CN114838542A - Liquid cooling plate - Google Patents

Liquid cooling plate Download PDF

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Publication number
CN114838542A
CN114838542A CN202210490659.4A CN202210490659A CN114838542A CN 114838542 A CN114838542 A CN 114838542A CN 202210490659 A CN202210490659 A CN 202210490659A CN 114838542 A CN114838542 A CN 114838542A
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CN
China
Prior art keywords
liquid
pipe
base plate
liquid cooling
cooling pipe
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210490659.4A
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Chinese (zh)
Inventor
刘希望
童千华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Huasheng Yuan Electrical Co ltd
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Shenzhen Huasheng Yuan Electrical Co ltd
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Publication date
Application filed by Shenzhen Huasheng Yuan Electrical Co ltd filed Critical Shenzhen Huasheng Yuan Electrical Co ltd
Priority to CN202210490659.4A priority Critical patent/CN114838542A/en
Publication of CN114838542A publication Critical patent/CN114838542A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D1/00Devices using naturally cold air or cold water
    • F25D1/02Devices using naturally cold air or cold water using naturally cold water, e.g. household tap water
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/22Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a liquid cooling plate. The liquid cooling plate comprises a substrate assembly and a pipeline assembly, the substrate assembly comprises a first substrate and a second substrate which are mutually laminated, and the pipeline assembly comprises a first liquid cooling pipe, a second liquid cooling pipe and a third liquid cooling pipe which are mutually connected in series; one side of the first base plate facing the second base plate or one side of the first base plate back to the second base plate is provided with a first groove body, one side of the second base plate facing the first base plate is provided with a second groove body, and one side of the second base plate back to the first base plate is provided with a third groove body; the first liquid cooling pipe is arranged in the first groove body, the second liquid cooling pipe is arranged in the second groove body, and the third liquid cooling pipe is arranged in the third groove body. The liquid cooling plate is equivalent to three layers of pipelines for cooling medium to flow on the two substrates, the time for the cooling medium to flow in the liquid cooling plate is longer, and the cooling effect of the liquid cooling plate is better.

Description

Liquid cooling plate
Technical Field
The invention relates to the technical field of radiators, in particular to a liquid cooling plate.
Background
The copper tube water-cooling plate is a common radiator at present, and the basic structure of the copper tube water-cooling plate is that a groove body is arranged on one surface of a base plate, a copper tube is arranged in the groove body, and cooling water or other cooling media flow in the copper tube. The base plate is made by the heat conduction material, with treating radiating object contact, treats that the heat of radiating object transmits base plate, copper pipe, coolant in proper order, along with coolant's flow, thereby treats radiating object and is taken away and realize the heat dissipation.
However, in the existing radiator, the length of the copper pipe is short, the flowing time of the cooling medium in the radiator is short, and the cooling medium cannot sufficiently absorb the heat of the object to be radiated, so that the cooling effect of the radiator is not ideal.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. To this end, the present invention proposes a liquid-cooled panel having a long pipe assembly, a long flowing time of a cooling medium in the pipe assembly, and a cooling effect of the liquid-cooled panel.
A liquid-cooled panel according to an embodiment of the present invention includes: the base plate assembly comprises a first base plate and a second base plate which are connected with each other and are stacked mutually, wherein a first groove body is arranged on one side, facing the second base plate, of the first base plate or one side, back to the second base plate, of the first base plate, a second groove body is arranged on one side, facing the first base plate, of the second base plate, and a third groove body is arranged on one side, back to the first base plate, of the second base plate; the pipeline assembly comprises a first liquid cooling pipe, a second liquid cooling pipe and a third liquid cooling pipe, wherein cooling media flow through the first liquid cooling pipe, the second liquid cooling pipe and the third liquid cooling pipe, the first liquid cooling pipe is arranged in the first groove body, the second liquid cooling pipe is arranged in the second groove body, the third liquid cooling pipe is arranged in the third groove body, and the first liquid cooling pipe, the second liquid cooling pipe and the third liquid cooling pipe are connected in series.
