite material Substances 0.000 title claims abstract description 119
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 70
- 239000010949 copper Substances 0.000 title claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 65
- 239000011159 matrix material Substances 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 54
- 239000002245 particle Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 57
- 239000000110 cooling liquid Substances 0.000 claims description 23
- 230000000737 periodic effect Effects 0.000 claims description 20
- 238000010894 electron beam technology Methods 0.000 claims description 10
- 239000002344 surface layer Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000035882 stress Effects 0.000 abstract description 9
- 230000008646 thermal stress Effects 0.000 abstract description 6
- 239000013077 target material Substances 0.000 abstract description 5
- 150000002739 metals Chemical class 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000003870 refractory metal Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000005461 Bremsstrahlung Effects 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000013160 medical therapy Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- X-Ray Techniques (AREA)
Abstract
The utility model discloses a copper-based high-heat-conductivity composite material conversion target and an X-ray tube. The conversion target comprises a composite material radiating matrix and a target, wherein the composite material radiating matrix comprises a copper matrix and high-heat-conductivity particles dispersed in the copper matrix, the target is arranged on the upper surface of the composite material radiating matrix, a metal modulation layer is arranged on the surface of the composite material radiating matrix at the junction of the composite material radiating matrix and the target, and the target and the composite material radiating matrix are connected through the metal modulation layer. The utility model realizes weldability between the composite material and the metals such as the target material, isolates the gas stored and diffused by the composite material, relieves the local stress caused by high heat conduction particles, improves the heat dissipation rate of the target in the X-ray source, reduces the temperature of the target and the thermal stress in the target layer, and improves the reliability and service life of the target under high power.
Description
Technical Field
The utility model belongs to the field of X-ray application, and particularly relates to an initial electron generating device for an X-ray tube.
Background
X-ray sources have wide application in the fields of industrial detection, scientific instruments, medical imaging, therapy, and the like. In an X-ray source, an electron beam impinges on a target material to generate X-rays. Most (-99%) of the electron beam power is eventually deposited in the form of heat in the target (typically refractory metals such as tungsten) and if the electron beam power is too high, the target will be destroyed, so the heat management of the X-ray conversion target is one of the core technologies of the radiation source.
Because the heat conductivity of refractory metal is not high, in order to solve the problem of heat dissipation, the material with good heat conductivity is usually required to be combined with the target, so that heat conduction is promoted, and the target is prevented from being too high in temperature. On the basis, the circulating insulating oil can be further adopted to realize convection heat dissipation, or the cooling water is adopted to realize super-evaporation heat dissipation.
The reflective emergent X-ray source generally adopts a casting or welding method to take copper (or copper alloy) material with good heat conduction performance as a substrate of a tungsten target, and heat is conducted to a shell through the target material and a heat dissipation substrate and is taken away through air cooling or liquid cooling, as shown in fig. 1. For a reflective X-ray source, the target typically has a reflection angle, which can reduce the electron beam power density by an order of magnitude while achieving a small focal spot. The power of a stationary reflective target X-ray tube is currently about 5kW at a maximum, and increasing the power generally requires the use of a rotating target.
Since the thermal expansion coefficient of copper adopted by the traditional heat dissipation matrix is 18.6X10 -6/K, and the thermal expansion coefficient of tungsten commonly used for the target material is 4.5X10/-6/K, the difference between the two is very large, so that thermal stress is easy to generate at high temperature, and the damage of the target is aggravated.
For a fixed target reflection type X-ray source, when the power is further increased, the target temperature is too high, the thermal stress is increased, and the target layer is cracked or the copper radiator is melted; in addition, the metal vapor pressure is too high, which results in a decrease in the vacuum degree in the tube and contamination of the surface of the insulating member, resulting in insulation failure at high voltage. Therefore, copper-based high thermal conductivity composite materials are beginning to be used as target heat dissipation substrates for X-ray sources.
However, the copper-based high-thermal-conductivity composite heat dissipation substrate faces serious process incompatibility (as shown in fig. 2) when being practically applied to a radiation target heat dissipation body:
1. The composite heat dissipation matrix conducts heat well, but because of the large roughness of the surface caused by microscopic discontinuities, a large number of gaps 10 exist between the composite heat dissipation matrix and the target, and the heat dissipation performance of the composite heat dissipation matrix and the refractory metal target when used in combination is actually poor. The copper-based high-heat-conductivity composite material radiating matrix has poor weldability, and when the composite material radiating matrix is brazed with other structural materials, the composite material radiating matrix cannot be welded by using conventional brazing materials such as mature silver-based solders due to extremely poor wettability, so that the composite material radiating matrix cannot ensure the air tightness and strength of a welding position through brazing, and is difficult to apply to vacuum devices such as a ray tube.
