CN1956124B - High efficient cathode assembly - Google Patents
High efficient cathode assembly Download PDFInfo
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- CN1956124B CN1956124B CN2005100867313A CN200510086731A CN1956124B CN 1956124 B CN1956124 B CN 1956124B CN 2005100867313 A CN2005100867313 A CN 2005100867313A CN 200510086731 A CN200510086731 A CN 200510086731A CN 1956124 B CN1956124 B CN 1956124B
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- cathode
- negative electrode
- heater
- support tube
- tube
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Abstract
A cathode component with high efficiency utilizes metal Ti with extremely low heat conductivity as support barrel of cathode so that power consumption of heat conduction can be lowered in order to raise heat efficiency of cathode.
Description
Technical field
High efficient cathode assembly of the present invention relates to the microwave device technical field, is the high cathode assembly of a kind of heat efficiency.
Background technology
Space travelling wave tube is the critical component of spaceborne transponder and satellite-borne synthetic aperture radar transmitter, mainly plays microwave power final stage amplification, and it has characteristics such as bandwidth, gain is high, efficient is high, power is big.Along with the extensive use of travelling wave tube in fields such as satellite communications, more and more higher to the requirement of travelling wave tube, as: pulsed TWT is to high power, big work ratio, long-life, highly reliable development.Therefore, as the negative electrode of travelling wave tube heart, equally also need further raising, require current density bigger, the negative electrode working temperature is low, and the life-span improves, thereby guarantees the reliable and stable work of travelling wave tube.The conventional oxide negative electrode can not satisfy these requirements, and film cathode has characteristics such as electronics emission is big, life-span length, anti-electron bombard, so it is microwave device, particularly the main electron source of travelling wave tube.But because the working temperature height of film cathode, thereby heating power is big, for space travelling wave tube, because the restriction of power, target efficient has proposed very high requirement.
Summary of the invention
The purpose of this invention is to provide a kind of high efficient cathode assembly, it can improve the travelling wave tube film cathode efficiency of heating surface, improves the cathode emission level, makes it under alap heating power, reaches the anticathode launch requirements of travelling wave tube.
For achieving the above object, technical solution of the present invention provides a kind of high efficient cathode assembly, form by negative electrode, cathode tube, cathode support tube, heater, negative electrode comprises cathode surface and cathode substrate, between cathode tube and heater, be filled with aluminium oxide, it is provided with tubular in cathode support tube periphery negative electrode heat shielding makes cathode support tube and negative electrode heat shielding constitute two layers of heat shielding structure, and cathode support tube and negative electrode heat shielding are to be made by the Titanium foil material.
Described high efficient cathode assembly, it also comprises a baffle plate, be located between cathode substrate and the heater assembly, so both avoided about 1000 ℃, causing the short circuit of heater, and avoided in preparation heater process target substrate to pollute on the other hand again and influence the emission level of negative electrode with aluminium oxide reaction owing to the barium metal in the emitting material.
Described high efficient cathode assembly, the calandria in its described heater is a tungsten rhenium alloy wire, wherein the content of rhenium is about 25%.
Described high efficient cathode assembly, tungsten-cobalt high-temperature solder is adopted in the welding between its described cathode substrate, cathode tube, the cathode support tube, and the fusing point of scolder is 1550 ℃.
Description of drawings
Fig. 1 is the structural representation of high efficient cathode assembly of the present invention;
Fig. 2 is the heating power of negative electrode-heater assembly of different materials different-thickness cathode support tube and the graph of relation of cathode temperature.
Embodiment
The structure of cathode assembly as shown in Figure 1, basic is conventional structure, form by negative electrode, cathode tube 3, cathode support tube 4, negative electrode heat shielding 5, baffle plate 6, heater 8, negative electrode comprises cathode surface 1 and cathode substrate 2, between cathode tube 3 and heater 8, be filled with aluminium oxide 7, be provided with the negative electrode heat shielding 5 of tubular in cathode support tube 4 peripheries, make cathode support tube 4 and negative electrode heat shielding 5 constitute two layers of heat shielding structure.
