WO2012083595A1 - 带有绝缘微散热器的印刷电路板的制备方法 - Google Patents
带有绝缘微散热器的印刷电路板的制备方法 Download PDFInfo
- Publication number
- WO2012083595A1 WO2012083595A1 PCT/CN2011/070051 CN2011070051W WO2012083595A1 WO 2012083595 A1 WO2012083595 A1 WO 2012083595A1 CN 2011070051 W CN2011070051 W CN 2011070051W WO 2012083595 A1 WO2012083595 A1 WO 2012083595A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- copper
- micro
- insulating
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 15
- 238000012937 correction Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000012772 electrical insulation material Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 description 5
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Definitions
- the present invention relates to the field of printed circuit board technology, and more particularly to a method of fabricating a novel printed circuit board combining an insulated micro heat sink with a conventional printed circuit board. Background technique
- PCB Printed Circuit Board
- PCBs provide fixed, assembled mechanical support for electronic components that enable electrical connections between electronic components.
- the component number and some graphics are printed on the PCB, which facilitates the component insertion, inspection and maintenance.
- electronic device from electronic watches and calculators to computers, communication electronic devices, and military weapon systems, uses electronic components for integrated electrical components such as integrated circuits.
- the conventional printed circuit board adopts a hole metallization structure, and the insulating material between the layers is FR4 material, and its thermal conductivity is 0.4 W/mk, and the heat transfer capability is low; the metal-based circuit board developed in recent years, The thermal conductivity of the insulating material between the layers is 1. 3-2. 2W / mk, the heat transfer capacity is still limited.
- a printed circuit board provided with a large number of integrated circuits especially a printed circuit board provided with a high-power light-emitting diode (LED), since the integrated circuit or the LED array is stably operated, the heat generation amount is large, and the junction operating temperature is low (about 60 degrees Celsius).
- the thermal conductivity of the printed circuit board is required to reach tens or hundreds of W/mk, which obviously exceeds the thermal conductivity of the prior art insulating materials. Summary of the invention
- Step A210 providing a heat-conductive electrically insulating substrate covered with copper foil on both upper and lower surfaces, and cutting it into one or more columnar insulated micro-heatsinks coated with copper foil on the upper and lower surfaces according to a predetermined size;
- Step A220 providing a N (N > 1) double-sided or single-sided copper-clad copper plate and (N-1) layer prepreg, cutting into a working circuit board of a printed circuit board according to a predetermined size, using a conventional printed circuit board pattern The method of transferring the inner layer of the printed circuit board on the corresponding copper surface of the copper plate;
- Step A230 In the corresponding position of the copper clad plate and the prepreg, according to the size of the insulating micro heat sink obtained in step A210, the mounting hole of the insulating micro heat sink is prepared by drilling, milling or punching, the shape and size of the mounting hole and the insulation One-to-one correspondence of micro heat sinks;
- Step A240 laminating the copper clad plate and the prepreg with a conventional multilayer printed circuit board stacking method, so that the two copper clad plates are respectively located on the top layer and the bottom layer, and the insulating micro heat sink is placed in the corresponding mounting hole;
- Step A250 The laminated copper plate and the prepreg are pressed according to the traditional multilayer printed circuit board pressing method;
- Step A260 Drilling, hole metallization, outer layer fabrication, solder mask fabrication, surface treatment fabrication, shape fabrication, and mounting of the heat generating device to the insulating microchip according to a conventional printed circuit board preparation method
- a printed circuit board with an insulating micro-heatsink is fabricated on a bottom surface of the heat sink.
- step A220 and step A260 during the preparation process of the inner layer and the outer layer of the printed circuit board, the bottom surface of the insulating micro-heatsink is provided with the inner layer of the heat-emitting device corresponding to the printed circuit board and / or the outer layer is electrically connected; the other bottom surface of the insulating micro-heatsink, that is, the bottom surface on which the heat-generating device is not installed, is insulated from all outer and inner-layer lines.
- step A240 a single-sided copper-clad copper plate on the bottom layer and the top layer is disposed in a direction in which the copper is faced outward.
- the heat generating device is a light emitting diode or a light emitting diode chip.
- the electrically insulating substrate may be cut into an elliptical cylindrical shape, a cubic shape, or a columnar insulating micro heat sink having a rhombic shape, a triangular shape, and a trapezoidal shape on both the upper and lower surfaces.
- the insulating micro-heat sink is made of an electrical insulating material such as alumina ceramic, aluminum nitride ceramic, silicon carbide, diamond or the like.