The liquid cooling plate provided by the embodiment of the invention has at least the following beneficial effects: the liquid cooling plate is equivalent to the structure that three layers of pipelines for cooling media to flow are arranged on two substrates (the three layers of pipelines respectively correspond to a first liquid cooling pipe, a second liquid cooling pipe and a third liquid cooling pipe), and the three layers of pipelines are mutually connected in series; therefore, the cooling medium flows in the liquid-cooled plate for a longer time, which is advantageous for the cooling medium to sufficiently absorb the heat of the object to be radiated, thereby improving the cooling effect of the liquid-cooled plate.
According to some embodiments of the invention, the pipe assembly further comprises a first joining pipe and a second joining pipe, one end of the first liquid-cooled pipe is connected with the second liquid-cooled pipe through the first joining pipe, and the other end of the first liquid-cooled pipe is connected with the third liquid-cooled pipe through the second joining pipe; one end of the second liquid cooling pipe, which is far away from the first linking pipe, is used for allowing the cooling medium to leave the pipeline assembly, and one end of the third liquid cooling pipe, which is far away from the second linking pipe, is used for allowing the cooling medium to enter the pipeline assembly.
According to some embodiments of the invention, an end of the second liquid cooling tube remote from the first connecting tube is an outlet end of the pipe assembly, an end of the third liquid cooling tube remote from the second connecting tube is an inlet end of the pipe assembly, and the inlet end and the outlet end are located at the same end of the base plate assembly.
According to some embodiments of the invention, the first and second adapter tubes are located at a same end of the substrate assembly, and the first and second adapter tubes are located at opposite ends of the substrate assembly, respectively.
According to some embodiments of the invention, a side of the second substrate facing away from the first substrate has a first contact plane, a side of the third liquid-cooling pipe facing away from the first substrate has a second contact plane, the third tank is opened on the first contact plane, and the first contact plane is flush with the second contact plane.
According to some embodiments of the invention, the first, second and third liquid-cooled tubes are serpentine in shape, and the first, second and third troughs are serpentine in shape.
According to some embodiments of the invention, the second slot body comprises a plurality of second longitudinal portions extending along the first direction and a plurality of second engaging portions spaced apart along the second direction, the second engaging portions are connected to ends of the second longitudinal portions, and every two adjacent second longitudinal portions are connected by one second engaging portion, so that the second slot body has a serpentine shape; the third tank body comprises a plurality of third longitudinal portions and a plurality of third connecting portions, the third longitudinal portions extend along the first direction, the third longitudinal portions are distributed at intervals along the second direction, the third connecting portions are connected to the ends of the third longitudinal portions, and every two adjacent third longitudinal portions are connected through one third connecting portion, so that the third tank body is in a serpentine shape; the second and third longitudinal portions are offset from each other along the second direction.
According to some embodiments of the invention, the second and third engagement portions are staggered from each other in the first direction.
According to some embodiments of the invention, the second slot body comprises a plurality of second longitudinal portions and a plurality of second connecting portions, the second longitudinal portions extend along the first direction, the second longitudinal portions are distributed at intervals along the second direction, the second connecting portions are connected to the ends of the second longitudinal portions, and every two adjacent second longitudinal portions are connected through one second connecting portion, so that the second slot body has a serpentine shape; the first trough body comprises a plurality of first longitudinal parts and a plurality of first connecting parts, the first longitudinal parts extend along the first direction, the first longitudinal parts are distributed at intervals along the second direction, the first connecting parts are connected to the ends of the first longitudinal parts, and every two adjacent first longitudinal parts are connected through one first connecting part, so that the first trough body is in a serpentine shape; the first and second longitudinal portions are offset from each other along the second direction.
According to some embodiments of the invention, the first and second engagement portions are staggered from each other in the first direction.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic view of a liquid-cooled panel according to an embodiment of the present invention;
FIG. 2 is a schematic view of another angle of the liquid cooled panel of FIG. 1;
FIG. 3 is an exploded view of the liquid cooled panel of FIG. 1;
FIG. 4 is a schematic view of the underside of the first substrate of FIG. 3;
FIG. 5 is a schematic view of the upper side of the second substrate in FIG. 3;
FIG. 6 is a schematic view of the underside of the second substrate of FIG. 3;
FIG. 7 is a cross-sectional view of the liquid cooled plate of FIG. 1 taken along section A-A;
FIG. 8 is an enlarged view of area B of FIG. 7;
FIG. 9 is a schematic view of the relative positions of the second and third channels.
