CN114899068A - Reflection type X-ray target substrate, preparation method and X-ray tube - Google Patents
Reflection type X-ray target substrate, preparation method and X-ray tube Download PDFInfo
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- CN114899068A CN114899068A CN202210717005.0A CN202210717005A CN114899068A CN 114899068 A CN114899068 A CN 114899068A CN 202210717005 A CN202210717005 A CN 202210717005A CN 114899068 A CN114899068 A CN 114899068A
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- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 41
- 239000010432 diamond Substances 0.000 claims abstract description 41
- 239000002131 composite material Substances 0.000 claims abstract description 40
- 238000006243 chemical reaction Methods 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 230000007704 transition Effects 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000013077 target material Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 3
- AHGIVYNZKJCSBA-UHFFFAOYSA-N [Ti].[Ag].[Cu] Chemical compound [Ti].[Ag].[Cu] AHGIVYNZKJCSBA-UHFFFAOYSA-N 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 2
- 230000008646 thermal stress Effects 0.000 abstract description 13
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 abstract description 5
- 238000010894 electron beam technology Methods 0.000 description 7
- 238000004088 simulation Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/112—Non-rotating anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/12—Cooling non-rotary anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/12—Cooling non-rotary anodes
- H01J35/13—Active cooling, e.g. fluid flow, heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- X-Ray Techniques (AREA)
Abstract
The invention discloses a reflective X-ray target substrate, a preparation method and an X-ray tube, relating to the technical field of X-rays, and the technical scheme is as follows: comprises a base part for carrying a conversion target; the base part is a heat dissipation base prepared from a copper-diamond composite material; or the base part comprises a heat-conducting base body and a transition layer, the conversion target is connected with the heat-conducting base body through the transition layer, and the transition layer is made of a copper-diamond composite material. The invention adopts the copper-carbon composite material with high thermal conductivity coefficient and low thermal expansion coefficient for the first time, namely the copper-diamond composite material is used as the heat dissipation substrate or the transition layer of the X-ray source, so that the heat dissipation rate of the target in the X-ray source can be greatly improved, the temperature of the target and the thermal stress in the target layer are reduced, and the reliability and the service life of the X-ray source under high power are improved.
Description
Technical Field
The invention relates to the technical field of X rays, in particular to a reflection type X ray target substrate, a preparation method and an X ray tube.
Background
The X-ray source has wide application in the fields of industrial detection, scientific instruments, medical imaging, treatment and the like. In an X-ray source, an electron beam bombards a target material to generate X-rays. Most (-99%) of the electron beam power eventually deposits in the form of heat in the target material, which is generally refractory metal such as tungsten, and if the electron beam power is too large, the target will be melted down, so the thermal management of the X-ray conversion target belongs to one of the core technologies of the radiation source.
In the X-ray source of transmission type light emission, diamond is used as a transmission window, and a metal film with high atomic number such as tungsten is plated on the vacuum side of the diamond. Due to the requirement of X-ray imaging accuracy, the X-ray focal spot needs to be relatively small, and in order to avoid damage of the transmission window due to heat, the power of the transmission X-ray tube is usually very small, typically below 10W. When the electron beam energy is high, the thickness of the window may be appropriately increased in order to increase the heat dissipation rate of the target. However, the thickness of the diamond thermal window is generally very thin, about 0.1-0.3mm, due to process difficulties, cost, and the like. Generally, the high-power X-ray tube does not adopt window-target integrated transmission type light emission.
The reflective light-emitting X-ray source generally adopts a casting or welding method to use a copper or copper alloy material with good heat conductivity as a tungsten target substrate, conducts heat to a shell through a target material and a heat dissipation substrate, and takes away the heat through air cooling or liquid cooling. For a reflective X-ray source, the target typically has a reflection angle, which reduces the electron beam power density by an order of magnitude while achieving a small focal spot. The power of the fixed reflective target X-ray tube is about 5kW at most at present, and the rotating target is generally needed to be adopted for increasing the power. In the case of a fixed target reflection X-ray source, when the power is further increased, the temperature of the target becomes too high and the thermal stress increases. The cracking of the target layer or the melting of the copper heat sink can be caused; in addition, the metal vapor pressure is too high, which causes the vacuum degree in the tube to be reduced and the surface of the insulating component to be polluted, thereby causing the insulation failure under high voltage.
Therefore, how to design a reflective X-ray conversion target substrate, a manufacturing method thereof and an X-ray tube which can overcome the above defects is a problem which needs to be solved urgently.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a reflective X-ray target substrate, a preparation method and an X-ray tube.
The technical purpose of the invention is realized by the following technical scheme:
in a first aspect, a reflective X-ray target substrate is provided, comprising a substrate member for carrying a conversion target;
the base part is a heat dissipation base prepared from a copper-diamond composite material;
or the base part comprises a heat-conducting base body and a transition layer, the conversion target is connected with the heat-conducting base body through the transition layer, and the transition layer is made of a copper-diamond composite material.