Heater 8 adopts the heater assembly structure, and heater assembly is embedded in calandria (generally being W silk or W-Re silk) in the dielectric exactly and (is generally Al
2O
3), avoided vibration to wait the heater short circuit that causes so on the one hand, improved the reliability of heater 8, because becoming heat conduction by thermal radiation to thermal change, the mode of heater 8 heated cathode gives heat on the other hand, so just make the temperature difference between heater 8 and the negative electrode drop to 100 ℃-200 ℃ from 500 ℃-600 ℃, thereby reduced the working temperature of heater 8, improved the efficiency of heating surface of heater 8, avoided owing to the drawback of the too high heater that causes 8 of heater 8 temperature than the more first damage of negative electrode.Therefore, now by more and more widely use.Our used heated filament is the tungsten rhenium alloy wire that contains 25% rhenium, and this silk is compared with the pure tungsten silk, is ductile, intensity is big, recrystallization temperature is high, corrosion resistance improves than characteristics such as resistance increases.
In order to prevent that emitting material in the POROUS TUNGSTEN cathode substrate 2 from permeating and cause short circuit in heater assembly, adding a dividing plate 6 between cathode substrate 2 and heater assembly separates, avoided so on the one hand because the barium metal in the emitting material causes the short circuit of heater 8 with aluminium oxide 7 reactions about 1000 ℃, avoided in preparing heater 8 processes target substrate 2 to pollute on the other hand again and influence the emission level of negative electrode.The structure of this dividing plate 6 relates in other patents, and application number is 200410070108.4, can be with reference to enforcement.But will reduce the heat efficiency of negative electrode like this, therefore, must make contact between the substrate 2 of tungsten matrix cathode and the cathode tube 3 good.In order to improve the heat efficiency of negative electrode, we weld together cathode tube 3 and support tube 4 with a kind of brazing metal, have avoided having the gap between negative electrode cake and the cathode tube 3 so on the one hand, cause the negative electrode heat efficiency to descend.Adhesion between cathode substrate 2 and the cathode tube 3 is improved greatly, thereby increase the impact resistance of negative electrode, but this scolder must possess following characteristics simultaneously: the first, and it must all soak into cathode substrate 2 and support tube 4, could guarantee firm welding like this.The second, its fusing point must be lower than the melting temperature (general about 1600 ℃ of the fusing point of emitting material) of emitting material in the cathode substrate 2, otherwise causes the evaporation of emitting material in welding process.The 3rd, its molten some temperature must be far above negative electrode normal working temperature (the negative electrode working temperature generally is lower than 1100 ℃) otherwise cause the evaporation of scolder in the negative electrode course of work, and then cause the adhesion between cathode substrate 2 and the support tube 4 to descend, and the performance that influences microwave device.We adopt tungsten-cobalt high-temperature solder of developing ourselves, and the fusing point of scolder is 1550 ℃, and this tungsten-cobalt high-temperature solder relates in other patents, and application number is 200410038291.x, can be with reference to enforcement.
For improving the efficiency of heating surface, adopt two layers of heat shielding, wherein the inside one deck is a heat shielding, it is again cathode support tube 4, the negative electrode outwards approach of heat radiation mainly is the thermal radiation of cathode plane 1, cathode tube 3, heater assembly rear end face and the heat conduction of passing through cathode support tube 4, and wherein the dissipation power by support tube 4 outside conduction is:
P=(2πrtδΔT)/l (1)
In the formula: δ is the conductive coefficient of backing material
R is the radius of support tube, and t is the thickness of support tube
Δ T is the temperature difference at cathode support band two ends
L is the cathode support strip length
Can find out that from formula (1) character of 4 materials of cathode support and the anticathode heat efficiency of geometry will play crucial effect, it is little to choose thermal conductivity, and thin as far as possible material is made cathode support tube 4.Generally choose tantalum now and do heat-shield material.Tantalum has high melt point, lower coefficient of linear expansion, when high temperature, have very low vapour pressure, lower thermal conductivity, its machining property is good in addition, can be processed into extremely thin paper tinsel, tantalum has good gettering ability more than 700 ℃ the time, therefore in the negative electrode course of work, can absorb pernicious gas, thereby have higher vacuum degree near making negative electrode.We choose a kind of new material titanium as ground floor heat shielding (being cathode support tube 4) material, and titanium is except the advantage that has above tantalum and have, and it is compared with tantalum, also have lower thermal conductivity (be about tantalum 1/5th) and stronger gettering ability.Fig. 2 has provided the heating power of negative electrode-heater assembly of different materials different-thickness cathode support tube 4 and the relation of cathode temperature.