Reference numerals:
100-liquid cold plate, 101-first substrate, 102-second substrate, 103-inlet end, 104-outlet end, 105-first adapter, 106-second adapter, 107-substrate assembly;
301-a first liquid-cooled tube, 302-a second liquid-cooled tube, 303-a third liquid-cooled tube, 304-a elbow portion, 305-a body portion;
401-a first slot, 402-a first longitudinal portion, 403-a first engagement portion;
501-a second slot body, 502-a second longitudinal part, 503-a second engagement part;
601-a third slot, 602-a third longitudinal portion, 603-a third engagement portion;
801-first contact plane, 802-second contact plane.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The invention provides a liquid cooling plate 100, wherein the liquid cooling plate 100 comprises a substrate assembly 107 and a pipeline assembly, wherein the substrate assembly 107 comprises a first substrate 101 and a second substrate 102, and the pipeline assembly comprises a first liquid cooling pipe 301, a second liquid cooling pipe 302 and a third liquid cooling pipe 303.
The first substrate 101 and the second substrate 102 are both made of a heat conductive material, for example, the first substrate 101 and the second substrate 102 may both be provided as an aluminum plate. The first substrate 101 and the second substrate 102 are connected to each other, and specifically, they may be connected by screws; for example, holes for screws to pass through are formed at the edges of the first substrate 101 and the second substrate 102. Referring to fig. 1 and 3, a first substrate 101 is overlaid on a second substrate 102, and the first substrate 101 and the second substrate 102 are laminated to each other.
Both the first substrate 101 and the second substrate 102 may be in contact with an object to be heat dissipated. Specifically, a side of the first substrate 101 opposite to the second substrate 102 may be in contact with an object to be heat dissipated, and a side of the second substrate 102 opposite to the first substrate 101 may also be in contact with an object to be heat dissipated; taking fig. 1 as an example, the upper surface of the first substrate 101 may contact an object to be heat-dissipated, and the lower surface of the second substrate 102 may contact the object to be heat-dissipated. Also, what the first substrate 101 and the second substrate 102 are in contact with may be two different objects to be radiated. The connection between the object to be cooled and the first substrate 101 or the second substrate 102 may be by contact, adhesion, screw connection, or the like.
The first base plate 101 has a first channel 401, the first channel 401 is disposed on a side of the first base plate 101 facing the second base plate 102 or facing away from the second base plate 102, and fig. 3 and 4 show a case where the first channel 401 is disposed on a side of the first base plate 101 facing the second base plate 102. Referring to fig. 5 and 6, the second substrate 102 has a second slot 501 and a third slot 601, the second slot 501 is disposed on a side of the second substrate 102 facing the first substrate 101, and the third slot 601 is disposed on a side of the second substrate 102 facing away from the first substrate 101. Taking the specific directions of fig. 5 and 6 as examples, the second tank 501 is disposed on the upper side of the second base plate 102, and the third tank 601 is disposed on the lower side of the second base plate 102. The first groove body 401, the second groove body 501 and the third groove body 601 can be machined by a numerical control lathe (i.e. CNC machining).
Referring to fig. 3 to 6, a first liquid-cooled tube 301 is disposed in a first tank 401, a second liquid-cooled tube 302 is disposed in a second tank 501, and a third liquid-cooled tube 303 is disposed in a third tank 601. Referring to fig. 7, after the liquid-cooled panel 100 is assembled, the first liquid-cooled tube 301, the second liquid-cooled tube 302, and the third liquid-cooled tube 303 are sequentially stacked from top to bottom. The first liquid cooling pipe 301 and the first base plate 101 can be connected together by means of bonding, welding and the like, so that the first liquid cooling pipe 301 is fixed in the first tank body 401; the connection manner between the second substrate 102 and the second and third liquid-cooled tubes 302 and 303 is similar, and the description is not repeated here. The first liquid-cooled tube 301, the second liquid-cooled tube 302, and the third liquid-cooled tube 303 are all made of a heat conductive material, for example, all three are provided as copper tubes. The first liquid-cooling tube 301, the second liquid-cooling tube 302 and the third liquid-cooling tube 303 are connected in series (the series connection sequence of the three is not strictly limited by the "series connection" here), and the lumens of the three can allow the cooling medium to flow.