Preferably, in the copper-diamond composite material, the content of diamond is 10-90%.
Preferably, the thermal conductivity range of the heat dissipation substrate or the transition layer is 400-1600W/m.K, and the thermal expansion coefficient range is 4 × 10 -6 -12×10 -6 /K。
In a second aspect, there is provided a method of preparing a reflective X-ray target substrate as described in the first aspect, comprising the steps of:
uniformly mixing the metallized diamond and copper powder to obtain a mixture;
the mixture is heated and melted under vacuum and directly fused and cast with the target material to obtain a base component consisting of the conversion target and a heat dissipation base body or a target-composite material component consisting of the conversion target and a transition layer.
In a third aspect, there is provided a method of making a reflective X-ray target substrate as described in the first aspect, comprising the steps of:
preparing the copper-diamond composite material by a melting or hot-press molding process;
the target material and the copper-diamond composite material are welded together through the welding flux to obtain a base part consisting of the conversion target and the heat dissipation base body or obtain a target-composite material assembly consisting of the conversion target and the transition layer.
Preferably, the solder is silver, silver copper or silver copper titanium solder.
In a fourth aspect, there is provided a method of making a reflective X-ray target substrate as described in the first aspect, comprising the steps of:
placing the metallized diamond powder above the target material;
pressing by adopting a cold pressing or hot pressing process, and demoulding to obtain a prefabricated member of the diamond powder framework;
the molten copper or copper alloy is infiltrated into the preform to obtain a base component consisting of the conversion target and the heat-dissipating matrix, or to obtain a target-composite component consisting of the conversion target and the transition layer.
In a fifth aspect, there is provided a reflective X-ray tube comprising a cathode head, an anode head and a reflective X-ray target substrate as described in the first aspect.
Preferably, the anode head is fixedly connected with the heat dissipation substrate.
Preferably, the anode head is fixedly connected with the heat-conducting substrate.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the reflective X-ray target substrate, the copper-carbon composite material with high thermal conductivity and low thermal expansion coefficient is adopted for the first time, namely the copper-diamond composite material is used as the heat dissipation substrate or the transition layer of the X-ray source, so that the heat dissipation rate of the target in the X-ray source can be greatly improved, the temperature of the target and the thermal stress in the target layer are reduced, and the reliability and the service life of the reflective X-ray target substrate under high power are improved;
2. the conversion target is combined with the heat-conducting substrate made of copper or copper alloy material through the transition layer made of copper-diamond composite material, so that the temperature and stress of the target and the nearby temperature and stress can be effectively reduced, and the cost is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic structural view of a base member in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of an X-ray tube in embodiment 1 of the present invention;
FIG. 3 is a schematic structural view of a base member in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of an X-ray tube in embodiment 2 of the present invention;
FIG. 5 is a schematic diagram of a simulation setup in an embodiment of the invention;
FIG. 6 shows the simulation results of the embodiment of the present invention in which the base member is entirely made of pure copper, a is the distribution of thermal stress, and b is the change of thermal stress with time;
FIG. 7 is a simulation result of the case where the base member is entirely a copper-diamond composite material in the example of the present invention, a is a thermal stress distribution, and b is a change in thermal stress with time;
FIG. 8 shows the result of the variation of the maximum temperature of the conversion target and the heat sink substrate with time in the example of the present invention, wherein a is pure copper and b is a copper-diamond composite material.
Reference numbers and corresponding part names in the drawings:
1. converting the target; 2. a heat-dissipating substrate; 3. a transition layer; 4. a thermally conductive substrate; 5. a cathode head; 6. an anode head; 7. and (4) a pipe shell.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1: a reflective X-ray target substrate, as shown in FIG. 1, comprises a substrate member for carrying a conversion target 1; the base member is a heat dissipating base 2 made of a copper-diamond composite material.
When the power of the existing reflective X-ray source is further improved, a target layer is cracked or a copper radiator is melted due to overhigh temperature and increased thermal stress of the target; in addition, the high temperature metal vapor pressure causes the vacuum degree in the tube to be reduced and the surface of the insulating component to be polluted, thereby causing the insulation failure under high voltage.
The invention adopts the copper-carbon composite material with high thermal conductivity and low thermal expansion coefficient for the first time, namely the copper-diamond composite material as the heat dissipation substrate 2 or the transition layer 3 of the X-ray source, so that the heat dissipation rate of the target in the X-ray source can be greatly improved, the temperature of the target and the thermal stress in the target layer can be reduced, and the reliability and the service life of the target under high power can be improved.