- the present invention combines an insulating micro heat sink having a thermal conductivity with a conventional rigid printed circuit board, so that the rigid printed circuit board has the thermal conductivity and heat transfer stability of the insulated micro heat sink.
- the traditional printed circuit board has the advantages of flexible wiring and reliable electrical connection, and can heat the heat generated by the light-emitting diodes and the like during operation to the outside of the printed circuit board in time, which is ideal for the heating element and its array.
- Carrier plate The preparation method is simple and practical, and has strong practicability.
- Figure 1 is a schematic cross-sectional view of a printed circuit board with an insulated micro-heat sink of the present invention.
- FIG. 2 is a flow chart showing a method of manufacturing the printed circuit board with the insulated micro heat sink shown in FIG. detailed description
- FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the present invention.
- the printed circuit board is a rigid printed circuit board, which comprises a three-layer copper plate 110 and a two-layer cured plate 120 which are successively laminated and laminated, wherein the top plate and the bottom plate of the printed circuit board are both
- the copper plate 110 is provided with a copper layer line 130 on the upper and lower surfaces of each layer of the copper plate 110.
- the printed circuit board further includes a two-column-shaped insulating micro-heatsink 150 respectively embedded in two cylindrical through-holes penetrating the printed circuit board, the insulating micro-heatsink 150 having the same thickness as the printed circuit board
- the upper and lower bottom surfaces 151 are covered with a copper layer, and the upper bottom surface 151 is respectively provided with an LED chip 160.
- the LED chip 160 is electrically connected to the inner layer circuit of the printed circuit board (not shown), and the insulating micro heat dissipation.
- the other bottom surface 151 of the device 150 is insulated from other circuitry of the printed circuit board.
- the insulating micro-heat sink 150 is made of a high thermal conductivity electrical insulating material such as alumina ceramic, aluminum nitride ceramic, silicon carbide, diamond, etc., and the thermal conductivity between the two bottom surfaces of the insulating micro heat sink 150 can be achieved. 20-1000W/mk.
- the LED chip 160 operates, and the LED illuminator emits heat, and the heat is conducted to the other bottom surface 151 of the insulating micro-heatsink 150 through the insulating micro-heatsink 150, and then passes through the copper layer of the bottom surface 151. Conduct heat away from the printed circuit board.
- FIG. 2 it is a flow chart of a method for preparing a printed circuit board with an insulated micro-heat sink shown in FIG. 1, the method comprising the following steps:
- Step A210 providing a heat-conductive electrically insulating substrate covered with copper foil on both upper and lower surfaces, and cutting it into two upper and lower bottom surfaces 151 according to a predetermined size, and a cylindrical insulating micro-heatsink 150 covered with copper foil;
- Step A220 providing three layers of copper-clad board 110 and two pre-cured sheets on both the upper and lower surfaces, and cutting into a working board of a printed circuit board according to a predetermined size, and using a conventional printed circuit board pattern transfer method on the corresponding copper-clad surface of the copper-clad board 110 Making inner wiring of the printed circuit board;
- Step A230 In the corresponding position of the copper clad plate 110 and the prepreg, according to the size of the insulating micro heat sink obtained in step A210, the mounting hole of the insulating micro heat sink 150 is prepared by drilling, milling or punching, and the mounting hole is The shape and size correspond to the insulation proud radiator 150-one;
- Step A240 The copper-clad board 110 and the prepreg are laminated on each other by a conventional multilayer printed circuit board stacking method, so that the two copper-clad boards 110 are respectively located on the top layer and the bottom layer, and the insulating heat sink 150 is placed in the corresponding mounting hole. ;
- Step A250 The laminated copper plate 110 and the prepreg are pressed according to the conventional multilayer printed circuit board, and after pressing, the prepreg becomes the cured sheet 120;
- Step A260 Drilling, hole metallization, outer layer fabrication, solder mask fabrication, surface treatment fabrication, shape fabrication, and mounting of the LED chip 160 to the laminated laminate according to a conventional printed circuit board preparation method
- a printed circuit board with an insulating micro-heatsink 150 is fabricated.
- the upper bottom surface 151 of the insulating heat sink 150 may be provided with a heat generating device such as an integrated circuit chip of a light emitting diode element or a non-light emitting diode chip;
- a N (N > 1) layer of copper clad plate and (N-1) layer prepreg may be provided to form a 2N layer printed circuit board;
- the copper-clad board provided may be a double-sided copper-clad board or a single-sided copper-clad board; for a single-sided copper-clad board, when the copper-clad board and the prepreg are laminated, the copper-clad board on the top layer and the bottom layer is required to be The copper is placed in the outward direction.
- the electrically insulating substrate can be cut into an elliptical cylindrical shape, a cubic shape, or a columnar insulating micro heat sink having a rhombic, a triangular shape and a trapezoidal shape on the upper and lower surfaces, and the cut insulating micro heat sink is determined by actual circuit requirements. For one or more.
- the heat generating component of the present invention is electrically connected to the inner and/or outer layer of the printed circuit board.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Led Device Packages (AREA)
Description
说 明 书 带有绝缘傲散热器的印刷电路板的制备方法 技术领域
本发明涉及印刷电路板技术领域， 尤其是一种将绝缘微散热器与传统印刷 电路板相结合的新型的印刷电路板的制备方法。 背景技术
印刷电路板 ( Printed Circui t Board, PCB )是电子工业的重要部件之一。
PCB能为电子元件提供固定、装配的机械支撑，可实现电子元件之间的电气连接。 另外， PCB上都印有元件的编号和一些图形， 这为元件插装、检查、 维修提供了 方便。 几乎每种电子设备， 小到电子手表、 计算器， 大到计算机、 通讯电子设 备、 军用武器系统， 只要有集成电路等电子元件， 为了它们之间的电气互连， 都要使用印刷电路板。
传统的印刷电路板采用孔金属化的结构， 层与层之间的绝缘材料为 FR4材 料， 其热导率为 0. 4W/mk，传热能力较低； 近年来发展的金属基电路板， 层与层 之间绝缘材料的热导率为 1. 3-2. 2W/mk,传热能力仍然有限。对于设置有大量集 成电路的印刷电路板， 尤其是设置有大功率发光二极管 （LED )的印刷电路板， 由于集成电路或发光二极管阵列稳定运行时， 发热量大， 结工作温度低（约 60 摄氏度）， 要求该印刷电路板的热导率达到数十或数百 W/mk， 显然， 这远远超出 了现有技术的绝缘材料的热导率。 发明内容
针对以上现有的印刷电路板的不足， 本发明的目的是提供一种带有绝缘微 散热器的印刷电路板的制备方法。
本发明的目的是通过釆用以下技术方案来实现的： 一种带有绝缘微散热器
1
更正页 （细则第 91条)
说 明 书 的印刷电路板的制备方法， 该方法包括以下步骤：
步骤 A210: 提供上下表面均覆有铜箔的髙导热电气绝缘基板， 并按照预定 尺寸将其切割成一个或多个上下底面均覆有铜箔的柱状绝缘微散热器；
步骤 A220:提供 N (N > 1)层双面或单面敷铜的敷铜板及 ( N-1 )层半固化片， 按照预定尺寸切割成印刷电路板的工作拼板， 釆用传统印刷电路板图形转移的 方法在敷铜板的对应敷铜表面制作印刷电路板的内层线路；
步骤 A230: 在敷铜板和半固化片的相应位置，按照步骤 A210所得绝缘微散 热器的尺寸， 采用钻、 铣或冲等方式， 制作出绝缘微散热器的安装孔， 安装孔 的形状和尺寸与绝缘微散热器一一对应；
步骤 A240: 采用传统多层印刷电路板叠层的方法将敷铜板及半固化片相间 叠层， 使二敷铜板分别位于顶层和底层， 将绝缘微散热器放入对应的安装孔中； 步骤 A250: 将叠层好的敷铜板及半固化片， 按传统多层印刷电路板压合的 方法进行压合；
步骤 A260: 按照传统的印刷电路板制备方法对压合好的层压板进行钻孔、 孔金属化制作、 外层线路制作、 阻焊制作、 表面处理制作、 外形制作以及将发 热器件安装于绝缘微散热器的一底面上， 带有绝缘微散热器的印刷电路板制作 完成。
作为本发明优选的技术方案， 在步驟 A220及步骤 A260中， 印刷电路板内 层线路和外层线路制备过程中， 绝缘微散热器的设置发热器件的底面与印刷电 路板对应的内层线路和 /或外层线路电气连通； 绝缘微散热器的另一底面即未安 装发热器件的底面与所有的外层线路和内层线路绝缘。
作为本发明优选的技术方案， 步骤 A240中， 将位于底层和顶层的单面敷铜 的敷铜板以敷铜面向外的方向设置。
作为本发明优选的技术方案， 所述发热器件为发光二极管或发光二极管芯 片。
2
更正页 （细则第 91条)
说 明 书 作为本发明优选的技术方案， 步骤 A210中， 可将电气绝缘基板切割成椭圆 柱形、 立方体形、 或上下底面均为菱形、 三角形、 梯形的柱状的绝缘微散热器。
作为本发明优选的技术方案， 所述绝缘微散热器为氧化铝陶瓷、 氮化铝陶 瓷、 碳化硅、 金刚石等髙导热率的电气绝缘材料制成。
相对于现有技术， 本发明将具有髙热导率的绝缘微散热器与传统刚性印刷 电路板相结合， 使刚性印刷电路板兼具了绝缘微散热器的髙热导率、 传热稳定 以及传统的印刷电路板的走线灵活、 电气连接可靠等两方面的优点， 可将发光 二极管等发热元件在工作时散发的热量及时有效地传导至印刷电路板外， 是发 热元件及其阵列理想的载板； 制备方法简便易行， 实用性强。 附图说明
下面结合附图与具体实施例对本发明作进一步说明：
图 1是本发明带有绝缘微散热器的印刷电路板的剖面示意图。
图 2为图 1所示的带有绝缘微散热器的印刷电路板的制备方法的流程图。 具体实施方式
图 1为本发明较佳实施方式的剖面示意图。
如图 1 所示， 该印刷电路板为一刚性印刷电路板， 其包括依次交又叠压的 三层敷铜板 110和二层固化片 120，其中， 印刷电路板的顶层板及底层板均为敷 铜板 110， 每一层敷铜板 110的上下表面均设有铜层线路 130。 该印刷电路板还 包括二圃柱形的绝缘微散热器 150，其分别嵌设于二贯穿印刷电路板的圆柱形通 孔内， 该绝缘微散热器 150 的髙度与印刷电路板的厚度相同， 其上下底面 151 均覆有铜层，在其上底面 151分别设有一发光二极管芯片 160，该发光二极管芯 片 160与印刷电路板的内层电路电气连接（图中未示出）， 绝缘微散热器 150的 另一底面 151与印刷电路板的其他电路绝缘。
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更正页 （细则第 91条)
说 明 书 所述绝缘微散热器 150为氧化铝陶瓷、 氮化铝陶瓷、 碳化硅、 金刚石等高 导热率的电气绝缘材料制成， 该绝缘微散热器 150 的两底面之间的热导率可达 到 20-1000W/mk。
该印刷电路板应用过程中， 发光二极管芯片 160工作， 发光二极管发光体 发光散发热量， 热量通过绝缘微散热器 150传导至绝缘微散热器 150的另一底 面 151， 再经该底面 151的铜层将热量传导至印刷电路板外。
如图 2所示， 其为图 1所示带有绝缘微散热器的印刷电路板的制备方法的 流程图， 该方法包括以下步骤：
步骤 A210: 提供一上下表面均覆有铜箔的髙导热电气绝缘基板， 并按照预 定尺寸将其切割成两个上下底面 151覆有铜箔的圃柱形绝缘微散热器 150;
步骤 A220: 提供三层上下表面均敷铜的敷铜板 110及二半固化片， 按照预 定尺寸切割成印刷电路板的工作拼板， 采用传统印刷电路板图形转移的方法在 敷铜板 110的对应敷铜表面制作印刷电路板的内层线路；
步猓 A230: 在敷铜板 110和半固化片的相应位置，按照步猓 A210所得绝缘 微散热器的尺寸， 釆用钻、 铣或冲等方式， 制作出绝缘微散热器 150的安装孔， 安装孔的形状和尺寸与绝缘傲散热器 150—一对应；
步骤 A240: 采用传统多层印刷电路板叠层的方法将敷铜板 110及半固化片 相间叠层， 使二敷铜板 110分别位于顶层和底层， 同时， 将绝缘傲散热器 150 放入对应的安装孔中；
步骤 A250: 将叠层好的敷铜板 110及半固化片， 按传统多层印刷电路板压 合的方法进行压合， 压合后， 半固化片成为固化片 120;
步骤 A260: 按照传统的印刷电路板制备方法对压合好的层压板进行钻孔、 孔金属化制作、 外层线路制作、 阻焊制作、 表面处理制作、 外形制作以及将发 光二极管芯片 160安装于绝缘微散热器 150的一底面 151上， 带有绝缘微散热 器 150的印刷电路板制作完成。
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更正页 （细则第 91条)
说 明 书 需要注意的是， 在印刷电路板内层线路和外层线路制备过程中， 需保证绝 缘傲散热器 150的设置发光二极管芯片 160的底面 151与印刷电路板对应的内 层线路电气连通； 绝缘微散热器 150的另一底面 151 即未安装发光二极管芯片 160的底面 151与所有的外层线路和内层线路绝缘。
本发明的带有绝缘微散热器的印刷电路板的制备方法不仅限于上述较佳实 施方式， 凡是依本发明所作的等效变化与修改， 都被本发明权利要求书的范围 所覆盖。 例如：
步骤 A260中， 绝缘傲散热器 150的上底面 151可设置一发光二极管元件或 非发光二极管芯片的集成电路芯片等发热器件；
步骤 A220中， 可提供 N (N > 1)层敷铜板及（N- 1 )层半固化片以制成 2N层 印刷电路板；
步骤 A220中， 所提供的敷铜板可为双面敷铜板， 也可为单面敷铜板； 如为 单面敷铜板， 在敷铜板和半固化片叠压时， 需将位于顶层和底层的敷铜板以其 敷铜面向外的方向放置。
步骤 A210中， 可将电气绝缘基板切割成椭圆柱形、 立方体形、 或上下底面 均为菱形、 三角形、 梯形的柱状的绝缘微散热器， 所切割的绝缘微散热器由实 际电路需要决定， 可为一个或多个。
本发明发热元件与印刷电路板的内层和 /或外层线路电气连接。
5
更正页 （细则第 91条)
Claims
1、 一种带有绝缘微散热器的印刷电路板的制备方法， 其特征是： 该方法包 括以下步骤：
步骤 A210: 提供上下表面均覆有铜箔的高导热电气绝缘基板， 并按照预定 尺寸将其切割成一个或多个上下底面均覆有铜箔的柱状绝缘微散热器；
步骤 A220: 提供 N (N > 1)层双面或单面敷铜的敷铜板及（ N-1 )层半固化片， 按照预定尺寸切割成印刷电路板的工作拼板， 釆用传统印刷电路板图形转移的 方法在敷铜板的对应敷铜表面制作印刷电路板的内层线路；
步骤 A230: 在敷铜板和半固化片的相应位置，按照步骤 A210所得绝缘微散 热器的尺寸， 釆用钻、 铣或冲等方式， 制作出绝缘微散热器的安装孔， 安装孔 的形状和尺寸与绝缘微散热器一一对应；
步骤 A240: 釆用传统多层印刷电路板叠层的方法将敷铜板及半固化片相间 叠层， 使二敷铜板分别位于顶层和底层， 将绝缘微散热器放入对应的安装孔中； 步骤 A250: 将叠层好的敷铜板及半固化片， 按传统多层印刷电路板压合的 方法进行压合；
步骤 A260: 按照传统的印刷电路板制备方法对压合好的层压板进行钻孔、 孔金属化制作、 外层线路制作、 阻焊制作、 表面处理制作、 外形制作以及将发 热器件安装于绝缘微散热器的一底面上， 带有绝缘微散热器的印刷电路板制作 完成。
2、 根据权利要求 1所述的带有绝缘微散热器的印刷电路板的制备方法， 其 特征是： 步骤 A210中， 将髙导热电气绝缘基板切割成椭圆柱形、 立方体形或上 下底面均为菱形、 三角形、 梯形的柱状的绝缘傲散热器。
3、 根据杈利要求 1所述的带有绝缘微散热器的印刷电路板的制备方法， 其 特征是： 步骤 A210中， 所述髙导热电气绝缘基板为氧化铝陶瓷、 氣化铝陶瓷、 碳化硅、 金刚石等电气绝缘材料制成。
4、 根据杈利要求 1所述的带有绝缘微散热器的印刷电路板的制备方法， 其
6
更正页 （细则第 91条) 权利要求书 特征是： 在步骤 A220及步骤 A260中， 印刷电路板的内层线路和外层线路制备 过程中， 绝缘微散热器的设置发热器件的底面与印刷电路板对应的内层线路和 / 或外层线路电气连通； 绝缘微散热器的另一底面即未安装发热器件的底面与所 有的外层线路和内层线路绝缘。
5、 根据权利要求 1所述的带有绝缘微散热器的印刷电路板的制备方法， 其 特征是： 步骤 A240中， 将位于底层和顶层的单面敷铜的敷铜板以敷铜面向外的 方向设置。
6、 根据杈利要求 1所述的带有绝缘微散热器的印刷电路板的制备方法， 其 特征是： 所述发热器件为发光二极管或发光二极管芯片。
更正页 （细则第 91条)
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