CN213692018U - High-efficient radiator module for thyristor - Google Patents
High-efficient radiator module for thyristor Download PDFInfo
- Publication number
- CN213692018U CN213692018U CN202022705373.2U CN202022705373U CN213692018U CN 213692018 U CN213692018 U CN 213692018U CN 202022705373 U CN202022705373 U CN 202022705373U CN 213692018 U CN213692018 U CN 213692018U
- Authority
- CN
- China
- Prior art keywords
- plate
- heat dissipation
- thyristor
- heating panel
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high-efficient radiator module for thyristor relates to semiconductor heat dissipation technical field, including two blocks of heating panels that set up relatively and the fastener of connecting two heating panels, two fixed mounting has at least one thyristor between the heating panel, the heating panel includes the base plate, two the terminal surface that the base plate was kept away from each other all is provided with two locating plates that are parallel to each other, two form the confession between the locating plate the mounting groove of fastener installation, the base plate with be provided with a plurality of heat radiation fins between the locating plate, the coolant liquid runner has all been seted up in the heating panel, arbitrary in the heating panel the exit end and another of coolant liquid runner in the heating panel the entry end intercommunication of cooling runner. The utility model discloses a set up the mode that heat radiation fins increased heat radiating area and water-cooling combined together and cool down the thyristor, guaranteed the radiating efficiency.
Description
Technical Field
The utility model relates to a semiconductor heat dissipation technical field especially relates to a high-efficient radiator module is used to thyristor.
Background
The thyristor is also called as silicon controlled rectifier, can work under the conditions of high voltage and high power, can control the working process, and is widely applied to electronic circuits such as controllable rectification, alternating current voltage regulation, contactless electronic switch, inversion, frequency conversion and the like.
The thyristor is a high-power electronic component, so that the power consumption is high, a large amount of heat can be generated in the operation process, and the thyristor is sensitive to temperature and poor in heat dissipation treatment, so that the service life of the thyristor can be directly influenced. Generally, the thyristor is heat-dissipated by adding a heat sink. Most of the existing radiators rely on radiating fins to radiate, and the existing radiators are simple in structure and poor in radiating effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, overcome prior art's shortcoming, provide a high-efficient radiator module is used to thyristor.
In order to solve the technical problem, the technical scheme of the utility model as follows:
the utility model provides a high-efficient radiator module for thyristor, includes two heating panels that set up relatively and the fastener of connecting two heating panels, two fixed mounting has at least one thyristor between the heating panel, the heating panel includes the base plate, two the terminal surface that the base plate kept away from each other all is provided with two locating plates that are parallel to each other, two form the confession between the locating plate the mounting groove of fastener installation, the base plate with be provided with a plurality of heat radiation fins between the locating plate, all seted up the coolant liquid runner in the heating panel, arbitrary in the heating panel the exit end and another of coolant liquid runner in the heating panel the entry end intercommunication of cooling runner.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: the cooling liquid flow channels in the cooling plate are all arranged in a snake shape.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: the base plate with be provided with the mounting panel between the locating plate, heat radiation fins is fixed to be set up on the mounting panel, the mounting panel is located the base plate with angular division between the locating plate is in the face, be located the mounting panel orientation base plate one side heat radiation fins all is on a parallel with the base plate, and follow the width direction of mounting panel equidistance in proper order is arranged, is located the mounting panel orientation locating plate one side heat radiation fins all is on a parallel with the locating plate, and follows the width direction of mounting panel equidistance in proper order is arranged.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: the end part of the positioning plate is provided with a first baffle parallel to the base plate, and two sides of the first baffle are respectively connected with the end parts of the positioning plate and the mounting plate, so that the positioning plate and the heat dissipation fins between the mounting plates are surrounded.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: the end part of the base plate is provided with a second baffle parallel to the positioning plate, and two sides of the second baffle are respectively connected with the end parts of the base plate and the mounting plate to surround the heat dissipation fins between the base plate and the mounting plate.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: and heat dissipation fins perpendicular to the substrates are arranged at the opposite ends of the two substrates.