The liquid cooling plate 100 provided by the invention is equivalent to that three layers of pipelines for cooling medium to flow are arranged on two substrates and are connected in series, so that the time for the cooling medium to flow in the liquid cooling plate 100 is longer, the cooling medium can fully absorb the heat of an object to be cooled, and the cooling effect of the liquid cooling plate 100 is improved.
As noted above, first liquid-cooled tube 301, second liquid-cooled tube 302, and third liquid-cooled tube 303 are connected in series with one another; specifically, in some embodiments, the third liquid-cooling pipe 303, the first liquid-cooling pipe 301, and the second liquid-cooling pipe 302 may be connected in series, that is, the cooling medium flows through the third liquid-cooling pipe 303, the first liquid-cooling pipe 301, and the second liquid-cooling pipe 302 in sequence.
Referring to fig. 2 and 3, the pipe assembly further includes a first connecting pipe 105 and a second connecting pipe 106, one end of the first liquid-cooling pipe 301 is connected to the second liquid-cooling pipe 302 through the first connecting pipe 105, and the other end of the first liquid-cooling pipe 301 is connected to the third liquid-cooling pipe 303 through the second connecting pipe 106. While the end of the second liquid-cooled tube 302 remote from the connection of the first adapter tube 105 serves as the outlet end 104 of the tube assembly (outlet end 104 for the cooling medium to leave the tube assembly), and the end of the third liquid-cooled tube 303 remote from the second adapter tube 106 serves as the inlet end 103 of the tube assembly (inlet end 103 for the cooling medium to enter the tube assembly).
That is, with reference to the specific directions of fig. 2 and 3, the cooling medium enters the third liquid-cooling pipe 303 from the left front end of the third liquid-cooling pipe 303, flows out from the rear end, and flows into the first liquid-cooling pipe 301 through the second connecting pipe 106 (flows in from the right rear end of the first liquid-cooling pipe 301); subsequently, the cooling medium flows out from the left rear end of the first liquid-cooled tube 301, and flows into the second liquid-cooled tube 302 through the first joint tube 105 (flows in from the left rear end of the second liquid-cooled tube 302); finally, the cooling medium flows out from the right front end of the second liquid-cooling pipe 302.
In order to increase the cooling effect of the object to be cooled, it is necessary to reduce the temperature of the cooling medium flowing through the first substrate 101 and reduce the temperature of the cooling medium flowing through the second substrate 102 on the side opposite to the first substrate 101 as much as possible. In general, as the cooling medium flows through the liquid cooling plate 100, the cooling medium absorbs heat, and the temperature of the cooling medium gradually increases. Compared with other serial sequences, if the third liquid-cooling tube 303, the first liquid-cooling tube 301 and the second liquid-cooling tube 302 are sequentially connected in series, the sequence of the cooling medium flowing through the third liquid-cooling tube 303 and the first liquid-cooling tube 301 is relatively earlier, and the temperature of the cooling medium flowing through the third liquid-cooling tube 303 and the first liquid-cooling tube 301 is relatively lower; accordingly, the temperature of the cooling medium flowing through the first substrate 101 and the temperature of the cooling medium flowing through the side of the second substrate 102 opposite to the first substrate 101 are both low, which is beneficial to improve the cooling effect of the liquid-cooled plate 100.
Referring to fig. 2, both the first and second connection pipes 105 and 106 may be provided as U-shaped pipes; in the case where the first, second, and third liquid-cooling pipes 301, 302, and 303 are all provided as copper pipes, the first and second connecting pipes 105 and 106 may also be provided as copper pipes. The first connecting pipe 105 and the pipe to be connected can be connected by welding. The second connecting tube 106 and the pipe to be connected may also be connected by welding.
Referring to fig. 1 or 2, in some embodiments, the inlet end 103 and the outlet end 104 may be disposed at the same end of the substrate assembly 107, which may facilitate connection of a liquid supply system (not shown) to the liquid cooled plate 100 and may also facilitate reducing complexity of the layout of the liquid supply lines. Referring to FIG. 1, to facilitate connection of the liquid cooled plate 100 to an external liquid supply system, the inlet end 103 and outlet end 104 may also be raised relative to the edges of the substrate assembly 107 such that the inlet end 103 and outlet end 104 are connected to quick connect fittings (not shown).