2. The diamond material itself is less in outgassing, but because of imperfect wettability of diamond and copper in the heat-dissipating matrix of the composite material, there are a large number of microscopic pores, i.e., micropores 11, which not only store a large amount of gas, but also form gas diffusion channels, i.e., micropores channels 12. Therefore, the composite material radiating matrix is directly used as the X-ray conversion target radiating body, and compared with a single copper radiating body or a diamond radiating body, the composite material is more deflated.
3. The thermal expansion coefficient of the composite material radiating matrix can be better matched with the target in a macroscopic sense, but the thermal expansion coefficient is extremely uneven in a microscopic sense due to the microscopic anisotropy. In particular, when diamond particles are in contact with a tungsten target, the target is susceptible to micro-cracking at high temperatures due to localized stresses, resulting in target damage.
Disclosure of utility model
The utility model aims to solve the problems that: the weldability between the copper-based composite material radiating matrix and refractory metal targets and other structural members is poor, and the air tightness and strength cannot be ensured by brazing, so that the copper-based composite material radiating matrix is difficult to apply to vacuum devices such as an ray tube and the like; the air release rate of the composite material radiating matrix is high, and the composite material radiating matrix is not suitable for being directly exposed on the inner surface of a high-vacuum device; the local stress of the composite material radiating matrix under the contact of the high heat conduction particles and the refractory metal easily causes crack damage.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a copper-based high heat conduction composite material conversion target, includes combined material radiating basal body, target, combined material radiating basal body includes copper basal body and disperses the high heat conduction granule in the copper basal body, the target sets up in the upper surface of combined material radiating basal body, combined material radiating basal body and target juncture's combined material radiating basal body surface is provided with the metal modulation layer, target and combined material radiating basal body pass through the metal modulation layer links to each other.
Further, the metal modulation layer comprises a thin modulation layer and a thick modulation layer, the thickness of the thin modulation layer is 0.01mm-0.1mm, and the thickness of the thick modulation layer is 0.5mm-2cm.
Further, the metal modulation layer comprises a surface layer metal modulation layer which is tiled on the upper surface of the composite material radiating substrate, and a periodic pinning layer which is periodically connected below the surface layer metal modulation layer, and the periodic pinning layer is embedded in the composite material radiating substrate.
Further, the period and amplitude of the periodic pinning layer are both 0.5-2mm.
Further, a periodic grooving structure is adopted on one side of the target, which is contacted with the metal modulation layer.
Further, the periodic grooving structure is a rectangular groove or a curved groove with a fixed period or a variable period.
Further, the spatial period and amplitude of the periodic grooved structure of the target are both 0.2-2mm.
The high-heat-conductivity X-ray tube comprises a cathode cover, an anode cover and a tube shell, wherein the cathode cover and the anode cover are installed face to face through the tube shell, a cathode for emitting an electron beam is installed on the cathode cover, and the anode cover comprises the copper-based high-heat-conductivity composite material conversion target and cooling liquid for anode cooling.
Furthermore, the anode cover is also provided with a copper heat dissipation matrix, the tube shell is connected with the copper heat dissipation matrix, the copper-based high-heat-conductivity composite material conversion target is completely isolated from cooling liquid by the copper heat dissipation matrix, and the cooling liquid cools the copper heat dissipation matrix; or the anode cover is also provided with a copper heat dissipation matrix, the tube shell is connected with the copper heat dissipation matrix, the copper-based high-heat-conductivity composite material conversion target is in direct contact with cooling liquid, and the cooling liquid cools the composite material heat dissipation matrix; or the tube shell is connected with the composite material radiating matrix, the copper-based high-heat-conductivity composite material conversion target is in direct contact with cooling liquid, and the cooling liquid cools the composite material radiating matrix.
Further, the metal modulation layer is arranged on the surface of the composite material radiating matrix, which is possibly contacted with vacuum, the surface of the composite material radiating matrix, which is connected with other metal or ceramic structural members, and the surface of the composite material radiating matrix, which is contacted with cooling liquid.
Compared with the prior art, the utility model has the beneficial effects that:
The utility model can realize weldability between the composite material radiating matrix and the target, isolate the gas stored and diffused by the composite material radiating matrix and relieve the local stress caused by high heat conduction particles by using the metal modulation layer. Through the structure, the practicability of the copper-based high-heat-conductivity composite heat-dissipation substrate in the X-ray conversion target assembly can be met, so that the heat dissipation rate of a target in an X-ray source is improved, the temperature of the target and the thermal stress in a target layer are reduced, and the reliability and the service life of the target under high power are improved.