The electron beam bombards the conversion target 1, generating X-rays. The power of the electron beam, which is mostly deposited in the conversion target 1, conducts heat away by the contact between the conversion target 1 and the heat-dissipating substrate 2, thereby reducing the temperature and stress of the conversion target 1 and the heat-dissipating material in the vicinity of the conversion target 1.
In this example, the composition of diamond in the copper-diamond composite material was 10% to 90%.
The thermal expansion coefficient of diamond is 1.2X 10 -6 ～4.5×10 -6 K, coefficient of thermal expansion of copper 18.6X 10 -6 and/K. The coefficient of thermal expansion of the copper-carbon composite material formed by the two materials is 5 multiplied by 10 -6 Adjustable about/K and 4.5-10 coefficient of thermal expansion of tungsten -6 the/K is very close. By adjusting the doping ratio between diamond and copper, the composite material with the thermal expansion coefficient being most matched with that of different targets can be obtained.
In this embodiment, the thermal conductivity range of the heat dissipation substrate 2 or the transition layer 3 is 400-1600W/m.K, and the thermal expansion coefficient range is 4 × 10-6-12 × 10-6/K.
As shown in FIG. 2, the reflective X-ray target substrate can be designed into a reflective X-ray tube, which is composed of a cathode assembly, a tube shell 7 and an anode assembly. The cathode assembly comprises a cathode head 5, a cathode and related devices, and is used for emitting electrons and providing gating or focusing; the anode assembly consists of an anode head 6, a conversion target 1 and a heat dissipation base body 2, wherein the heat dissipation base body 2 is connected with the anode head 6 in an installing mode and used for converting electrons into X rays and conducting away deposition heat. The envelope 7 mainly provides high voltage insulation and support properties.
As an optional implementation manner, the method for preparing the reflective X-ray target substrate specifically comprises: uniformly mixing the metallized diamond and copper powder to obtain a mixture; the mixture is heated and melted under vacuum and directly fused and cast with the target material to obtain a base part consisting of the conversion target 1 and the heat dissipation base 2.
As another optional embodiment, the method for preparing the reflective X-ray target substrate specifically comprises: preparing the copper-diamond composite material by a melting or hot-press molding process; the target material and the copper-diamond composite material are welded together through the solder, and the base part consisting of the conversion target 1 and the heat dissipation base 2 is obtained.
Wherein the solder is silver, silver copper or silver copper titanium solder.
The preparation method of the reflection type X-ray target substrate can also comprise the following steps: placing the metallized diamond powder above the target material; pressing by adopting a cold pressing or hot pressing process, and demoulding to obtain a prefabricated member of the diamond powder framework; the preform is impregnated with molten copper or copper alloy to obtain a base member composed of the conversion target 1 and the heat-dissipating base 2.
Example 2: a reflective X-ray tube, as shown in fig. 3, embodiment 2 is different from embodiment 1 in that:
the base part comprises a heat-conducting base body 4 and a transition layer 3, the conversion target 1 is connected with the heat-conducting base body 4 through the transition layer 3, and the transition layer 3 is made of a copper-diamond composite material.
As shown in fig. 4, when the target X-ray tube is used, the heat conducting substrate 4 may be mounted on the anode head 6, or the heat conducting substrate 4 may be integrally formed with the anode head 6.
In this example, when the base member is prepared, a target-composite assembly composed of the conversion target 1 and the transition layer 3 can be prepared first by the same preparation method as in example 1. The target-composite assembly is then assembled with the thermally conductive base 4 to form the final base member.
Experimental verification
Under the same condition, a copper-carbon composite material with high thermal conductivity and low thermal expansion coefficient and a traditional oxygen-free copper substrate are respectively adopted as the heat dissipation substrate 2 of the target for the reflective X-ray source, and the change of the highest temperature in the target layer and the substrate along with time and the thermal stress in the target layer can be analyzed through simulation calculation.
As shown in FIG. 5, a simulation experiment was performed by injecting 2kW of power into the surface of a tungsten target disk having a diameter of 10 mm.
As shown in fig. 6-8, simulation results show that, after the copper-diamond composite material is used as the heat dissipation substrate 2 instead of pure copper or copper alloy, the temperature rises of the target and the heat dissipation substrate 2 are respectively reduced to 62.5% and 53.8% (the temperature rise of the target layer is reduced from 427 ℃ to 267 ℃, and the temperature rise of the heat dissipation substrate 2 is reduced from 357 ℃ to 192 ℃); the thermal stress in the target layer at steady state is reduced to one sixth (from 9.2E8 to 1.5E 8); by obviously reducing the highest temperature and the thermal stress, the high-voltage vacuum breakdown caused by metal vapor and the target damage probability can be greatly reduced, and the reliability and the service life of the high-power vacuum breakdown target are obviously improved.