As can be seen from Figure 2, under 950 ℃ working temperature, 0.3W and 0.7W have descended respectively when its heating power ratio adopted thick 0.03mm tantalum and 0.05mm tantalum to do support tube 4 when negative electrode adopted thick 0.03mm titanium to do support tube 4, this result than the low 0.4W of Russian import negative electrode about, the cathode assembly that adopts 0.03mm titanium support tube 4 at present under 1150 ℃ high temperature continuous operation 1000 hours.
Claims (2)
1. cathode assembly, comprise negative electrode, cathode tube, cathode support tube, heater, negative electrode is made up of cathode surface and cathode substrate, between cathode tube and heater, be filled with aluminium oxide, it is characterized in that, be provided with the negative electrode heat shielding of tubular in cathode support tube periphery, make cathode support tube and negative electrode heat shielding constitute two layers of heat shielding structure, cathode support tube and negative electrode heat shielding are to be made by the metal titanium foil;
Tungsten-cobalt high-temperature solder is adopted in welding between described cathode substrate, cathode tube, the cathode support tube, and the fusing point of scolder is 1550 ℃.
2. cathode assembly as claimed in claim 1, it is characterized in that, also comprise a baffle plate, be located between cathode substrate and the heater assembly, so both avoided causing the short circuit of heater at 1000 ℃ with aluminium oxide reaction, and avoided in preparation heater process target substrate to pollute on the other hand again and influence the emission level of negative electrode owing to the barium metal in the emitting material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2005100867313A CN1956124B (en) | 2005-10-27 | 2005-10-27 | High efficient cathode assembly |
Applications Claiming Priority (1)
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CN2005100867313A CN1956124B (en) | 2005-10-27 | 2005-10-27 | High efficient cathode assembly |
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CN1956124A CN1956124A (en) | 2007-05-02 |
CN1956124B true CN1956124B (en) | 2010-07-21 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102087946B (en) * | 2009-12-02 | 2012-02-29 | 中国科学院电子学研究所 | Structure for improving heating efficiency of cathode heater assembly and preparation method thereof |
CN102468092B (en) * | 2010-11-03 | 2014-03-19 | 中国科学院电子学研究所 | Method for preparing heat element for heated cathode |
CN102832090B (en) * | 2012-08-29 | 2015-04-22 | 安徽华东光电技术研究所 | Heater assembly for space traveling wave tube and preparation method thereof |
CN105931935B (en) * | 2016-04-26 | 2018-02-02 | 北京科技大学 | A kind of high heat conductive insulating medium rapid heat-up cathode filament assembly and preparation method |
CN113828879B (en) * | 2021-08-12 | 2023-02-28 | 南京三乐集团有限公司 | High-efficiency high-consistency cathode assembly welding method for Ku-waveband communication traveling wave tube |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4990823A (en) * | 1988-09-22 | 1991-02-05 | U.S. Philips Corporation | Electron gun and method of manufacturing an electron gun, and display tube comprising such an electron gun |
US5113110A (en) * | 1989-12-31 | 1992-05-12 | Samsung Electron Devices Co., Ltd. | Dispenser cathode structure for use in electron gun |
CN1427439A (en) * | 2001-12-17 | 2003-07-02 | 松下电器产业株式会社 | Cathode frame and cathode sleeve substrate and mfg. method thereof, cathode sleeve structural body and cathode ray tube device |
-
2005
- 2005-10-27 CN CN2005100867313A patent/CN1956124B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4990823A (en) * | 1988-09-22 | 1991-02-05 | U.S. Philips Corporation | Electron gun and method of manufacturing an electron gun, and display tube comprising such an electron gun |
US5113110A (en) * | 1989-12-31 | 1992-05-12 | Samsung Electron Devices Co., Ltd. | Dispenser cathode structure for use in electron gun |
CN1427439A (en) * | 2001-12-17 | 2003-07-02 | 松下电器产业株式会社 | Cathode frame and cathode sleeve substrate and mfg. method thereof, cathode sleeve structural body and cathode ray tube device |
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Granted publication date: 20100721 Termination date: 20121027 |