Drawings
FIG. 1 is a schematic view of a conventional X-ray tube;
FIG. 2 is a diagram of the connection of a composite heat sink substrate to a target in a prior art copper-based high thermal conductivity composite conversion target;
FIG. 3 is a schematic diagram of the structure of a composite heat dissipation matrix in a copper-based high thermal conductivity composite conversion target of the present utility model bonded to the target through a metal modulating layer;
FIG. 4 is a schematic structural diagram of a switching target with periodic pinning layers;
FIG. 5 is a schematic structural view of a switching target having a periodic grooved structure;
FIG. 6 is a schematic view of the structure of the present utility model disposed on the anode side;
FIG. 7 is a schematic diagram of a first implementation of a high thermal conductivity X-ray tube according to the present utility model;
FIG. 8 is a schematic diagram of a second implementation of a high thermal conductivity X-ray tube according to the present utility model;
fig. 9 is a schematic diagram of a third implementation of a high thermal conductivity X-ray tube according to the present utility model.
The marks in the figure: 1-a cathode housing; 2-cathode; 3-an anode casing; 4-target; 5-a tube shell; 6-copper heat dissipation matrix; 7-electron beam; 8-X rays; 9-cooling the liquid; 10-gap; 11-micropores; 12-microporous channels; 13-a composite material heat dissipation matrix; 14-high thermal conductivity particles; 15-a metal modulation layer; 16-periodic pinning layer; 17-metal parts.
Detailed Description
The utility model is described in further detail below with reference to the accompanying drawings.
This embodiment provides a copper-based high thermal conductivity composite conversion target as shown in fig. 3, which mainly includes a composite heat-dissipating substrate 13 and a target 4. Specifically, the composite material heat dissipation substrate 13 includes a copper substrate and high heat conduction particles 14 dispersed in the copper substrate, the target 4 is disposed on the upper surface of the composite material heat dissipation substrate 13, a metal modulation layer 15 is disposed on the surface of the composite material heat dissipation substrate 13 at the junction of the composite material heat dissipation substrate 13 and the target 4, and the target 4 and the composite material heat dissipation substrate 13 are connected through the metal modulation layer 15. The utility model realizes the weldability between the composite material radiating matrix 13 and the target 4 and other metals by adding the metal modulation layer 15; the metal modulation layer 15 can effectively isolate the gas stored and diffused by the composite material radiating matrix 13, and reduce slow leakage and slow deflation caused by the composite material radiating matrix 13; the addition of the metal modulation layer 15 can also relieve local stress caused by high heat conduction particles, thereby improving the heat dissipation rate of the target in the X-ray source, reducing the temperature of the target and the thermal stress in the target layer, and improving the reliability and service life of the target under high power.
Copper or copper-based alloy, nickel or nickel-based alloy is used as the material of the metal modulation layer 15 in order to obtain optimal heat conduction and connection mechanics, air tightness. In this embodiment, the metal modulation layer 15 includes two types of thick modulation layers and thin modulation layers.
Wherein the thickness of the thin modulation layer is preferably 0.01mm-0.1mm. Typical structure of the thin modulation layer as shown in fig. 3, the metal modulation layer 15 includes only a surface layer metal modulation layer laid on the upper surface of the composite heat dissipation substrate 13.
Wherein the thickness of the thick modulation layer is preferably 0.5mm-2cm. One example of a thick modulating layer is shown in fig. 4, where the metal modulating layer 15 includes a surface layer metal modulating layer laid on the upper surface of the composite heat dissipating substrate 13, and a periodic pinning layer 16 periodically connected to the lower surface of the surface layer metal modulating layer, and the periodic pinning layer 16 is embedded in the composite heat dissipating substrate 13. The periodic pinning layer 16 is used to attenuate the concentration of composite stress and to control the expansion of composite defects under thermal fatigue. The period and amplitude of the periodic pinning layer 16 is preferably 0.5-2mm.
Fig. 5 shows a further preferred construction of the switching target on the basis of the provision of the thick modulation layer described above. Specifically, a periodic grooved structure including, but not limited to, a rectangular groove or a curved groove with a fixed or varying period is employed on the side of the target 4 in contact with the metal modulation layer 15. The periodic grooving structure is used for forming an equivalent transition layer and reducing the equivalent gradient of temperature and stress; meanwhile, the binding force between the target and the metal modulation layer is enhanced, and the falling-off caused by the composite material is avoided. Wherein the spatial period and amplitude of the target slot is preferably 0.2-2mm.
