CN213692029U - Water-cooled thyristor radiator module - Google Patents
Water-cooled thyristor radiator module Download PDFInfo
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- CN213692029U CN213692029U CN202022697770.XU CN202022697770U CN213692029U CN 213692029 U CN213692029 U CN 213692029U CN 202022697770 U CN202022697770 U CN 202022697770U CN 213692029 U CN213692029 U CN 213692029U
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- heat dissipation
- plate body
- thyristor
- base plate
- coolant liquid
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Abstract
The utility model discloses a water-cooled thyristor radiator module relates to thyristor heat dissipation equipment technical field, including the heat dissipation base plate, arbitrary terminal surface of heat dissipation base plate is for supplying the installation face of thyristor installation, first coolant liquid runner and second coolant liquid runner have been seted up in the heat dissipation base plate, the side of heat dissipation base plate seted up with first inlet and the first liquid outlet of first coolant liquid runner intercommunication and with second inlet and the second liquid outlet of second coolant liquid runner intercommunication. The utility model discloses well thyristor installs on the heat dissipation base plate, and the heat that the thyristor during operation produced can transmit to the heat dissipation base plate rapidly, outwards disperses by the heat dissipation base plate, simultaneously, sets up the coolant liquid runner in the heat dissipation base plate, flows at the coolant liquid inner loop and takes away the heat that the thyristor during operation produced, has effectively guaranteed the radiating efficiency of thyristor.
Description
Technical Field
The utility model relates to a thyristor heat dissipation equipment technical field especially relates to a water-cooling type thyristor radiator module.
Background
The thyristor is also called as silicon controlled rectifier, can work under the conditions of high voltage and high power, can control the working process, and is widely applied to electronic circuits such as controllable rectification, alternating current voltage regulation, contactless electronic switch, inversion, frequency conversion and the like.
The thyristor is a high-power electronic component, so that the power consumption is high, a large amount of heat can be generated in the operation process, and the thyristor is sensitive to temperature and poor in heat dissipation treatment, so that the service life of the thyristor can be directly influenced. At present, generally, the thyristor is cooled by air, namely, a radiating fin is additionally arranged for radiating, so that the cooling efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, overcome prior art's shortcoming, provide a water-cooling type thyristor radiator module.
In order to solve the technical problem, the technical scheme of the utility model as follows:
the utility model provides a water-cooling type thyristor radiator module, includes the heat dissipation base plate, arbitrary terminal surface of heat dissipation base plate is for supplying the installation face of thyristor installation, first coolant liquid runner and second coolant liquid runner have been seted up in the heat dissipation base plate, first coolant liquid runner with the plane at second coolant liquid runner place all is on a parallel with the installation face, just the plane at first coolant liquid runner place with interval between the installation face is less than the plane at second coolant liquid runner place with interval between the installation face, the side of heat dissipation base plate set up with first inlet and the first liquid outlet and with second inlet and the second liquid outlet of second coolant liquid runner intercommunication of first coolant liquid runner intercommunication.
As a preferred scheme of water-cooling type thyristor radiator module, wherein: the heat dissipation base plate comprises a first plate body, a second plate body, a third plate body and a fourth plate body which are sequentially stacked along the thickness direction of the heat dissipation base plate, wherein the first plate body corresponds to one opposite side of the second plate body and is provided with a first groove body, the first plate body is in butt joint with the second plate body and is provided with a second groove body in a butt joint mode, the first groove body is in butt joint with the second groove body to form a first cooling liquid flow channel, the third plate body corresponds to one opposite side of the fourth plate body and is provided with a second groove body, and the third plate body is in butt joint with the fourth plate body and is provided with a second groove body in a butt joint mode.
As a preferred scheme of water-cooling type thyristor radiator module, wherein: the first cooling liquid flow channel and the second cooling liquid flow channel are arranged in a snake shape.
As a preferred scheme of water-cooling type thyristor radiator module, wherein: the first cooling liquid flow channels extend along the length direction of the heat dissipation substrate, and the second cooling liquid flow channels extend along the width direction of the heat dissipation substrate.
As a preferred scheme of water-cooling type thyristor radiator module, wherein: the heat dissipation substrate is made of aluminum.
The utility model has the advantages that:
(1) the thyristor is arranged on the heat dissipation substrate, the heat generated during the operation of the thyristor can be rapidly transmitted to the heat dissipation substrate and is dissipated outwards by the heat dissipation substrate, meanwhile, the cooling liquid flow channel is arranged in the heat dissipation substrate, the heat generated during the operation of the thyristor is taken away through the circulation flow of the cooling liquid in the cooling flow channel, and the heat dissipation efficiency of the thyristor is effectively ensured;
(2) in the utility model, the first cooling liquid flow channel and the second cooling liquid flow channel are arranged in the heat dissipation substrate, when the cooling liquid flows in the first cooling liquid flow channel and the second cooling liquid flow channel, the heat dissipation efficiency of the heat dissipation substrate is further improved, so that the heat dissipation efficiency of the heat dissipation substrate can be adjusted by changing the number of the cooling liquid flow channels through which the cooling liquid flows according to the running power of the thyristor;
(3) in the utility model, the first cooling liquid flow channel and the second cooling liquid flow channel are both arranged in a snake shape, so that the contact area of the cooling liquid and the heat dissipation substrate is increased, the heat dissipation efficiency is improved, and meanwhile, the extending directions of the first cooling liquid flow channel and the second cooling liquid flow channel are mutually vertical, so that the coverage area of the cooling liquid flow channel in the heat dissipation substrate is increased;
(4) the utility model discloses well heat dissipation base plate is by first plate body, second plate body, third plate body and fourth plate body range upon range of formation in proper order, and when the coolant liquid runner in the heat dissipation base plate takes place to block up, can unpack adjacent plate body apart, is convenient for clear up the coolant liquid runner.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a water-cooled thyristor radiator module provided by the present invention;
fig. 2 is a top view of the second plate;
fig. 3 is a top view of a fourth plate body;
wherein: 1. a heat-dissipating substrate; 2. a mounting surface; 3. a first tank body; 4. a second tank body; 5. a first liquid inlet; 6. a first liquid outlet; 7. a second liquid inlet; 8. a second liquid outlet; 9. a first plate body; 10. a second plate body; 11. a third plate body; 12. a fourth plate body; 13. and (7) installing holes.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
The embodiment provides a water-cooling type thyristor radiator module, which comprises an aluminum radiating substrate 1, wherein the upper end surface of the radiating substrate 1 is a mounting surface 2 for mounting a thyristor, and a mounting hole 13 is formed in the mounting surface 2. A first cooling liquid flow channel and a second cooling liquid flow channel are arranged in the heat dissipation substrate 1, the planes of the first cooling liquid flow channel and the second cooling liquid flow channel are parallel to the mounting surface 2, and the distance between the plane of the first cooling liquid flow channel and the mounting surface 2 is smaller than the distance between the plane of the second cooling liquid flow channel and the mounting surface 2. The heat generated during the operation of the thyristor is taken away through the circulating flow of the cooling liquid in the cooling flow channel, the heat dissipation efficiency of the thyristor is effectively ensured, and the heat dissipation efficiency of the heat dissipation substrate 1 can be adjusted by changing the number of the cooling liquid flow channels through which the cooling liquid flows according to the operation power of the thyristor.
Preferably, the first cooling liquid flow channel and the second cooling liquid flow channel are arranged in a serpentine shape, so that the contact area between the cooling liquid and the heat dissipation substrate 1 is increased, and the heat dissipation efficiency is improved. In addition, the first cooling liquid flow channels which are arranged in a snake shape extend along the length direction of the heat dissipation substrate 1, and the second cooling liquid flow channels which are arranged in a snake shape extend along the width direction of the heat dissipation substrate 1, so that the extending directions of the first cooling liquid flow channels and the second cooling liquid flow channels are mutually vertical, and the coverage area of the cooling liquid flow channels in the heat dissipation substrate 1 is increased.
The heat dissipation substrate 1 is formed by sequentially stacking a first plate 9, a second plate 10, a third plate 11 and a fourth plate 12 in the thickness direction, and a first groove 3 is formed in the lower end face of the first plate 9 and the upper end face of the second plate 10. After the first plate body 9 and the second plate body 10 are aligned and butted, the two first groove bodies 3 are spliced to form a first cooling liquid flow channel, and a first liquid inlet 5 and a first liquid outlet 6 communicated with the first cooling liquid flow channel are formed on the side surface of the heat dissipation substrate 1. A second groove 4 is formed on the lower end surface of the third plate 11 and the upper end surface of the fourth plate 12. After the third plate body 11 and the fourth plate body 12 are aligned and butted, the two second groove bodies 4 are spliced to form a second cooling liquid channel, and a second liquid inlet 7 and a second liquid outlet 8 communicated with the second cooling liquid channel are formed on the side surface of the heat dissipation substrate 1. Therefore, when the cooling liquid flow channel in the heat dissipation substrate 1 is blocked, the adjacent plate bodies can be disassembled, and the cooling liquid flow channel is convenient to clean.