As an optimized scheme of high-efficient radiator module for thyristor, wherein: the heat dissipation plate is made of aluminum.
The utility model has the advantages that:
(1) the utility model has the advantages that the two heat dissipation plates are clamped at the upper end and the lower end of the thyristor, heat generated by the thyristor during working can be dissipated outwards through the heat dissipation plates, the two heat dissipation plates are both provided with the cooling liquid flow channel, and the heat absorbed by the heat dissipation plates can be taken away when the cooling liquid circularly flows in the flow channel, so that the heat dissipation plates are always kept at a lower temperature, and the heat dissipation effect on the thyristor is ensured;
(2) the cooling liquid flow passages in the heat dissipation plate are distributed in a snake shape, so that the area of the cooling liquid flow passages in the heat dissipation plate is increased, the contact area of the cooling liquid and the heat dissipation plate is further increased, and the heat exchange efficiency is improved;
(3) the utility model has the advantages that the mounting plate is fixedly arranged in the angular bisector between the base plate and the positioning plate, and the radiating fins are uniformly distributed on the two sides of the mounting plate, so that the radiating fins are diverged in a tree shape, and the radiating effect of the radiating fins is effectively improved;
(4) the utility model discloses install first baffle and second baffle on base plate and locating plate respectively, this first baffle and second baffle surround the heat radiation fin inside, have avoided dust impurity etc. to pile up between heat radiation fin and mounting panel and influence the radiating effect of heat radiation fin;
(5) the utility model discloses well heating panel is made by the aluminum product, and coefficient of heat conductivity is high, and heat dispersion is superior.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a high-efficiency heat sink module for a thyristor according to the present invention;
FIG. 2 is a schematic cross-sectional view A-A of FIG. 1;
wherein: 1. a heat dissipation plate; 2. a fastener; 3. a substrate; 4. positioning a plate; 5. mounting grooves; 6. heat dissipation fins; 7. a coolant flow passage; 8. and (7) mounting the plate.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
The embodiment provides a high-efficient radiator module for thyristor, including two piece aluminium system's heating panel 1 about, at least one thyristor is fixed to be pressed from both sides between two heating panel 1. The two heat dissipation plates 1 are fixedly connected through fasteners 2 to be stably clamped at the upper end and the lower end of the thyristor. The fastening member 2 may include a fastening bolt and a fixing nut which are inserted into the two heat radiating plates 1.
Wherein, every heating panel 1 all includes base plate 3, and the equal fixed mounting of the lower terminal surface that is located the base plate 3's of top up end and is located the base plate 3 of below has two locating plates 4, and two locating plates 4 on arbitrary base plate 3 all are perpendicular to place base plate 3, and form the mounting groove 5 that is located the 3 middle parts of base plate between two locating plates 4, and fastener 2 all is located this mounting groove 5. All fixedly between base plate 3 and locating plate 4 is provided with mounting panel 8, and this mounting panel 8 is located locating plate 4 and keeps away from one side of mounting groove 5, and mounting panel 8 is located the angular bisector between base plate 3 and locating plate 4. A plurality of radiating fins 6 parallel to the substrate 3 are fixedly arranged on one side of the mounting plate 8 facing the substrate 3, and the radiating fins 6 are sequentially arranged at equal intervals in the vertical direction. A plurality of heat dissipation fins 6 parallel to the positioning plate 4 are fixedly arranged on one side of the mounting plate 8 facing the positioning plate 4, and the heat dissipation fins 6 are sequentially arranged at equal intervals in the horizontal direction. The arrangement makes the plurality of radiating fins 6 on the mounting plate 8 radiate outwards in a tree shape, and effectively improves the radiating effect of the radiating fins 6.