Further, referring to fig. 1 and 2, in some embodiments, the first adapter tube 105 and the second adapter tube 106 are also distributed at the same end of the substrate assembly 107, and the first adapter tube 105 and the inlet end 103 are located at opposite ends of the substrate assembly 107, respectively. In this arrangement, on the one hand, the inlet end 103 and the outlet end 104 do not hinder the soldered mounting of the first adapter tube 105 nor of the second adapter tube 106; on the other hand, the protruding first and second adapters 105 and 106 do not obstruct the connection of the inlet and outlet ends 103 and 104 to the quick connect couplings, facilitating the connection between the liquid cooled plate 100 and the liquid supply system.
In order to increase the total length of the pipe assembly and thus increase the flow time of the cooling medium in the liquid cooling plate 100, the first liquid cooling pipe 301, the second liquid cooling pipe 302 and the third liquid cooling pipe 303 may be arranged in a serpentine shape (accordingly, the first tank 401 needs to be arranged in a serpentine groove). Taking the first liquid-cooling tube 301 as an example, referring to fig. 3, the first liquid-cooling tube 301 includes a main body 305 and an elbow portion 304, the main body 305 extends along a first direction, a plurality of main bodies 305 are distributed at intervals along a second direction, an end of the main body 305 is connected to the elbow portion 304, and two adjacent main bodies 305 are connected by one elbow portion 304, thereby forming the serpentine first liquid-cooling tube 301. The first direction is perpendicular to the second direction, the first direction may correspond to a front-back direction in fig. 3, and the second direction may correspond to a left-right direction in fig. 3. Referring to fig. 3, the main portion 305 is a straight pipe segment in the first liquid-cooling pipe 301, and the elbow portion 304 corresponds to an elbow pipe segment in the first liquid-cooling pipe 301 for connecting two straight pipe segments. The main body 305 and the elbow 304 may be integrally formed or may be connected by welding.
The first liquid cooling pipe 301 is arranged in a serpentine shape, so that the total length of the first liquid cooling pipe 301 or the pipeline assembly can be increased, the flowing time of a cooling medium in the liquid cooling plate 100 is increased, and the cooling effect of the liquid cooling plate 100 is enhanced. Similarly, referring to fig. 3, in order to increase the overall length of the pipe assembly and enhance the cooling effect of the liquid cooling plate 100, the second liquid cooling pipe 302 and the third liquid cooling pipe 303 may also be arranged in a serpentine shape, and the second liquid cooling pipe 302 and the third liquid cooling pipe 303 may also include a plurality of main portions 305 and a plurality of elbow portions 304, which will not be described again. Accordingly, referring to fig. 5 and 6, when the second liquid-cooled tube 302 is arranged in a serpentine shape, the second tank 501 needs to be arranged in a serpentine shape, and when the third liquid-cooled tube 303 is arranged in a serpentine shape, the third tank 601 needs to be arranged in a serpentine shape.
Referring to fig. 4, when the first channel 401 is configured as a serpentine channel, the first channel 401 includes a plurality of first longitudinal portions 402 and a plurality of first engaging portions 403, the first longitudinal portions 402 extend in a first direction, the plurality of first longitudinal portions 402 are spaced apart in a second direction, ends of the first longitudinal portions 402 are connected to the first engaging portions 403, and two adjacent first longitudinal portions 402 are connected end to end by one first engaging portion 403, thereby forming the serpentine first channel 401. Referring to fig. 3 and 4, first longitudinal portions 402 extend in the front-rear direction, each first longitudinal portion 402 is configured to receive a main body portion 305 of a first liquid-cooled tube 301, and each first engaging portion 403 is substantially U-shaped, and each first engaging portion 403 is configured to receive a bent portion 304 of the first liquid-cooled tube 301.
Similarly, referring to fig. 5, the second slot 501 includes a plurality of second longitudinal portions 502 and a plurality of second engagement portions 503. The second longitudinal portion 502 extends along the first direction, the plurality of second longitudinal portions 502 are distributed at intervals along the second direction, the second connection portion 503 is connected with the end portion of the second longitudinal portion 502, the second connection portion 503 is U-shaped, and two adjacent second longitudinal portions 502 are connected end to end through the second connection portion 503, so that a serpentine second slot 501 is formed.
Similarly, referring to fig. 6, the third slot 601 includes a plurality of third longitudinal portions 602 and a plurality of third connecting portions 603, the third longitudinal portions 602 extend along the first direction, the plurality of third longitudinal portions 602 are spaced apart along the second direction, the third connecting portions 603 are connected to ends of the third longitudinal portions 602, the third connecting portions 603 are U-shaped, and two adjacent third longitudinal portions 602 are connected end to end by one third connecting portion 603, so as to form the serpentine third slot 601.
Since the two sides of the second substrate 102 are both provided with the slots, in order to prevent the local structural strength of the second substrate 102 or the substrate assembly 107 from being too low, the overlapping portion of the second slot 501 and the third slot 601 can be reduced.
Referring to fig. 7-9, in some embodiments, in the second direction, the second longitudinal portion 502 and the third longitudinal portion 602 may be staggered; specifically, the second vertical portion 502 and the third vertical portion 602 are not overlapped with each other in the left-right direction. Fig. 9 is a plan view of the second substrate 102, and the position of the third groove 601 is shown by a dotted line in fig. 9.
Referring to fig. 8, in the second direction, each third longitudinal portion 602 is disposed between two adjacent second longitudinal portions 502. If the second longitudinal portion 502 and the third longitudinal portion 602 are overlapped up and down, the thickness of the overlapping portion of the second longitudinal portion 502 and the third longitudinal portion 602 in the second substrate 102 is small, the structural strength of the portion is low, bending or breaking is easy to occur, and the risk of breaking the second substrate 102 during grooving is high. If the second longitudinal portion 502 and the third longitudinal portion 602 are disposed in a staggered manner, the thickness of the second substrate 102 at the position where the second longitudinal portion 502 or the third longitudinal portion 602 is disposed will not be too small, which is beneficial to avoiding the local structural strength of the second substrate 102 from being too low, thereby improving the overall structural strength of the liquid cooling plate 100, and improving the impact resistance and the service life of the liquid cooling plate 100.
Similarly, referring to fig. 7 and 8, in a second direction, the first and second longitudinal portions 402, 502 may be offset from each other; specifically, the first longitudinal portion 402 and the second longitudinal portion 502 are not overlapped up and down by being staggered in the left-right direction, so that the overall structural strength of the substrate assembly 107 is prevented from being too low. In addition, as mentioned above, the heat of the object to be cooled is transferred to a certain substrate, and then transferred to a certain liquid cooling tube; if the direct contact area between two liquid-cooled tubes is too large, the cooling medium in one liquid-cooled tube absorbs the heat of the cooling medium in the other liquid-cooled tube, which results in a decrease in the cooling effect of the liquid-cooled panel 100. Under the condition that the first longitudinal portion 402 and the second longitudinal portion 502 are staggered with each other, the direct contact area between the first liquid-cooling pipe 301 and the second liquid-cooling pipe 302 is small, so that the cooling medium in the first liquid-cooling pipe 301 can be prevented from absorbing the heat of the cooling medium in the second liquid-cooling pipe 302, and the liquid-cooling plate 100 can be ensured to have a good cooling effect.
In addition to the offset arrangement between the different longitudinal portions, the different engagement portions may also be offset relative to each other, thereby avoiding a too low local structural strength of the substrate assembly 107. For example, referring to fig. 9, the second and third linking portions 503 and 603 may be staggered from each other in the first direction; specifically, the second connection portion 503 and the third connection portion 603 are shifted from each other in the front-rear direction, and the second connection portion 503 and the third connection portion 603 do not overlap each other vertically.
Similarly, in order to avoid the local structural strength of the substrate assembly 107 from being too low and to reduce the direct contact area between the first liquid-cooled tube 301 and the second liquid-cooled tube 302, the first joining part 403 and the second joining part 503 may be arranged to be staggered with each other along the first direction; specifically, the first joining portion 403 and the second joining portion 503 are shifted from each other in the front-rear direction, and the first joining portion 403 and the second joining portion 503 do not overlap each other vertically. The offset arrangement between the first linking portion 403 and the second linking portion 503 is similar to the offset arrangement between the second linking portion 503 and the third linking portion 603 in fig. 9, and is not illustrated in detail here.