When other metal parts 17 are further included, as shown in fig. 6, a metal modulation layer 15 is disposed between the composite material heat dissipation substrate 13 and the target 4 and between the composite material heat dissipation substrate 13 and the other metal parts 17, the metal modulation layer 15 is tightly combined with the composite material heat dissipation substrate 13, and meanwhile, the metal modulation layer 15 is tightly combined with the target 4 and the other metal parts 17 or is in airtight brazing, so that reliable heat transfer and airtight connection between the composite material heat dissipation substrate 13 and the parts are ensured.
Based on the above-mentioned copper-based high thermal conductivity composite conversion target assembly using the metal modulation layer 15, reflection target type X-ray tubes of different structures can be respectively designed. The tube is composed of a cathode assembly, a tube housing 5 and an anode assembly (mainly comprising an anode casing 3, a copper-based high thermal conductivity composite conversion target). The cathode assembly comprises a cathode housing 1, a cathode 2 and associated accessories for emitting an electron beam 7 and providing a grid control or focusing; the anode assembly consists of an anode cap 3, a target 4 and a heat dissipating substrate for converting part of the energy of the electrons 7 into X-rays 8 and for conducting away the heat of deposition of the electrons 7 in the target 4. The envelope 5 mainly provides high voltage insulation and support properties.
A high voltage is applied between the cathode housing 1 and the anode housing 3, which is of a relatively negative potential, so that an accelerating and focusing electric field of electrons is formed in the tube. The cathode emits electrons, and the electron beam flies to the anode component under the action of the electric field, bombards on the target surface, and generates X rays through the bremsstrahlung process. The X-rays are emitted outside the tube for imaging purposes. Most of the power of the electron beam is deposited on the target surface, a part of the heat of the target layer is radiated, and most of the heat is firstly conducted to a heat dissipation substrate with high heat conductivity and thermal expansion coefficient matched with the target layer. The heat of the heat dissipating substrate can be directly cooled by the external cooling liquid 9, thereby reducing the temperature and stress of the target and the heat dissipating material in the vicinity of the target. In this embodiment, the metal modulation layer is preferably disposed on the surface where the composite heat dissipation substrate may contact with vacuum, the surface where the composite heat dissipation substrate connects with other metal or ceramic structural members, and the surface where the composite heat dissipation substrate contacts with the cooling liquid. The following are three preferred configurations of the high thermal conductivity X-ray tube.
As shown in fig. 7, the composite heat dissipation substrate 13, the copper heat dissipation substrate 6, and the anode cover 3 are combined, the package 5 is connected to the copper heat dissipation substrate 6, and the cooling liquid 9 cools the copper heat dissipation substrate 6. The structure adopts the copper radiating substrate 6 as the substrate of the composite material radiating body, and can reduce the use amount of the composite material (the cost of the composite material is about ten times of that of the conventional copper heat conducting substrate) when the power is not too high, thereby improving the radiating efficiency near the target and effectively controlling the cost.
As shown in fig. 8, the composite heat dissipation substrate 13, the copper heat dissipation substrate 6, and the anode casing 3 are joined by integral sintering or brazing, the package 5 is connected to the copper heat dissipation substrate 6, and the cooling liquid 9 cools the composite heat dissipation substrate 13. This structure uses the cooling liquid to cool the composite material directly, and the radiating efficiency is higher than the former scheme. The copper radiating matrix is used as an intermediate layer for welding the composite radiating matrix and the tube shell assembly, so that the reliability of the welding process can be improved.
As shown in fig. 9, the composite material heat-dissipating substrate 13, the copper heat-dissipating substrate 6, and the anode casing 3 are joined by integral sintering or brazing, the package 5 is connected to the composite material heat-dissipating substrate 6, and the cooling liquid 9 cools the composite material heat-dissipating substrate 13. The structure uses the cooling liquid to directly cool the composite material, and has high heat dissipation efficiency. The composite material radiator component is directly welded with the pipe shell component, so that the structure is simplest, and the miniaturization of the product can be ensured.