Preferably, the end of the positioning plate 4 far from the base plate 3 is fixedly provided with a first baffle plate, and the other side of the first baffle plate is connected with the end of the adjacent mounting plate 8. The first baffle plate, the adjacent positioning plate 4 and the adjacent mounting plate 8 are spliced into a triangular prism, and the heat dissipation fins 6 which are positioned on one side of the mounting plate 8 facing the positioning plate 4 are positioned inside the triangular prism. And second baffles are fixedly arranged on two sides of the base plate 3, and the other ends of the second baffles are connected with the end parts of the adjacent mounting plates 8. The second baffle plate, the adjacent substrate 3 and the positioning plate 4 are spliced into a triangular prism, and the heat dissipation fins 6 which are arranged on one side of the substrate 3 are all positioned in the triangular prism. The first baffle and the second baffle surround the heat radiating fins 6, so that dust, impurities and the like are prevented from being accumulated between the heat radiating fins 6 and the mounting plate 8 to influence the heat radiating effect of the heat radiating fins 6.
The lower end surface of the substrate 3 positioned above and the upper end surface of the substrate 3 positioned below are both provided with the heat dissipation fins 6 perpendicular to the substrates 3, so that the upper end and the lower end of any one substrate 3 are both provided with a plurality of heat dissipation fins 6, and the heat dissipation efficiency of the heat dissipation plate 1 is further improved.
In addition, each heat dissipation plate 1 is provided with a cooling liquid flow channel 7, and an inlet end and an outlet end communicated with the cooling liquid flow channel 7, the inlet end of the cooling liquid flow channel 7 in the heat dissipation plate 1 positioned above is communicated with a cooling liquid supply end through a pipeline, the outlet end of the cooling liquid flow channel 7 in the heat dissipation plate 1 positioned below is communicated with the inlet end of the cooling liquid flow channel 7 in the heat dissipation plate 1 positioned below, and the outlet end of the cooling liquid flow channel 7 in the heat dissipation plate 1 positioned below is communicated with the cooling liquid supply end. The cooling liquid supply end conveys the cooling liquid to the cooling liquid flow channel 7 in the upper heat dissipation plate 1 through a pump body and a pipeline, and the cooling liquid flows through the cooling liquid flow channels 7 in the two heat dissipation plates 1 and then returns to the cooling liquid supply end again, so that the circulating flow of the cooling liquid is realized. The cooling liquid drives the heat absorbed by the heat dissipation plate 1 during the flowing process, so that the heat dissipation plate 1 is maintained at a lower temperature.
Preferably, the cooling liquid flow passages 7 in each heat dissipation plate 1 are arranged in a serpentine manner, so that the area of the cooling liquid flow passages 7 in the heat dissipation plate 1 is increased, the contact area between the cooling liquid and the heat dissipation plate 1 is increased, and the heat exchange efficiency is improved.
The utility model discloses all be provided with the heat radiation fins 6 of dispersing the form on two heating panels 1, increased heating panel 1's heat radiating area, simultaneously, seted up coolant liquid runner 7 in heating panel 1, the heat in the heating panel 1 is taken away in the circulation flow through the coolant liquid, makes heating panel 1 remain throughout at lower temperature to the radiating effect to the thyristor has been guaranteed. Therefore, the utility model discloses a mode that heat radiation fins 6 and water-cooling combined together is cooled down the thyristor, has guaranteed the radiating efficiency.
In addition to the above embodiments, the present invention may have other embodiments; all the technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope claimed by the present invention.
Claims (7)
1. The utility model provides a high-efficient radiator module is used to thyristor, includes two heating panel (1) that set up relatively and fastener (2) of connecting two heating panel (1), two fixed mounting has at least one thyristor, its characterized in that between heating panel (1): the heat dissipation plate (1) comprises base plates (3), two positioning plates (4) which are parallel to each other are arranged on the end faces of the two base plates (3) which are far away from each other, an installation groove (5) for installing the fastener (2) is formed between the two positioning plates (4), a plurality of heat dissipation fins (6) are arranged between the base plates (3) and the positioning plates (4),
all seted up coolant liquid runner (7) in heating panel (1), arbitrary in heating panel (1) the exit end of coolant liquid runner (7) with another heating panel (1) in the entry end intercommunication of cooling runner.
2. The efficient heat sink module for a thyristor according to claim 1, wherein: the cooling liquid flow channels (7) in the heat dissipation plate (1) are all distributed in a snake shape.