It should be noted that, sealing strips are fixedly provided on both sides of the first plate 9 and the second plate 10, which are located on the first tank 3, and sealing strips are also fixedly provided on both sides of the third plate 11 and the fourth plate 12, which are located on the second tank 4. After the plate bodies are sequentially laminated, the sealing strip can play a role in sealing, and the cooling liquid in the cooling liquid channel is prevented from leaking from the gap between the adjacent plate bodies.
In addition, bolt holes are formed in corresponding positions of the four plate bodies, and the four plate bodies can be tightly connected through bolts and nuts after being aligned and stacked.
The utility model discloses a set up the coolant liquid runner at the heat dissipation basically, flow at the coolant liquid internal circulation through the coolant liquid and take away the heat that the thyristor during operation produced, effectively guaranteed the radiating efficiency of thyristor, simultaneously, can adjust the radiating efficiency of heat dissipation base plate 1 through the quantity that changes the coolant liquid runner that the coolant liquid flows according to the operating power of thyristor.
In addition to the above embodiments, the present invention may have other embodiments; all the technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope claimed by the present invention.
Claims (5)
1. A water-cooled thyristor radiator module which characterized in that: including heat dissipation base plate (1), arbitrary terminal surface of heat dissipation base plate (1) is for supplying installation face (2) of thyristor installation, first coolant liquid runner and second coolant liquid runner have been seted up in heat dissipation base plate (1), first coolant liquid runner with the plane at second coolant liquid runner place all is on a parallel with installation face (2), just the plane at first coolant liquid runner place with interval between installation face (2) is less than the plane at second coolant liquid runner place with interval between installation face (2), the side of heat dissipation base plate (1) seted up with first inlet (5) and first liquid outlet (6) and with second inlet (7) and second liquid outlet (8) that second coolant liquid runner communicates.
2. The water-cooled thyristor heat sink module of claim 1, wherein: the heat dissipation substrate (1) comprises a first plate body (9), a second plate body (10), a third plate body (11) and a fourth plate body (12) which are sequentially stacked along the thickness direction,
one opposite side of the first plate body (9) and the second plate body (10) is correspondingly provided with a first groove body (3), and after the first plate body (9) is butted with the second plate body (10), the two first groove bodies (3) are butted to form a first cooling liquid flow channel,
the third plate body (11) and the opposite side of the fourth plate body (12) are correspondingly provided with a second groove body (4), and after the third plate body (11) and the fourth plate body (12) are butted, the second groove bodies (4) are butted to form a second cooling liquid flow channel.
3. The water-cooled thyristor radiator module of claim 1 or 2, wherein: the first cooling liquid flow channel and the second cooling liquid flow channel are arranged in a snake shape.
4. The water-cooled thyristor heat sink module of claim 3, wherein: the first cooling liquid flow channels extend and are arranged along the length direction of the heat dissipation substrate (1), and the second cooling liquid flow channels extend and are arranged along the width direction of the heat dissipation substrate (1).
5. The water-cooled thyristor heat sink module of claim 1, wherein: the heat dissipation substrate (1) is made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022697770.XU CN213692029U (en) | 2020-11-20 | 2020-11-20 | Water-cooled thyristor radiator module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022697770.XU CN213692029U (en) | 2020-11-20 | 2020-11-20 | Water-cooled thyristor radiator module |
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| Publication Number | Publication Date |
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| CN213692029U true CN213692029U (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022697770.XU Active CN213692029U (en) | 2020-11-20 | 2020-11-20 | Water-cooled thyristor radiator module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114838542A (en) * | 2022-05-07 | 2022-08-02 | 深圳市华盛源机电有限公司 | Liquid cooling plate |
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2020
- 2020-11-20 CN CN202022697770.XU patent/CN213692029U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114838542A (en) * | 2022-05-07 | 2022-08-02 | 深圳市华盛源机电有限公司 | Liquid cooling plate |
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