If the target is combined with the copper heat dissipation substrate 2 through the composite material transition layer 3, the temperature and the thermal stress of the target and the nearby part can be effectively reduced, but the performance is not as good as that of the heat dissipation substrate 2 which is made of the composite material.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A reflective X-ray target base body, characterized in that it comprises a base body part for carrying a conversion target (1);
the base body part is a heat dissipation base body (2) prepared from a copper-diamond composite material;
or the base part comprises a heat-conducting base body (4) and a transition layer (3), the conversion target (1) is connected with the heat-conducting base body (4) through the transition layer (3), and the transition layer (3) is made of a copper-diamond composite material.
2. The reflective X-ray target substrate of claim 1, wherein the copper-diamond composite material comprises diamond in an amount of 10% to 90%.
3. The reflective X-ray target substrate according to claim 1, wherein the thermal conductivity of the heat-dissipating substrate (2) or the transition layer (3) is in the range of 400-1600W/m.K, and the thermal expansion coefficient is in the range of 4X 10 -6 -12×10 -6 /K。
4. A method of producing a reflective X-ray target substrate according to any one of claims 1 to 3, comprising the steps of:
uniformly mixing the metallized diamond and copper powder to obtain a mixture;
the mixture is heated and melted under vacuum and is directly fused and cast with the target material to obtain a base component consisting of the conversion target (1) and the heat dissipation base body (2) or obtain a target-composite material component consisting of the conversion target (1) and the transition layer (3).
5. A method of producing a reflective X-ray target substrate according to any one of claims 1 to 3, comprising the steps of:
preparing the copper-diamond composite material by a melting or hot-press molding process;
the target material and the copper-diamond composite material are welded together through the welding flux, so that a base part consisting of the conversion target (1) and the heat dissipation base body (2) is obtained, or a target-composite material assembly consisting of the conversion target (1) and the transition layer (3) is obtained.
6. The method of claim 5, wherein the solder is silver, silver copper, or silver copper titanium solder.
7. A method of producing a reflective X-ray target substrate according to any one of claims 1 to 3, comprising the steps of:
placing the metallized diamond powder above the target material;
pressing by adopting a cold pressing or hot pressing process, and demoulding to obtain a prefabricated member of the diamond powder framework;
the preform is impregnated with molten copper or copper alloy, resulting in a base part consisting of the conversion target (1) and the heat-dissipating base body (2), or in a target-composite component consisting of the conversion target (1) and the transition layer (3).
8. A reflective X-ray tube, characterized in that it comprises a cathode head (5), an anode head (6) and a reflective X-ray target substrate according to any one of claims 1 to 3.
9. A reflective X-ray tube according to claim 8, characterized in that the anode head (6) is fixedly connected to the heat-dissipating base body (2).
10. A reflective X-ray tube according to claim 8, characterized in that the anode head (6) is fixedly connected to the heat-conducting base body (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210717005.0A CN114899068A (en) | 2022-06-23 | 2022-06-23 | Reflection type X-ray target substrate, preparation method and X-ray tube |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210717005.0A CN114899068A (en) | 2022-06-23 | 2022-06-23 | Reflection type X-ray target substrate, preparation method and X-ray tube |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093355A (en) * | 2000-09-14 | 2002-03-29 | Rigaku Corp | X-ray tube target and its manufacturing method |
| US20100316193A1 (en) * | 2007-09-28 | 2010-12-16 | Plansee Metall Gmbh | X-ray anode having improved heat removal |
| JP2012212562A (en) * | 2011-03-31 | 2012-11-01 | Kobe Steel Ltd | Target for x ray generation, x ray generation device including the target for the x ray generation, and manufacturing method of the target for the x ray generation |
| CN109417009A (en) * | 2016-06-30 | 2019-03-01 | 通用电气公司 | Multilayer x-ray source target |
| CN111326381A (en) * | 2018-12-13 | 2020-06-23 | 通用电气公司 | Multi-layer X-ray source target with stress relief layer |
-
2022
- 2022-06-23 CN CN202210717005.0A patent/CN114899068A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093355A (en) * | 2000-09-14 | 2002-03-29 | Rigaku Corp | X-ray tube target and its manufacturing method |
| US20100316193A1 (en) * | 2007-09-28 | 2010-12-16 | Plansee Metall Gmbh | X-ray anode having improved heat removal |
| JP2012212562A (en) * | 2011-03-31 | 2012-11-01 | Kobe Steel Ltd | Target for x ray generation, x ray generation device including the target for the x ray generation, and manufacturing method of the target for the x ray generation |
| CN109417009A (en) * | 2016-06-30 | 2019-03-01 | 通用电气公司 | Multilayer x-ray source target |
| CN111326381A (en) * | 2018-12-13 | 2020-06-23 | 通用电气公司 | Multi-layer X-ray source target with stress relief layer |
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Application publication date: 20220812 |