3. The efficient heat sink module for a thyristor according to claim 1, wherein: an installation plate (8) is arranged between the base plate (3) and the positioning plate (4), the radiating fins (6) are fixedly arranged on the installation plate (8), the installation plate (8) is positioned in an angular bisector between the base plate (3) and the positioning plate (4),
the heat dissipation fins (6) which are positioned on one side of the mounting plate (8) facing the base plate (3) are all parallel to the base plate (3) and are sequentially arranged at equal intervals along the width direction of the mounting plate (8),
be located mounting panel (8) orientation locating plate (4) one side radiator fin (6) all are on a parallel with locating plate (4), and follow the width direction of mounting panel (8) is equidistance in proper order and arranges.
4. The efficient heat sink module for a thyristor according to claim 3, wherein: the end of the positioning plate (4) is provided with a first baffle parallel to the base plate (3), the two sides of the first baffle are respectively connected with the ends of the positioning plate (4) and the mounting plates (8), and the positioning plate (4) and the heat dissipation fins (6) between the mounting plates (8) are surrounded.
5. The efficient heat sink module for a thyristor according to claim 4, wherein: the end of the base plate (3) is provided with a second baffle parallel to the positioning plate (4), the two sides of the second baffle are respectively connected with the end of the base plate (3) and the end of the mounting plate (8), and the base plate (3) and the heat dissipation fins (6) between the mounting plates (8) are surrounded.
6. The efficient heat sink module for a thyristor according to claim 3, wherein: and heat dissipation fins (6) perpendicular to the substrates (3) are arranged at the opposite ends of the two substrates (3).
7. The efficient heat sink module for a thyristor according to claim 1, wherein: the heat dissipation plate (1) is made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705373.2U CN213692018U (en) | 2020-11-20 | 2020-11-20 | High-efficient radiator module for thyristor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705373.2U CN213692018U (en) | 2020-11-20 | 2020-11-20 | High-efficient radiator module for thyristor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213692018U true CN213692018U (en) | 2021-07-13 |
Family
ID=76735073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022705373.2U Active CN213692018U (en) | 2020-11-20 | 2020-11-20 | High-efficient radiator module for thyristor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213692018U (en) |
-
2020
- 2020-11-20 CN CN202022705373.2U patent/CN213692018U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110383470B (en) | Cooling system | |
| US9237676B2 (en) | Semiconductor module cooler and semiconductor module | |
| EP2768017B1 (en) | Cooler for semiconductor module, and semiconductor module | |
| US20130301328A1 (en) | Power conversion apparatus | |
| CN101193547A (en) | Radiator | |
| CN108766946B (en) | Liquid cooling heat abstractor and motor controller | |
| CN201788963U (en) | Copper water cooled radiator | |
| CN210694701U (en) | Cold drawing and machine controller for power module | |
| US20220173012A1 (en) | Semiconductor device | |
| CN216775385U (en) | Optical module liquid cooling radiator | |
| CN209882439U (en) | Double-sided heat dissipation high-performance water-cooling radiator and electrical equipment | |
| JPH0832262A (en) | Cooling module for lsi | |
| CN214316109U (en) | Subregion fin | |
| CN213692018U (en) | High-efficient radiator module for thyristor | |
| CN213692029U (en) | Water-cooled thyristor radiator module | |
| CN2612070Y (en) | Liquid cooling radiator | |
| CN112153854A (en) | Cold plate for power module and motor controller | |
| GB2560338A (en) | Cooling plate | |
| CN216054663U (en) | Double-side liquid cooling IGBT radiator | |
| CN216161725U (en) | Radiator structure of balanced cooling of single tube IGBT | |
| CN219981405U (en) | Radiator and electrical equipment | |
| CN210444726U (en) | Radiator structure and heat radiation device of inversion welding mechanism | |
| CN221860950U (en) | Forced diversion water radiator | |
| CN108882594B (en) | Efficient heat dissipation's converter rack | |
| CN218158942U (en) | Semiconductor refrigerating sheet type liquid cooling heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |