CN217641302U

CN217641302U - Novel IGBT water-cooling bottom plate

Info

Publication number: CN217641302U
Application number: CN202221182397.7U
Authority: CN
Inventors: 郝文煊; 张鹏
Original assignee: Shandong Sli Microelectronics Co ltd
Current assignee: Shandong Sli Microelectronics Co ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-10-21
Anticipated expiration: 2032-05-17

Abstract

The utility model discloses a novel IGBT water-cooling heat dissipation bottom plate, including the water-cooling base, the upper surface of water-cooling base is provided with the protective housing, a plurality of mounting grooves have been seted up to the upper surface of water-cooling base, the inside of mounting groove is provided with the DBC base plate, the surface of DBC base plate is provided with the chip, the both sides of water-cooling base all are provided with the limbers, the limbers is used for connecting water-cooling heat dissipation mechanism; this practicality provides the bottom and carries out radiating structure through the water-cooling base that sets up, not only can avoid the water source to leak the influence to the chip, from the heat dissipation of bottom, can avoid the inside long-pending heat of chip moreover, and the position restriction to the DBC base plate can also be provided in cooperation mounting groove in addition, provides certain fixed effect, compares with current structure, and the radiating effect is stronger, and it is more convenient to use, possesses certain beneficial effect.

Description

Novel IGBT water-cooling bottom plate

Technical Field

The utility model relates to a IGBT heat dissipation field specifically is a novel IGBT water-cooling bottom plate.

Background

In the field of IGBT module packaging, belonging to the microelectronic industry, an IGBT is a device formed by matching an MOSFET and a bipolar transistor, the input electrode of the IGBT is the MOSFET, and the output electrode of the IGBT is a PNP transistor, so that the IGBT integrates the advantages of the two devices, not only has the advantages of small driving power and high switching speed of the MOSFET device, but also has the advantages of reduced saturation voltage and large capacity of the bipolar device, has the frequency characteristic between the MOSFET and the power transistor, can normally work in a frequency range of dozens of KHZ, and is widely applied to modern industrial electronic technologies, such as frequency converters, air conditioners, welding machines, photovoltaics, automobiles and other industries.

The existing IGBT heat dissipation mode comprises wind cooling heat dissipation, liquid cooling heat dissipation and the like, wherein a module conducts heat to a radiator through a heat conducting bottom plate, and the radiator is cooled through a fan so as to achieve the effect of cooling the module; but in powerful IGBT module use, in order to reach better radiating effect, need the increase of radiator area, the power of fan is in order to increase thereupon, not only leads to the cost-push, can make the occupation space of radiator increase moreover for the space that all the other electron devices can occupy reduces, leads to the inconvenient equipment of equipment, consequently needs to design a neotype IGBT water-cooling bottom plate.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel IGBT water-cooling bottom plate to solve the current not enough problem of radiator radiating effect.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a novel IGBT water-cooling bottom plate, includes the water-cooling base, the upper surface of water-cooling base is provided with the protective housing, a plurality of mounting groove has been seted up to the upper surface of water-cooling base, the inside of mounting groove is provided with the DBC base plate, the surface of DBC base plate is provided with the chip, the both sides of water-cooling base all are provided with the limbers, the limbers is used for connecting water-cooling mechanism.

Preferably, a water tank is arranged inside the water-cooling base, the water tank is located below the DBC substrate, and the water through hole is connected with the water tank.

Preferably, adjacent two be provided with a plurality of radiating block between the mounting groove, a plurality of radiating block is vertical evenly distributed, and the interval of two adjacent radiating blocks is opened there is the notch.

Preferably, a cavity is formed in the heat dissipation block, the cavity is arranged above the water tank, and the cavity is communicated with the water tank.

Preferably, the protective shell is made of a silicone gel material.

Preferably, the water-cooling heat dissipation mechanism comprises a heat dissipation fan, a water pump, heat dissipation fins and a circulating water pipe, and the water outlet end and the water inlet end of the circulating water pipe are respectively connected with the two water through holes.

Compared with the prior art, the beneficial effects of the utility model are that:

through the water-cooling base that sets up, a bottom structure that dispels the heat is provided, not only can avoid the water source to leak the influence to the chip, from the heat dissipation of bottom moreover, can avoid the inside accumulated heat of chip, in addition the cooperation mounting groove can also provide the position restriction to the DBC base plate, provides certain fixed effect, compares with current structure, and the radiating effect is stronger, and it is more convenient to use, possesses certain beneficial effect.

Drawings

FIG. 1 is a schematic structural view of the present invention with the protective cover removed;

fig. 2 is a cross-sectional view of the present invention.

