CN213755092U - 一种具有散热结构的适配器电路板 - Google Patents
一种具有散热结构的适配器电路板 Download PDFInfo
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- CN213755092U CN213755092U CN202022794588.6U CN202022794588U CN213755092U CN 213755092 U CN213755092 U CN 213755092U CN 202022794588 U CN202022794588 U CN 202022794588U CN 213755092 U CN213755092 U CN 213755092U
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- heat dissipation
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- 230000005855 radiation Effects 0.000 title description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 95
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 78
- 238000010438 heat treatment Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003003 spiro group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN202022794588.6U CN213755092U (zh) | 2020-11-27 | 2020-11-27 | 一种具有散热结构的适配器电路板 |
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CN202022794588.6U CN213755092U (zh) | 2020-11-27 | 2020-11-27 | 一种具有散热结构的适配器电路板 |
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CN213755092U true CN213755092U (zh) | 2021-07-20 |
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CN202022794588.6U Active CN213755092U (zh) | 2020-11-27 | 2020-11-27 | 一种具有散热结构的适配器电路板 |
Country Status (1)
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CN (1) | CN213755092U (zh) |
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- 2020-11-27 CN CN202022794588.6U patent/CN213755092U/zh active Active
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Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240520 Address after: 441200, Group 2, Sunlizhuang Village, Taiping Town, Zaoyang City, Xiangyang City, Hubei Province Patentee after: Tian Huanhuan Country or region after: China Address before: No. 37, Zhangyang Fuda Road, Zhangmutou town, Dongguan City, Guangdong Province Patentee before: Dongguan Ao Wei Electronics Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240607 Address after: B1405, Minzhi Commercial Plaza, Intersection of Meilong Road and Minwang Road, Minqiang Community, Minzhi Street, Longhua District, Shenzhen City, Guangdong Province, 518000 Patentee after: Aidian Technology (Shenzhen) Co.,Ltd. Country or region after: China Address before: 441200, Group 2, Sunlizhuang Village, Taiping Town, Zaoyang City, Xiangyang City, Hubei Province Patentee before: Tian Huanhuan Country or region before: China |