Referring to fig. 8, in some embodiments, a side of the second substrate 102 opposite to the first substrate 101 has a first contact plane 801, a side of the third liquid cooling tube 303 opposite to the first substrate 101 has a second contact plane 802, the third slot 601 is opened on the first contact plane 801, and the first contact plane 801 and the second contact plane 802 are flush. Taking the orientation of fig. 8 as an example, the underside of the second substrate 102 has a first contact plane 801 and the underside of the third liquid-cooled plate 100 has a second contact plane 802. In this arrangement, when the first contact plane 801 is in contact with the object to be cooled, a part of the object to be cooled is also in contact with the second contact plane 802, i.e. there is a larger contact area between the object to be cooled and the third liquid-cooling tube 303. A part of heat of the object to be cooled can be directly transferred to the third liquid-cooled tube 303 without being transferred to the third liquid-cooled tube 303 through the second substrate 102, which is beneficial to reducing thermal resistance in the heat transfer process, thereby improving the cooling effect of the liquid-cooled plate 100 on the object to be cooled.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.

Claims (10)

1. Liquid-cooled panel, characterized in that it comprises:
the base plate assembly comprises a first base plate and a second base plate which are connected with each other and are stacked mutually, wherein a first groove body is arranged on one side, facing the second base plate, of the first base plate or one side, back to the second base plate, of the first base plate, a second groove body is arranged on one side, facing the first base plate, of the second base plate, and a third groove body is arranged on one side, back to the first base plate, of the second base plate;
the pipeline assembly comprises a first liquid cooling pipe, a second liquid cooling pipe and a third liquid cooling pipe, wherein cooling media flow through the first liquid cooling pipe, the second liquid cooling pipe and the third liquid cooling pipe, the first liquid cooling pipe is arranged in the first groove body, the second liquid cooling pipe is arranged in the second groove body, the third liquid cooling pipe is arranged in the third groove body, and the first liquid cooling pipe, the second liquid cooling pipe and the third liquid cooling pipe are connected in series.
2. The liquid cold plate of claim 1, wherein said pipe assembly further comprises a first joining pipe and a second joining pipe, one end of said first liquid cold pipe being connected to said second liquid cold pipe through said first joining pipe, the other end of said first liquid cold pipe being connected to said third liquid cold pipe through said second joining pipe;
one end of the second liquid cooling pipe, which is far away from the first linking pipe, is used for allowing the cooling medium to leave the pipeline assembly, and one end of the third liquid cooling pipe, which is far away from the second linking pipe, is used for allowing the cooling medium to enter the pipeline assembly.
3. The liquid cooled plate of claim 2, wherein the end of the second liquid cooled tube distal from the first joining tube is an outlet end of the tube assembly, the end of the third liquid cooled tube distal from the second joining tube is an inlet end of the tube assembly, and the inlet end and the outlet end are located at the same end of the substrate assembly.
4. The liquid cooled panel of claim 3, wherein the first and second adapter tubes are located at a same end of the base plate assembly, and the first adapter tube and the inlet end are located at opposite ends of the base plate assembly, respectively.
5. The liquid cooling plate of claim 1, wherein a side of the second substrate facing away from the first substrate has a first contact plane, a side of the third liquid cooling tube facing away from the first substrate has a second contact plane, the third slot opens at the first contact plane, and the first contact plane is flush with the second contact plane.
6. The liquid cooled plate of any one of claims 1 to 5, wherein the first, second and third liquid cooled tubes are serpentine in shape, and the first, second and third troughs are serpentine in shape.