In the figure: 10. a water-cooled base; 11. mounting grooves; 12. a water through hole; 13. a heat dissipating block; 14. a DBC substrate; 15. a chip; 16. a protective shell; 17. a water tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a novel IGBT water-cooling bottom plate includes a water-cooling base 10, a protective shell 16 is disposed on an upper surface of the water-cooling base 10, a plurality of mounting grooves 11 are disposed on the upper surface of the water-cooling base 10, a DBC substrate 14 is disposed inside the mounting grooves 11, a chip 15 is disposed on a surface of the DBC substrate 14, water through holes 12 are disposed on both sides of the water-cooling base 10, and the water through holes 12 are used for connecting a water-cooling heat dissipation mechanism;

carry out water-cooling heat dissipation through water-cooling base 10, nevertheless as the base, the heat can be taken away from the bottom to the cooling water of its circulation, has effectively avoided chip 15 in the problem of long-pending heat in inside, possesses stronger radiating effect, because chip 15 sets up in the inside of mounting groove 11, can avoid the water source to leak the influence that causes moreover, guarantees inner structure's safety.

Wherein, the inside of water-cooling base 10 is provided with basin 17, and basin 17 is located the below position of DBC base plate 14, and limbers 12 is connected with basin 17, through the intercommunication of limbers 12 with water-cooling heat dissipation mechanism, forms endless cooling water circulation structure, and the cooling water circulates in the inside of basin 17, and the heat of chip 15 bottom is always taken away in the process to reach radiating effect.

Wherein, be provided with a plurality of radiating block 13 between two adjacent mounting grooves 11, a plurality of radiating block 13 is vertical evenly distributed, and the interval of two adjacent radiating blocks 13 is opened there is the notch, through radiating block 13 for the temperature of each DBC base plate 14 junction overflows the scattered notch, avoids connecting each other too closely, leads to the problem of heat overstock.

Wherein, the cavity has been seted up to the inside of radiating block 13, and the cavity sets up in the top of basin 17, and the cavity all communicates with basin 17, and the inside circulation that radiating block 13 can be followed to the cooling water, transmits the heat on radiating block 13 surface promptly and can be taken away by the cooling water equally, has greatly avoided the problem of the inside amasss heat of chip 15, further strengthens the radiating effect.

The protective shell 16 is made of silicone gel material, and the silicone gel material has excellent water resistance and can provide water-proof protection for the electronic device.

The water-cooling heat dissipation mechanism comprises a heat dissipation fan, a water pump, heat dissipation fins and a circulating water pipe, wherein the water outlet end and the water inlet end of the circulating water pipe are respectively connected with two water through holes 12, the water pump is connected with the circulating water pipe and provides circulating power of a water source, the heat dissipation fins are of a frame structure formed by connecting a plurality of adjacent aluminum sheets, the circulating water pipe penetrates through the middle positions of the heat dissipation fins, the heat dissipation fan blows air from the positions of the heat dissipation fins, the temperature of inflow hot water is transferred to the heat dissipation fins, and heat on the heat dissipation fins is blown away by cold air, so that the heat dissipation effect is achieved.

The working principle is as follows: when using, connect the circulating pipe who corresponds with the limbers 12 at both ends, the cooling water carries out the circulation through the water pump and flows, the heat that chip 15 gived off transmits to the cooling water from the radiating block 13 of basin 17 and the side of its below, the cooling water gets into near of heat radiation fins, blow away the heat through the heat dissipation fan, the circulation is dispelled the heat constantly, the inside heat of chip 15 flows from the bottom, the problem of heat overstock in inside can not appear, holistic radiating effect has been guaranteed, can satisfy the use of powerful IGBT module.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel IGBT water-cooling bottom plate that dispels heat, includes water-cooling base (10), its characterized in that: the upper surface of water-cooling base (10) is provided with protective housing (16), a plurality of mounting groove (11) have been seted up to the upper surface of water-cooling base (10), the inside of mounting groove (11) is provided with DBC base plate (14), the surface of DBC base plate (14) is provided with chip (15), the both sides of water-cooling base (10) all are provided with limbers (12), limbers (12) are used for connecting water-cooling heat dissipation mechanism.

2. The novel IGBT water-cooling heat dissipation bottom plate of claim 1, characterized in that: the water-cooling base (10) is internally provided with a water tank (17), the water tank (17) is positioned below the DBC substrate (14), and the water through holes (12) are connected with the water tank (17).

3. The novel IGBT water-cooling heat dissipation bottom plate of claim 2, characterized in that: adjacent two be provided with a plurality of radiating block (13) between mounting groove (11), a plurality of radiating block (13) are vertical evenly distributed, and the interval of two adjacent radiating block (13) is opened there is the notch.

4. The novel IGBT water-cooling heat dissipation bottom plate of claim 3, characterized in that: the heat dissipation structure is characterized in that a cavity is formed in the heat dissipation block (13), the cavity is arranged above the water tank (17), and the cavity is communicated with the water tank (17).

5. The novel IGBT water-cooling heat dissipation bottom plate of claim 1, characterized in that: the protective shell (16) is made of a silicone gel material.

6. The novel IGBT water-cooling heat dissipation bottom plate of claim 1, characterized in that: the water-cooling heat dissipation mechanism comprises a heat dissipation fan, a water pump, heat dissipation fins and a circulating water pipe, wherein the water outlet end and the water inlet end of the circulating water pipe are respectively connected with two water through holes (12).