In summary, the compact metal material composite functional modulation layer is prepared on the surface of the composite material combined with other metals, and the functional modulation layer adopts metals such as copper, nickel and the like and alloys thereof. The use of the metal modulation layer can achieve weldability between the composite material and the metal such as the target material, isolate the gas stored and diffused by the composite material, and relieve local stress caused by high-heat-conductivity particles. By the method, the practicability of the copper-based high-heat-conductivity composite material in an X-ray conversion target assembly and other high-power electric vacuum devices can be met, so that the heat dissipation rate of a target in an X-ray source is improved, the temperature of the target and the thermal stress in a target layer are reduced, and the reliability and the service life of the copper-based high-heat-conductivity composite material under high power are improved.
The above description is only of the preferred embodiments of the present utility model, and is not intended to limit the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. The copper-based high-heat-conductivity composite material conversion target is characterized by comprising a composite material heat-dissipation substrate and a target, wherein the composite material heat-dissipation substrate comprises a copper substrate and high-heat-conductivity particles dispersed in the copper substrate, the target is arranged on the upper surface of the composite material heat-dissipation substrate, a metal modulation layer is arranged on the surface of the composite material heat-dissipation substrate at the junction of the composite material heat-dissipation substrate and the target, and the target and the composite material heat-dissipation substrate are connected through the metal modulation layer.
2. The copper-based high thermal conductivity composite switching target according to claim 1, wherein the metal modulation layer comprises a thin modulation layer and a thick modulation layer, the thickness of the thin modulation layer is 0.01mm-0.1mm, and the thickness of the thick modulation layer is 0.5mm-2cm.
3. The copper-based high thermal conductivity composite switching target according to claim 1, wherein the metal modulation layer comprises a surface layer metal modulation layer which is tiled on the upper surface of the composite heat dissipation substrate, and a periodic pinning layer which is periodically connected below the surface layer metal modulation layer, wherein the periodic pinning layer is embedded in the composite heat dissipation substrate.
4. A copper-based high thermal conductivity composite switching target according to claim 3, wherein the periodic pinning layer has a period and amplitude of 0.5-2mm.
5. The copper-based high thermal conductivity composite switching target according to claim 1, wherein a side of the target in contact with the metal modulation layer adopts a periodic grooved structure.
6. The copper-based high thermal conductivity composite switching target according to claim 5, wherein the periodic grooved structure is a rectangular groove or a curved groove with a fixed or varying period.
7. The copper-based high thermal conductivity composite switching target according to claim 5, wherein the spatial period and amplitude of the periodic grooved structure of the target are both 0.2-2mm.
8. A high thermal conductivity X-ray tube comprising a cathode housing, an anode housing, a tube housing through which the cathode housing and the anode housing are mounted face-to-face, a cathode for emitting an electron beam being mounted on the cathode housing, the anode housing comprising the copper-based high thermal conductivity composite conversion target of any one of claims 1 to 7 and a cooling liquid for anode cooling.
9. A high thermal conductivity X-ray tube as defined in claim 8, wherein,
The anode cover is also provided with a copper heat dissipation matrix, the tube shell is connected with the copper heat dissipation matrix, the copper-based high-heat-conductivity composite material conversion target is completely isolated from cooling liquid by the copper heat dissipation matrix, and the cooling liquid cools the copper heat dissipation matrix; or alternatively
The anode cover is also provided with a copper heat dissipation matrix, the tube shell is connected with the copper heat dissipation matrix, the copper-based high-heat-conductivity composite material conversion target is in direct contact with cooling liquid, and the cooling liquid cools the composite material heat dissipation matrix; or alternatively
The shell is connected with the composite material radiating matrix, the copper-based high-heat-conductivity composite material conversion target is in direct contact with cooling liquid, and the cooling liquid cools the composite material radiating matrix.
10. The high thermal conductivity X-ray tube of claim 9, wherein the metal modulating layer is provided on a surface of the composite heat dissipating substrate that may be in contact with vacuum, a surface of the composite heat dissipating substrate that is connected to other metal or ceramic structural members, and a surface of the composite heat dissipating substrate that is in contact with cooling liquid.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263032.8U CN221079927U (en) | 2023-08-23 | 2023-08-23 | Copper-based high-heat-conductivity composite material conversion target and X-ray tube |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263032.8U CN221079927U (en) | 2023-08-23 | 2023-08-23 | Copper-based high-heat-conductivity composite material conversion target and X-ray tube |
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| CN221079927U true CN221079927U (en) | 2024-06-04 |
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| CN202322263032.8U Active CN221079927U (en) | 2023-08-23 | 2023-08-23 | Copper-based high-heat-conductivity composite material conversion target and X-ray tube |
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| Country | Link |
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| CN (1) | CN221079927U (en) |
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