7. The liquid cooled plate of claim 6, wherein the second channel includes a plurality of second longitudinal portions extending in a first direction and a plurality of second engagement portions spaced apart in a second direction, the second engagement portions being connected to ends of the second longitudinal portions, and each two adjacent second longitudinal portions being connected by one of the second engagement portions to form the second channel in a serpentine shape;
the third tank body comprises a plurality of third longitudinal portions and a plurality of third connecting portions, the third longitudinal portions extend along the first direction, the third longitudinal portions are distributed at intervals along the second direction, the third connecting portions are connected to the ends of the third longitudinal portions, and every two adjacent third longitudinal portions are connected through one third connecting portion, so that the third tank body is in a serpentine shape;
the second and third longitudinal portions are offset from each other along the second direction.
8. The liquid cooled panel of claim 7 wherein the second and third engagement portions are offset from one another along the first direction.
9. The liquid cooled plate of claim 6, wherein the second channel includes a plurality of second longitudinal portions extending in a first direction and a plurality of second engagement portions spaced apart in a second direction, the second engagement portions being connected to ends of the second longitudinal portions, and each two adjacent second longitudinal portions being connected by one of the second engagement portions to form the second channel in a serpentine shape;
the first trough body comprises a plurality of first longitudinal parts and a plurality of first connecting parts, the first longitudinal parts extend along the first direction, the first longitudinal parts are distributed at intervals along the second direction, the first connecting parts are connected to the ends of the first longitudinal parts, and every two adjacent first longitudinal parts are connected through one first connecting part, so that the first trough body is in a serpentine shape;
the first and second longitudinal portions are offset from each other along the second direction.
10. The liquid cooled plate of claim 9, wherein the first and second engagement portions are offset from each other along the first direction.
CN202210490659.4A 2022-05-07 2022-05-07 Liquid cooling plate Pending CN114838542A (en)

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CN202210490659.4A CN114838542A (en) 2022-05-07 2022-05-07 Liquid cooling plate

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202663279U (en) * 2012-04-17 2013-01-09 嘉善华瑞赛晶电气设备科技有限公司 Double-face intensive power module
CN205726818U (en) * 2016-03-29 2016-11-23 深圳市光峰光电技术有限公司 Projector equipment and liquid cooling heat radiation system thereof
CN206506814U (en) * 2016-12-15 2017-09-19 北京中瑞蓝科电动汽车技术有限公司 Electric machine controller cooled plate
CN109275311A (en) * 2018-08-28 2019-01-25 电子科技大学 A kind of three-dimensional micro-channel and Pulsating Flow radiator
CN211671194U (en) * 2020-05-09 2020-10-13 凯福斯通(武汉)精密制造有限公司 Liquid cooling plate
CN211702842U (en) * 2020-04-27 2020-10-16 上海联影医疗科技有限公司 Water-cooling plate
CN213692029U (en) * 2020-11-20 2021-07-13 江苏晶中电子有限公司 Water-cooled thyristor radiator module
CN215647896U (en) * 2020-09-23 2022-01-25 中航光电科技股份有限公司 Liquid cooling plate and flexible cooling plate assembly
CN216122229U (en) * 2021-10-28 2022-03-22 中国第一汽车股份有限公司 Inverter assembly with double-sided water cooling

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202663279U (en) * 2012-04-17 2013-01-09 嘉善华瑞赛晶电气设备科技有限公司 Double-face intensive power module
CN205726818U (en) * 2016-03-29 2016-11-23 深圳市光峰光电技术有限公司 Projector equipment and liquid cooling heat radiation system thereof
CN206506814U (en) * 2016-12-15 2017-09-19 北京中瑞蓝科电动汽车技术有限公司 Electric machine controller cooled plate
CN109275311A (en) * 2018-08-28 2019-01-25 电子科技大学 A kind of three-dimensional micro-channel and Pulsating Flow radiator
CN211702842U (en) * 2020-04-27 2020-10-16 上海联影医疗科技有限公司 Water-cooling plate
CN211671194U (en) * 2020-05-09 2020-10-13 凯福斯通(武汉)精密制造有限公司 Liquid cooling plate
CN215647896U (en) * 2020-09-23 2022-01-25 中航光电科技股份有限公司 Liquid cooling plate and flexible cooling plate assembly
CN213692029U (en) * 2020-11-20 2021-07-13 江苏晶中电子有限公司 Water-cooled thyristor radiator module
CN216122229U (en) * 2021-10-28 2022-03-22 中国第一汽车股份有限公司 Inverter assembly with double-sided water cooling

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